3D In Context View all

Covid-19: The Way Forward for Semiconductor Success

In 2002, the first consulting client for my newly founded eda2asic consulting company was Synplicity, located in Sunnyvale. They focused on software for FPGA design and were a clear leader in this rapidly growing field. For about three years I really enjoyed contributing to their success, primarily for three reasons: ...

Handel Jones: The Road to Recovery from Covid-19

Covid-19 has created unprecedented problems for health and economies worldwide. Executives must make now important and often very difficult decisions that significantly impact the future of their companies and the lives of their workforces. The Global Semiconductor Alliance (GSA) started a webinar series to provide essential information to its members...

Francoise in 3D View all

Social Distancing Spotlight: A DBI Ultra Update

Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer DBI. Excited to celebrate this momentous occasion with them, I even wore the Xperi logo for the photo. Here we are a year later, and although I won’t have the...

Social Distancing Spotlight: NAMICS

Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites Community has already grown to 29 members. I visited with a few of them in person at IMAPS DPC to learn more about them, get updates on their activities in...
Fritzchens Fritz from Berlin / CC0

The Golden Age of Packaging Brought to you by Chiplet Integration

When people weren’t talking about the coronavirus at this year’s 2020 IMAPS Device Packaging Conference and its co-located Global Business Council, they were talking excitedly about the arrival of the golden age of packaging, heterogeneous integration, and most specifically, chiplet integration. Keynote speakers (Doug Yu, TSMC; Christian Hoffman, Qualcomm Germany;...

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