SUSS MicroTec and IMEC have entered a joint development program to develop permanent bonding, temporary bonding and debonding processes for 3D system integration, including through-silicon-via (TSV) manufacturing.
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SUSS MicroTec and IMEC have entered a joint development program to develop permanent bonding, temporary bonding and debonding processes for 3D system integration, including through-silicon-via (TSV) manufacturing.