Building Chiplet Systems: Models
Dec 06, 2022 · By Anemoi Software · 3D In-Depth, Design
Design View all
Building a Dense 3D-IC System: Power Challenges
Recently, there has been a very healthy discussion on whether Moore’s law is still valid. While the arguments fly from both sides, there is one thing that everyone agrees on – chiplets are the solution to the need to constantly increase the functionality of SoC, while also reducing cost. Whether...
Chiplet Designs and Heterogeneous Integration Packaging
System-on-Chip (SoC) integrates ICs (by reducing the feature size) with different functions such as central processing unit (CPU ), graphic processing unit (GPU ), memory, etc. into a single chip for the system or subsystem. Unfortunately, it is more and more difficult and costly to reduce the feature size (to...
Devices View all
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
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