Bill Martin, Author at 3D InCites - Page 2 of 2

Path Finding Series Part 3: The Cost of Non-robust Design

Path Finding Series Part 3: The Cost of Non-robust Design

In previous posts, I discussed a process for process-centering a design. In this post, we will examine how non-robust design’s erratic yields can impact the manufacturing environment and cost of a product. A non-robust design will have at least one specification that is skewed away from the specification’s center as shown in Figure 1. But what happens if your design is NOT robust? Does the pro... »

Path Finding Series Part 2: What if I do not have a robust design?

Path Finding Series Part 2: What if I do not have a robust design?

In previous posts, I discussed Robust Design analysis as orthogonal Path Finding. This analysis is performed while the design implementation is held constant but with varying manufacturing process parameters. This will determine how sensitive a design is within the process(es) it will be manufactured. The previous post highlighted the negative consequences if a design is released to manufacturing ... »

Path Finding Series Part 1: NOT a One-trick Pony

Path Finding Series Part 1: NOT a One-trick Pony

In previous posts, I discussed a classical Path Finding methodology.¹ Classical is when various design variables are arranged in different configurations while holding Process Variables (variation) constant. Examples would be: vary the RDL pitches, vary the size of balls or pillars used, vary the length/diameter of wire bonds, etc. This allows Path Finding to identify the solutions that meet requ... »

Can Product Design learn a Trick from Manufacturing?

Can Product Design learn a Trick from Manufacturing?

You might think this is crazy but bear with me for 421 words. Early in my career, I worked at an IDM as a product engineer and manager over IC products. ‘We’ were responsible for the overall product cost, maintaining yields (including speed binning) as well as improving yields. This was long before the SoC/ASIC disaggregation. This IDM was vertically integrated and had its own mask production,... »

3D By Design: Exploring Viable Path Finding

3D By Design: Exploring Viable Path Finding

Fruitful path finding eventually identifies solutions that are viable for mechanical, electrical, thermal, and cost (METC) requirements. Hopefully, more than one viable solution is found to offer a backup in case something was overlooked during exploration or your supply chain can no longer support your needs. Even if you need to re-explore due to changing situations, path finding is still faster... »

3D By Design: Are Path Finding Tools the Missing Link?

3D By Design: Are Path Finding Tools the Missing Link?

TechSearch International’s recently published 3D IC Gap Analysis report has a section for a new class of tools called Path Finding, which are separated from the classical EDA tools. The classical EDA tools discuss implementation and verification for IC, package, and PCB. Path Finding tools are used well before the Implementation/Verification cycles begin and should help reduce the number of cyc... »

A Path Finding Based SI Design Methodology for 3D Integration

A Path Finding Based SI Design Methodology for 3D Integration

3D integration is being touted as the next semiconductor revolution by industry. 3D integration involves the use of various interconnects that include balls, pillars, bond wires, through silicon vias (TSV) and redistribution layers (RDL) for enabling chip stacking, interposer and printed circuit board (PCB) based technologies. More recently 2.5D integration using silicon interposers has gained mom... »

Path Finding: Who Performs and When?

Path Finding: Who Performs and When?

Microelectronic products all have mechanical, thermal and electrical properties that degrade until the device is permanently damaged. Path finding adds value to an end-product by pre-determining where the breaking points are, and if or how they can be enlarged. For decades, product designers have used various methods of path finding to determine optimum solutions for the design and manufacture of ... »

2.5/3D Packaging: Path Finding

2.5/3D Packaging: Path Finding

2.5D/3D packaging technologies are revitalizing creativity in high technology products. We thought we knew what faster, better, lighter and smaller meant. 2.5D/3D packaging can revolutionize what we thought possible but it will require augmenting our current methods and tools. One key methodology to add would be Path Finding. Path Finding can ensure a design’s structural integrity early in the... »

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