Breaking the Compute Barrier with Light: Silicon Photonics, Co-Packaged Optics, and Advanced Packaging
Aug 20, 2026 · By UT Source · 3D In-Depth, Processes and Technology
Design View all
A Legacy of Innovation: Celebrating 50 Years of VIEW Micro Metrology
VIEW Engineering: The Origins of Automated Optical Metrology In the 1970s, rapid advances in manufacturing created a growing need for automated optical measurement. CNC machining dramatically increased production speeds, while Statistical Process Control (SPC) required accurate, repeatable measurement data to maintain quality. At the same time, shrinking component sizes and...
Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design
Combines Siemens’ EDA expertise and software with NVIDIA AI infrastructure and software to improve result quality, time-to-results, tool-calling reliability and token efficiency for long-running engineering workloads Enables agentic AI workflows that help engineers improve productivity and design quality across the electronic design automation (EDA) lifecycle Delivers more predictable, trusted outcomes...
Devices View all
How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding
A patient who can no longer speak generates text directly from neural activity. A patient with paralysis controls a cursor using thought alone. Behind demonstrations like these is a difficult engineering problem: how do you assemble electronics delicate enough to interact with the human brain, while keeping them stable inside...
Navy’s Directed Energy Systems Integration Lab to Train Sailors on Laser Weapons
By Thomas McMahon Naval Surface Warfare Center, Port Hueneme Division, CA Sailors can now get certified in operating and maintaining the fleet’s most prevalent directed energy system through a new training program at Naval Surface Warfare Center, Port Hueneme Division (NSWC PHD)’s Directed Energy Systems Integration Laboratory (DESIL), with the first...
Latest Posts - Page 2
From AI momentum to manufacturing reality
AI is moving past the hype, and the first real pressure is showing up in manufacturing. As demand accelerates across...
The Need for Speed: How Domestic Manufacturing Accelerates Delivery of Mission-Critical Technology
By James S. B. Chew, Vice President and General Manager, Intel Government Technologies The future of US defense capability hinges...
How Semiconductor Transistors Work: The On/Off Switches Powering Our Digital Society
Our digital society operates entirely on combinations of extremely simple information: 0 and 1. These numbers are physically generated by...
SWAP Hub earns DoW Year 2 Award Investment from NSTXL
The Microelectronics Commons NSTXL (National Security Technology Accelerator) has announced the DoW Year 2 awards, with more than $200M invested...
Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging
One of the most important shifts in semiconductor manufacturing today is not just the continued growth of wafer-level packaging (WLP),...
Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough
By Chandra Gupta In my last column, I described the ceramic substrate itself, and why material choice matters so deeply...
Intel Foundry Achieves Breakthrough with World’s Thinnest GaN Chiplet Technology
Han Wui Then is a senior principal engineer at Intel Foundry Technology Research specializing in advanced semiconductor materials and advanced...
Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?
By Tobias Gleichmann In advanced packaging, the real challenge usually doesn’t show up during development. It shows up when processes...
Advanced Optical Metrology for Wire Bond Inspection Using 3D Area Multi-Focus (AMF) Imaging
By Austin Rose, Troy Frappier and Alan Emmans of VIEW Micro Metrology Abstract Wire bonding remains one of the most...
Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging
Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article...
The Next Mode of Transformation: 3D IC Integration
The semiconductor industry finds itself at a critical juncture, where the traditional paradigms of Moore’s Law are encountering fundamental physical...
Is Copper Sintering the Key to Advancing Wide Band Gap Semiconductors?
By Rejoy Surendran and Xinpei Cao, Henkel Adhesive Technologies In the mid- to high-voltage power semiconductor sector, which enables EVs,...
Product-Proven Green Alternative to Solvent and Piranha Wafer Processing using Ozone
The use of ozone in semiconductor wet processing surface preparation has gained new momentum as fabs pursue advanced cleans and...
Novel Failure Analysis Approach Correctly Identifies Rejects
Rejects can occur at various stages of semiconductor processing. The further downstream a reject occurs, the more costly the defect...
Laminography: a Non-destructive 3D X-ray Breakthrough for Advanced Packaging
By Till Dreier & Julius Hållstedt Non-destructive X-ray inspection has become a critical capability across the semiconductor and electronics industry...
CMP Technology for the Next Generation of Substrates
For decades, chemical mechanical planarization (CMP) has been one of the enabling technologies of semiconductor manufacturing. Without ultra-flat and uniform...
Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging
By Abdelhamid El-Sawy, Ph.D., Senior R&D Scientist and Bud Troche, Senior Director of Wafer Level Packaging, MacDermid Alpha Electronics Solutions...
A Comprehensive Approach to 3D IC Physical Verification: Tackling DRC, LVS and Beyond
As the industry pushes toward ever-greater levels of semiconductor performance, integration and efficiency, the promise of 3D integrated circuits (3D...
The Telecom Network Semiconductor Trifecta
Telecommunication networks are undergoing a rapid transformation. With 5G rollouts, edge computing, and a surge in IoT devices, the pressure...