Design View all

Let’s Start the ESD Alliance – 3D InCites Conversation!

This post kicks off what I expect to be a regular series of blogs that will help tie the system design community to manufacturing or, more specifically, your community tackling 3D integration. I accepted Francoise’s invitation to become a 3D InCites blogger because the ESD Alliance, where I serve as...

Devices View all

How AiP Technology Helps Enable 5G and More

For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...

System-on-Chip Disintegration is Underway

We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...

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