Design View all

DAC 2020 Addresses Chiplet Design and Integration

In the early days of ASIC technology, only logic library elements and basic I/Os with up to 10s of transistors were available for customizing gate arrays and/or logic functions in standard cell chips. And then, “megacells” (a.k.a. Functional Blocks, Semiconductor IP Blocks), comprised of 100s, even 1000s, and more transistors...

An EDA Perspective on Today’s Advanced Packaging

In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of EDA tools to IDMs, fabless IC vendors, and wafer foundries. Some of our EDA marketing people passionately presented their products’ strengths and demonstrated in-depth EDA knowledge. However, speaking fast, with...

Devices View all

How AiP Technology Helps Enable 5G and More

For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
Concept for 3-dimensional stacking of Flash devices. A thin film field effect transistor with a silicon nitride as charge reservoir and a tunnel oxide. A.J. Walker et al., VLSI Symposium, 2003.

The Future of Non-volatile Memory

Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above is a concept for 3D stacking of Flash devices. A thin-film field effect transistor with a silicon nitride as charge reservoir and a tunnel oxide....

Latest Posts - Page 2

Replacing NMP: Are You Ready?

NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an...