John Lau

About John

John H. Lau (F’94) was a fellow of Industrial Technology Research Institute, Hsinchu, Taiwan, for five years, a Visiting Professor with the Hong Kong University of Science and Technology, Hong Kong, for one year, the Director of MMC Laboratory, IME Singapore, Singapore, for two years, and a Senior Scientist/MTS with the HPLab/Agilent, Santa Clara, CA, USA, for over 25 years. Since 2014, he has been a Senior Technical advisor of ASM Pacific Technology Ltd., Hong Kong. With more than 39 years of R&D and manufacturing experience in semiconductor packaging, he has authored or coauthored over 470 peer-reviewed papers, 30 issued and pending U.S. patents, and 19 textbooks on flip-chip technologies, fan-in and fan-out wafer-level packaging, ball grid array, through-silicon via for 3-D integration, advanced MEMS packaging, lead-free solder and manufacturing, and reliability of 2-D and 3-D IC interconnections.,Dr. Lau was a recipient of many awards and is an elected ASME Fellow and IMAPS Fellow.