Eric Beyne

Eric Beyne is program director of the advanced packaging and interconnect research at imec. This team performs R&D in the field of high-density interconnection and packaging techniques focused on “system-in-a-package” integration, 3D-interconnections, wafer-level packaging, RF front-end design and technology using integrated passives and RF-MEMS as well as research on packaging reliability including thermal and thermo-mechanical characterization. Eric Beyne obtained his PhD in Applied Sciences in 1990 from the KU Leuven (Belgium). He has been with imec since 1986 and is president of the IMAPS-Benelux committee, member of the IMAPS-Europe Liaison committee, elected member of the board of governors of the IEEE-CPMT society and IEEE-CPMT Strategic Director for Region 8.

Latest Eric's Posts