Design View all

Synopsys: Galaxy Implementation Platform

Product Description Synopsys’ Galaxy™ Implementation Platform is the industry’s leading solution for IC implementation and signoff. Now available with powerful automation for multi-die implementation and foundry certified design flows, Galaxy provides a silicon-proven path to successful implementation of 3D-IC stacked die and silicon-interposer based 2.5D systems. Testimonial Following collaborations with...

Cielution: CielSpot, CielSpot-CTM, CielMech

Product Description CielSpot, CielSpot-CTM and CielMech are thermal and mechanical simulation Software As A Service (SAAS) products based on Cielution’s innovative Cloud based collaboration platform. Users define 3D IC stacking, process and power distribution details at the Cielution online portal to implement complex, but necessary design methodologies with minimal effort....

SavanSys Solutions: 2.5D & 3D Packaging Cost Model

Product Description The 2.5D & 3D Packaging Cost Model is the first tool available to model the total cost and yield from fabrication of the wafers to complete assembly. The user is able to edit a variety of parameters, including TSV and interposer characteristics and die preparation details, and generate...

Devices View all

3D NAND

3D NAND Flash – Towering Spires or Costly Canyons?

The transition to 3D NAND Flash seems to be imminent with projections of it being half the total NAND Flash market by 2016. That means tens of billions of dollars within 3 years. V-NAND is Samsung’s version. Their first publication describing this architecture was released in 2009 and was called...

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