3D Incites News - Page 3
Brewer Science Named 2025 National Top Workplace in Manufacturing Industry
Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries,...
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
LQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, announced that it has completed the...
Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
Investors include Onto Innovation, Lam Capital, UMC Capital, and MediaTek Capital Multibeam Corp. announced that it has raised $31 million...
SEMI and Arizona State University Partner to Deliver Cutting-Edge Semiconductor Engineering and AI Education
New Online Classes Available through SEMI University Expand Accessibility of ASU’s Academic Excellence SEMI, the industry association serving the global...
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
All Geographic Regions Reported Growth, with Americas, EMEA, and Japan Recording Double Digit Increases Electronic System Design (ESD) industry revenue...
SEMI and India Semiconductor Mission (ISM) Announce the Opening of Visitor Registrations for SEMICON® India 2025 – Building the Next Semiconductor Powerhouse
Event to Showcase Global Semiconductor Trends and India’s Local Ecosystem Development Visitor registration for SEMICON India 2025, scheduled to be...
Kuehne+Nagel and Natilus Partner to Bring Blended-wing-body Aircraft to Commercial Air Freight
Kuehne+Nagel, one of the world’s leading logistics providers, and Natilus, an aerospace manufacturer of blended-wing-body aircraft, today announced a strategic...
Kuehne+Nagel Appoints Shirley Sharma Paterson as Global Head of Sales
Kuehne+Nagel announced the appointment of Shirley Sharma Paterson as Global Head of Sales, effective August 1, 2025. She will report...
SEMICON Taiwan 2025 to Spearhead Opportunities for Global Semiconductor Collaboration and Innovation
SEMI today announced its 30th annual SEMICON Taiwan event – the premier conference and exhibition for the global semiconductor industry....
SEMI and TechSearch International Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database
Expanded Coverage and Enhanced Data Structure Provide Heightened Clarity in a Dynamic Market SEMI and TechSearch International announced the release...
Revealing the Invisible: Optimized nano-CT Case Studies in Advanced Packaging
By Till Dreier and Julius Hållstedt, Excillum Complex architectures with intricate interconnects, stacked dies, and buried features – the recent...
SEMI Acquires Linx Consulting’s Market Reports and Conferences to Boost Industry Insights
Deal Amplifies SEMI’s Market Intelligence Capabilities in Semiconductor Materials and Specialty Chemicals SEMI, the global industry association representing the electronics manufacturing...
Ensuring Precision Calls For Certified Quality Logistics for the Semiconductor Industry
Editor’s note: This article originally appeared on Digitimes. In a world where semiconductors are the foundation of modern technology, powering...
NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials in College Park, Maryland
Woychik’s address will highlight the critical role of advanced packaging technologies in the evolution of the U.S. OSAT industry to...
Phoenix to Host SEMICON West 2025 for the First Time, Showcasing Arizona’s Critical Role as a Semiconductor Manufacturing Hub
Event registration now open, with expanded programming and support from key Arizona partners SEMI, the industry association serving the global...
The Next Frontier—AI for Semiconductor Test
By Ming Zhang, Ph.D., Vice President of Fabless Solutions While AI has made significant inroads in semiconductor design and manufacturing,...
Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%...
SurplusGLOBAL to Launch Beta of Semiconductor Equipment and Parts Platform ‘SemiMarket’
Grand Opening Planned for December SurplusGLOBAL, a leading provider specializing in legacy semiconductor equipment and parts, has fired the starting...
