Blogs Archives - Page 3 of 77

3D In Context View all

SEMI’s Sustainability Startup Summit Round Three

Aug 20, 2024 · By Dean Freeman · 3D In Context

If you watched the Summer Olympics in Paris, one of the challenges the Athletes faced was the temperature. With a few days above 90°F, precautions were taken for the fans and the athletes to avoid overheating. Paris was not the exception as temperature records seem to be announced nearly daily...

SEMI Market Symposium: A Trillion Dollars is in sight

SEMI Market Symposium: A Trillion Dollars is Still in Sight

Aug 12, 2024 · By Dean Freeman · 3D In Context

Semicon West in July coincides with many analysts’ mid-year forecasts. The SEMI Market Symposium has long been a show staple, kicking off the week and sometimes setting the temperature for the show, and the industry for the remainder of the year. This year, analysts maintain that we are still on...

Sustainability and Semiconductors at SEMICON WEST 2024

Jul 22, 2024 · By Dean Freeman · 3D In Context

SEMI has increasingly focused on sustainability and semiconductors in the past three years, growing from a few keynote talks at SEMICON West 2021 to three full days packed with sustainability topics at SEMICON West 2024. You could have nicknamed this show SEMI Sustainability West. The semiconductor manufacturing industry is at...

AI and VLSI

Jul 16, 2024 · By Dean Freeman · 3D In Context

What do oxide transistors, ferroelectrics, 2-dimensional channel layers, CFETS, Advanced packaging, AI, and tradewinds have in common? They were all topics at the IEEE VLSI Conference in June. The VLSI conference is held every June alternating between Hawaii, and Kyoto. In 2024 there were three and a half days of...

Francoise in 3D View all

Witnessing Foundry 2.0 in Action

Aug 13, 2024 · By Francoise von Trapp · Blogs

One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member companies. There’s nothing like talking to the experts face-to-face and walking through a cleanroom or advanced packaging applications lab to drive home a concept. For the past year, I’ve been...

SEMICON West 2024: Riding the Generative AI Winds of Change

Jul 15, 2024 · By Francoise von Trapp · Blogs

Deepak Chopra said, “All great changes are preceded by chaos.” Here’s my Aha! moment from SEMICON West 2024: After great chaos precipitated by the pandemic, geopolitical tensions, the climate crisis, and the talent shortage, one singular driver is driving unprecedented change: Generative AI. Generative AI was referenced in almost every...

ECTC 2024: Advanced Packaging Engineers to the Rescue!

Jun 01, 2024 · By Francoise von Trapp · Blogs

If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then you must be feeling very important right now; especially if you’re an advanced packaging engineer. Whether you’re improving energy efficiency, increasing yield, delivering innovative process control solutions, designing next-generation advanced...

The Nexus of Innovation for U.S. Semiconductor Manufacturing

May 07, 2024 · By Francoise von Trapp · Blogs

Will Arizona be the nexus of innovation for U.S. semiconductor manufacturing? It certainly looks that way. The speakers and panelists who presented at SEMI’s Arizona Breakfast Forum on May 1, confirmed what those of us who live and work here already know: The sun isn’t the only thing heating up...

From Different Dimensions View all

Sustainability 101: Critical Minerals and Collaboration

Aug 14, 2024 · By Julia Freer Goldstein · Blogs

We need governments, companies, and communities worldwide to cooperate if we want to build a more circular and more equitable economy. This applies to all industries, including semiconductors and 3D integration. Mineral supplies are a crucial issue for our industry. Metals are needed for all aspects of semiconductor manufacturing and...

Arizona Semiconductor Industry: A Powerhouse in the Making

Aug 05, 2024 · By Shannon Blood · Blogs

A Rising Force in Semiconductor Manufacturing In the sun-soaked deserts of Arizona, a major shift is unfolding, one that not only has the potential to reshape the global semiconductor landscape but also underscores the state’s pivotal role in powering the future of technology worldwide. With its strategic location, supportive business...

July Member News: Progress in Sustainability, Industry Expansion, and Technology Innovation

Jul 31, 2024 · By Avery Gerber · Blogs

July is always an exciting month for the semiconductor industry thanks to SEMICON West. July Member News reflects the significant progress our members made in sustainability, industry expansion, technology innovation, workforce development, and more. Achievements include but are not limited to advancements in emissions reduction targets and new technologies enhancing...

3D InCites Members Share SEMICON West 20 Under 30 Experiences

Jul 29, 2024 · By Jillian Carapella · Blogs

This year at SEMICON West in San Francisco, I had the opportunity to attend SEMI’s 20 Under 30 award ceremony on July 10 at the Moscone Center. As the name suggests, this award recognizes and celebrates young semiconductor industry professionals who display excellence in leadership, collaboration, and innovation. First of...

Interconnectology 101 View all

Interconnectology 101: Before Switching to PVD, Consider Liquid Metal Ink

Jul 23, 2024 · By Jillian Carapella · Blogs

You may have heard of the company, Averatek. Founded in 2009 out of the Stanford Research Institute, it developed and licensed chemistries and advanced interconnect technologies for electronics. Although the company specialized in printed circuit boards (PCBs), Averatek’s new leadership saw an opportunity to apply its technology to advanced packaging....

An Overview of the Global Semiconductor Secondary Equipment and Parts Market

Jul 01, 2024 · By Jillian Carapella · Blogs

Even though it seems like everything has a computer chip these days, the semiconductor industry was not immune to the destruction of COVID-19. As millions of people geared up to work from home, a global chip shortage emerged. Rapid fluctuations in the automotive market exacerbated this. Because so many people...

Understanding the Role of Inspection and Metrology for AI Packages

Jun 18, 2024 · By Jillian Carapella · Blogs

At this point, we can’t deny it – we’re truly living in the age of AI. But in today’s changing world where ChatGPT generates information faster than ever imagined, one thing is certain: today’s technology-driven society would not be feasible without advanced packaging. To help me write this article, I...

Why Are HBM Manufacturers Choosing Liquid Mold Underfill?

Jun 06, 2024 · By Jillian Carapella · Blogs

As the world demands faster and smarter technologies than ever before, the importance of underfill is gaining traction in the realm of advanced packaging. Underfill is an epoxy that helps fill gaps between a chip and its substrate. It’s important because it works to relieve stress on the chip, thus...

Packaging IFTLE View all

IFTLE 603: Amkor’s Slice of the CHIPS Pie for its HVM OSAT; Samsung Texas Update

Aug 27, 2024 · By Phil Garrou · Blogs

HVM OSAT In Peoria, AZ Commerce Secretary Gina M. Raimondo has identified advanced packaging as a major area of focus for the US government’s effort to rebuild American semiconductor manufacturing. The Commerce Department emphasized that developing robust advanced packaging manufacturing capacity and capability is a key priority and essential to...

An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)

IFTLE 602: Dr. Dev Palmer in at NAPMP; A New Player in Glass Core Substrates

Aug 21, 2024 · By Phil Garrou · Blogs

Dr. Dev Palmer Takes over the Reins CHIPS NAPMP The Department of Commerce has announced that Dr. Dev Palmer has joined CHIPS for America’s Research and Development (R&D) Office as the director of the National Advanced Packaging Manufacturing Program (NAPMP). Dr. Palmer joins CHIPS for America from DARPA where he most recently...

IFTLE 601: Glass Substrates for CPUs; Silicon Interposers; and 300mm Wafer Production in the U.S.

Aug 07, 2024 · By Phil Garrou · Blogs

AMD to Adopt Glass Substrates for CPUs Business Korea reports that AMD intends to adopt glass substrates for its ultra-high-performance SiPs between 2025 and 2026. AMD reportedly will use glass substrates for its data center products aimed at artificial intelligence (AI) and high-performance computing (HPC) workloads. Performance requirements for AI...

IFTLE 600: A Notice of Intent from the CHIPS NAPMP

Jul 24, 2024 · By Phil Garrou · Blogs

The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States (U.S.) leadership in advanced packaging and provide the technology and skilled workforce needed for packaging manufacturing in the U.S. NAPMP-funded activities and CHIPS manufacturing incentives seek to establish a self-sustaining,...