Terepac Corporation has begun shipping samples of its ultrathin, flexible, silicon-based products to selected customers from its plant in Waterloo, Ontario, Canada, CEO Ric Asselstine announced. Following four years of development by a tightly integrated R&D team of PhD scientists and industry-seasoned engineers, the company is now entering into pilot scale production of Microscale Circuit Cluster™ products which offer customers all the advantages of a printed structure but with the electrical performance they have come to expect from nanostructured silicon integrated circuits, in a package of unprecedented elegance, compactness, ruggedness and low cost.

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