Design View all

Building Chiplet Systems: Models

There is a general agreement that chiplet systems are the next step in the evolution of designing dense, complicated, and heterogeneously integrated IC systems. On the one hand, disaggregating monolithic ICs into small ICs provides better cost benefits through better yields and the possibility of mixing technology nodes. On the...

Forging a New Future for 3D IC Design and Architecture

The semiconductor industry’s ability to coax more and more performance out of a chip has produced the most significant innovations of our modern era. We are starting to test the limits of how much we can squeeze onto a tiny piece of silicon, according to Sanjay Bali, vice president of...

Devices View all

How AiP Technology Helps Enable 5G and More

For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
Intel@14nm+@Skylake@Kabylake-S(DualCore)@Celeron_G3930@SR35K______DSC02678

System-on-Chip Disintegration is Underway

We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...

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