Investors include Onto Innovation, Lam Capital, UMC Capital, and MediaTek Capital
Multibeam Corp. announced that it has raised $31 million in Series B funds from global investors led by Onto Innovation Inc., a leader in process control solutions for advanced nodes and advanced packaging, and Lam Capital, the venture capital arm of Lam Research Corp., a global provider of wafer fabrication equipment and services for the semiconductor industry. Participants also include UMC Capital, the venture capital arm of UMC Corp., and MediaTek Capital, the venture capital arm of MediaTek Inc. Several leading financial and corporate investors also contributed to the oversubscribed round, alongside existing investors.
Onto Innovation CEO, Michael Plisinski: “For the last decade, advances in packaging have ushered in new eras for semiconductors. First, the adoption of copper pillar and fan-out packaging helped power the mobile era and now chiplet architectures are powering the AI era. Future innovation lies in advanced packaging solutions. For packaging with interconnects below 1µm, we see enormous potential for Multibeam’s direct-write lithography technology to enable denser interconnects between chips cost-effectively. Multibeam has taken a novel lithography technology from concept to mass production to address the growing need for advanced integration of chips on large substrates. As such, we are very pleased to lead this Series B investment round.”
Audrey Charles, Senior Vice President of Corporate Strategy and Advanced Packaging, Lam Research; President, Lam Capital: “Heterogenous chip-to-chip integration is essential for delivering the lower power, higher performance semiconductors needed to meet the rapidly escalating demands of AI compute. Multibeam, with its disruptive, innovative miniaturized design, has developed an e-beam lithography system that has the potential to deliver unparalleled patterning flexibility for emerging chiplet applications at the wafer scale and beyond.”
UMC Capital President, Kris Peng: “Multibeam has developed a highly flexible lithography tool capable of patterning fine features across full wafers. This new type of direct-wafer writing system with high resolution, large depth of focus, and wafer-scale field of view, opens the aperture on the type of chips that can be made.”
MediaTek Capital Partner, Brian Hsu: “Multibeam’s system enables rapid time to prototype and time to market. These new capabilities enable agile development of a wide variety of novel and diverse applications.”
