Design View all

Mentor Graphics: Xpedition Package Integrator

Xpedition® Package Integrator provides a holistic co-design methodology that automates planning and optimization of connectivity from a chip through multiple packaging variables, while targeting multiple PCB platforms. Engineers can quickly and easily assemble complete cross-domain systems (IC, package & board) and drive ball map plans and pin optimization through a...

Devices View all

Can 3D Super-NAND Improve Cost-per-Bit for 3D NAND?

The 3D NAND floodgates just opened a little wider with today’s announcement from BeSang that it has developed 3D Super-NAND technology, based on a monolithic 3D IC process, True 3D™ IC, claiming to be the “lowest cost-per-bit in the NAND market.” With all the recent 3D NAND discussion and announcements...

Amkor: SLIM

Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level of integration by use of back-end-of-line technology combined with assembly-based fan-out architectures.  It has optimal registration, 3D access to top and bottom side of package and the finest line RDL capability...

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