New platform builds on Sikama’s proven UP1200 technology with support for 310 × 310 mm panels, <10 ppm O₂, ultra-low vibration and ±2°C temperature uniformity, with larger panel formats in development
Sikama International, Inc., a leading provider of advanced thermal processing equipment for semiconductor and microelectronics manufacturing, today announced the development of a next-generation reflow platform designed for emerging advanced semiconductor and panel-level packaging applications.
Scheduled for launch in 2027, the platform builds on Sikama’s proven reflow equipment, available today with support for 310 × 310 mm panels, and will expand capabilities to larger formats. The new platform is being engineered to accommodate a broad range of substrate materials, including glass, organic, silicon and ceramic substrates, including applications in Fan-Out Panel-Level Packaging (FOPLP) and other emerging advanced packaging processes.
As semiconductor packaging transitions toward larger square and rectangular panels, technologies such as Chip-on-Panel-on-Substrate (CoPoS), FOPLP, glass core substrates and Through-Glass Via (TGV) architectures are creating new thermal processing requirements.
“As customers move toward larger panels and increasingly complex packaging processes, reflow requirements are evolving,” said Jeff Blair, Vice President of Commercial Operations at Sikama International. “We’re developing this platform around the temperature control, atmosphere, vibration and thermal efficiency requirements our customers identify as critical for next-generation panel-level packaging.”
Performance Designed for Advanced Panel-Level Packaging
Sikama’s next-generation platform is being developed around several key performance targets:
· ±2°C temperature uniformity across a panel substrate
· Process atmosphere control below 10 ppm O₂
· 10x lower vibration compared with conventional competitive reflow solutions
· 50% reduction in power consumption compared with competitive models
· Precise heating, cooling and thermal profile control
· High thermal-mass processing capability
· Flexible handling of glass, organic, silicon, ceramic and other advanced substrates
· High throughput while maintaining Sikama’s space and energy-efficient approach to thermal processing
These capabilities address critical challenges in thermal uniformity, warpage control, mechanical stability and process consistency as customers move to panel-based substrates.
From Wafers to Large-Format Panels
The industry’s panel-level packaging roadmap extends beyond today’s 310 × 310 mm format, with larger panels, including approximately 510 × 515 mm and 600 × 600 mm, being explored and standardized across the semiconductor ecosystem.
Sikama is developing its platform to support this evolution, incorporating thermal, atmosphere, transport and handling technologies designed to accommodate increasingly large and demanding substrates. Rather than simply scaling an existing oven, the new architecture is being developed specifically around emerging panel-level processing requirements.
Built Around Customer Requirements
The platform is being developed in direct response to customer needs and evolving semiconductor packaging roadmaps, with Sikama working closely with customers to understand emerging substrate materials, dimensions and manufacturing challenges while developing a platform flexible enough to evolve alongside their technology roadmaps.
“Advanced packaging is evolving quickly, and equipment must evolve with it,” Blair said. “Our approach is to understand each customer’s process rather than expect them to adapt to our equipment. That engineering partnership, combined with exceptional equipment performance and Sikama’s industry-leading customer support, is what we believe will differentiate this platform.”
Commercial introduction is planned for 2027, with additional specifications, supported panel sizes and the product name to be announced as development progresses.
About Sikama International
Sikama International designs and manufactures precision thermal processing equipment for semiconductor and microelectronics manufacturing. With over 40 years of experience in reflow and advanced thermal processing, Sikama provides solutions emphasizing efficiency, atmosphere management, process flexibility and customer-specific applications. For more information, visit www.sikama.com, email sales@sikama.com, or call +1-805-962-1000.
