Eric Beyne, Author at 3D InCites

About Eric Beyne

Eric Beyne is program director of the advanced packaging and interconnect research at imec. This team performs R&D in the field of high-density interconnection and packaging techniques focused on “system-in-a-package” integration, 3D-interconnections, wafer-level packaging, RF front-end design and technology using integrated passives and RF-MEMS as well as research on packaging reliability including thermal and thermo-mechanical characterization. Eric Beyne obtained his PhD in Applied Sciences in 1990 from the KU Leuven (Belgium). He has been with imec since 1986 and is president of the IMAPS-Benelux committee, member of the IMAPS-Europe Liaison committee, elected member of the board of governors of the IEEE-CPMT society and IEEE-CPMT Strategic Director for Region 8.

Here are my most recent posts

Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing

Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing

  2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather skeptically at 3D, but now it is beginning to realize that 3D does not necessarily have to cost more money. Better still, it creates new possibilities and opportunities. 3D on the market In 2017 we saw 3D chip technology start to appear in a range of different commercial ... »

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS imagers you find in your smartphone, the high-bandwidth DRAM memory stacks used in high-end computing, as well as in advanced graphics cards. 3D integration allows a significant reduction of a system’s footprint and enables ever shorter an... »

Developing 3D Systems with Ultrafine and Dense Interconnections

Developing 3D Systems with Ultrafine and Dense Interconnections

For the past 2 to 3 years, 3D integration technology has developed into a technically and economically interesting road for further improving the performance of systems. In comparison to conventional planar 2D systems, we are now able to fabricate shorter and faster connections between circuits. And we can make these connections much denser, allowing a fine-grained partitioning of functions. Thes... »