Intel and TSMC Could Lose Billions in Chip Factory Funding – Tom’s Hardware
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Delayed German budget may have a drastic effect on German subsidies for new Intel’s and TSMC’s fabs in the country.
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Keynote Conversations From SEMICON Europa 2023 On Shaping a Sustainable $1Trillion Era
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This episode was recorded live from Munich, as the official podcast of SEMICON Europa. The theme of this year’s event is Shaping a Sustainable $1 Trillion Era. Françoise von Trapp talks with some of the keynote speakers about the roles their companies play in achieving this goal. talking with some of the Keynote speakers about […]
Semiconductors Headed Toward Strong 2024 – SemiWiki.com
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The global semiconductor market is now solidly in a turnaround. WSTS revised its data for 2Q 2023 growth over 1Q 2023 to 6.0% from 4.2% previously. 3Q 2023 was up 6.3% from 2Q 2023. With our Semiconductor Intelligence forecast of 3% growth in 4Q 2023, the year-to-year growth in 4Q 2023 will be a positive […]
AT&S’ Markus Leitgeb and Tony Gueli Talk About Meeting Today’s IC Substrate Challenges
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In this episode, Françoise von Trapp talks with AT&S’s Markus Leitgeb and Tony Gueli, about the complex world of IC substrates for advanced microelectronics. The conversation focuses on technical and commercial challenges, and how they can be overcome when you work with the right substrate partners. You’ll learn about the driving applications for advanced IC […]
CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program – Semiconductor Digest
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Today, the Biden-Harris Administration announced its vision to boost U.S. capabilities for advanced packaging, a key technology for manufacturing state-of-the-art semiconductors. CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program was posted by Shannon Davis on Semiconductor Digest.
What Can Go Wrong In Heterogeneous Integration – SemiEngineering
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Workflows and tool integration are disconnected, mechanical stress is ill-defined, and co-planarity is nearly impossible. But there are solutions on the horizon. The post What Can Go Wrong In Heterogeneous Integration appeared first on Semiconductor Engineering.
Imec Grants Public Access to Virtual Fab for Quantifying Environmental Impact of IC Manufacturing – Semiconductor Digest
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Beyond the ICT industry, imec aims to guide academics and policy makers with actionable data. Imec Grants Public Access to Virtual Fab for Quantifying Environmental Impact of IC Manufacturing was posted by Shannon Davis on Semiconductor Digest.
US Govt Says Banned Chipmaking Equipment Still Ends Up in China – Tom
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Chinese companies go above and beyond to get wafer fab tools from American companies.
Total Overlay With Multiple RDL Layers – SemiEngineering
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Unexpected problems that can develop across the whole RDL stack. The post Total Overlay With Multiple RDL Layers appeared first on Semiconductor Engineering.
System in Package (SiP) Technology Market Worth $22.01B by 2027 – Semiconductor Digest
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The global system in package (SiP) technology market is growing at a CAGR of 8.4% from 2020 to 2027. System in Package (SiP) Technology Market Worth $22.01B by 2027 was posted by Shannon Davis on Semiconductor Digest.
Industry Strategy Symposium 2024 to Highlight Chip Innovation and Business Opportunities on Path to $1 Trillion – Semiconductor Digest
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SEMI announced today that Industry Strategy Symposium (ISS) 2024 will be held January 7-10 at the Ritz-Carlton in Half Moon Bay, Calif. with the theme Ready, Set and Ramp? Industry Strategy Symposium 2024 to Highlight Chip Innovation and Business Opportunities on Path to $1 Trillion was posted by Shannon Davis on Semiconductor Digest.
3D Heterogenous Integration: Design And Verification Challenges – SemiEngineering
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The emerging interconnect architecture of signal nets and power delivery networks call for an innovative EDA tools with ultra-large data capacity and scalable compute technology. The post 3D Heterogenous Integration: Design And Verification Challenges appeared first on Semiconductor Engineering.
UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI – Semiconductor Digest
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United Microelectronics Corporation, a global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products. UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI was posted by Shannon Davis on […]
Data Leakage In Heterogeneous Systems – SemiEngineering
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What’s needed to secure data across multiple chiplets and interoperable systems. The post Data Leakage In Heterogeneous Systems appeared first on Semiconductor Engineering.
Wired for Success: Women in Electronics – EE Times
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Diversity leads to more successful businesses. Men and women can capitalize on each other’s abilities by learning about differences and viewing them as strengths. The post Wired for Success: Women in Electronics appeared first on EE Times.
Member Spotlight: Conversations from IMAPS 2023
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This Member Spotlight episode was recorded live at the IMAPS International Symposium. Françoise von Trapp speaks with community members who attended and exhibited about what they were showcasing, and what they learned. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of […]
Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration – SemiWiki
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One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More The post Ensuring 3D IC Semiconductor Reliability: […]
Making Connections In 3D Heterogeneous Integration – SemiEngineering
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Advanced packaging adds a huge number of options, but taking advantage of them isn’t easy. The post Making Connections In 3D Heterogeneous Integration appeared first on Semiconductor Engineering.
Ensuring The Health And Reliability Of Multi-Die Systems – SemiEngineering
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Thorough testing from die to system and silicon lifecycle management help complex designs work as intended. The post Ensuring The Health And Reliability Of Multi-Die Systems appeared first on Semiconductor Engineering.
IMAPS Leaders Talk About DEI Past, Present and Future
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In this panel discussion, recorded live at the International Microelectronics and Packaging Society International Symposium, Françoise hands over the mike to Dan Krueger, Honeywell, as he moderates a panel on Diversity in Packaging, Past, Present, and Future. Don’t miss this lively town hall discussion on many important topics in today’s challenging work environment, including the […]
