Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level...
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at...
As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it,...
As you all may know, in most fan-out wafer level packages (FOWLP) such as embedded wafer level ball grid array...