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Send us a text Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore’s Law slows, requiring closer integration between chip and package design to maximize performance. • Traditional chip design treated packaging as an afterthought with designers “throwing designs over the wall” • Economic realities of advanced nodes mean companies now pay […]
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Chipmakers TSMC, Intel and Micron publicly replied to a U.S. Department of Commerce inquiry on the national-security impact of tariffs. The post Chip Industry Warns U.S. Tariffs, Bans Could Halt Growth appeared first on EE Times.
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Shift-left pattern-based methods help automotive IC teams verify earlier, speed time-to-market, improve quality, and boost product reliability. The post Get More Reliable Automotive ICs with a Shift Left Design Approach appeared first on EE Times.
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Send us a text Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they’re improving semiconductor manufacturing quality. • X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality • Traditional 2D radiographic imaging is being replaced by 3D […]
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Learn how major manufacturers are implementing chiplet solutions to optimize performance and cost. The post Advanced IC Packaging: The Roadmap to 3D IC Semiconductor Scaling appeared first on EE Times.
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Washington, D.C.’s ban on AI chip exports is having the opposite effect, pushing China to further develop its homegrown AI chip tech.
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Send us a text The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco’s Moscone Center from June 15-20, has become increasingly […]
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Trump revokes AI Diffusion rule, aiming to simplify policy. Nvidia applauds move. The post Trump Administration Revokes Controversial AI Diffusion Rule appeared first on EE Times.
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Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.
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Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More The post Intel’s Foundry Transformation: Technology, Culture, […]
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GaN outshines silicon in RF tech with superior power, thermal performance and efficiency. The post Why RF Technologies Should Consider GaN Over Silicon appeared first on EE Times.
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President Donald Trump has initially excluded semiconductors from his latest round of U.S. tariffs. However, he could put tariffs on semiconductors in the future. If tariffs are placed on semiconductors imported to the U.S., how would that affect U.S.-based semiconductor companies? The chart below shows U.S. semiconductor… Read More The post Semiconductor Tariff Impact appeared […]
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Intel is reportedly planning to cut over 20,000 jobs as part of new CEO Lip-Bu Tan’s push to streamline management, reduce costs, and refocus the company amid ongoing business struggles.
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Send us a text Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials. When ultrasound encounters even the tiniest […]
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Nvidia, AMD begin chip production at TSMC Arizona amid looming U.S. tariffs. The post Nvidia, AMD Ramp at TSMC Arizona as U.S. Tariffs Loom appeared first on EE Times.
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The economics are not yet clear for industrial or consumer electronics. The post Can Chiplets Serve Cost-Conscious Apps? appeared first on Semiconductor Engineering.
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Send us a text The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year’s award winners in heterogeneous integration and chiplet technology. • SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates • Eric Gongora, […]
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Co-packaged optics and silicon photonics reach an inflection point at this year’s OFC 2025. The post Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025 appeared first on EE Times.
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Trump tariffs, now 54% on Chinese goods, threaten to raise electronics prices. Complex supply chains face disruption, despite some exemptions. The post Trump Tariffs Unleash Shift in Global Economy appeared first on EE Times.
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In response to Trump’s tariffs, China retaliates, including levies and barring American companies and restricting export of minerals. The post China Retaliates Against Trump Tariffs appeared first on EE Times.
