SUSS MicroTec and IMEC have entered a joint development program to develop permanent bonding, temporary bonding and debonding processes for 3D system integration, including through-silicon-via (TSV) manufacturing.
Francoise von Trapp

They call me the “Queen of 3D” because I have been following the course of…
Related Category Posts
Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing
Feb 12, 2018
2017 saw a clear breakthrough for 3D chip technology...
Combining Technology Platforms and Integrating Complex Materials for New Applications
Jan 18, 2016
Heterogeneous integration is in many ways different from other research...
Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration
Apr 17, 2015
Multi-project wafer (MPW) programs have long been considered an economical...
Related Tag Posts
SEMICON Korea 2025 Member Preview: Lead the Edge
Feb 06, 2025
In its continued focus on AI and smart devices, SEMI’s...
US-JOINT Consortium: Strengthening Advanced Packaging Innovation Across Borders
Feb 05, 2025
As global semiconductor demand continues to surge, international collaboration has...
Announcing the Winners of the 2025 3D InCites Awards
Feb 04, 2025
As advanced interconnect and advanced packaging processes take the helm...