Sophie Olson is Sr. Manager, Wirebond and Power Package Development at Amkor Technology. She joined Amkor in 2004 and is currently responsible for the development of power packages and semiconductor packaging materials. Before joining the R&D team, she spent two years at Amkor Japan to help expedite the integration of Amkor subsidiaries. She previously held business operations, sales and customer service roles as well. She holds a BA in Materials Science and Engineering from Arizona State University and a master’s degree in Political Science from FSU.