Blogs Archives - Page 3 of 57

3D In Context View all

Achieving Carbon Neutral Computing

Jun 23, 2021 · By Dean Freeman · 3D In Context

According to the Wall Street Journal, (WSJ) the Security and Exchange Commission (SEC) is proposing that public companies be required to disclose more information on what they are doing to combat climate change and the threats linked to climate change. According to the SEC, approximately 90% of companies in the...

As Semiconductor Spending Explodes,This Sure Feels Like a Super Cycle!

Jun 14, 2021 · By Dean Freeman · 3D In Context

What a time to be in the semiconductor industry! If you’re a chip manufacturer you’re currently being blamed for the woes of the supply chain and shortages, because you failed to anticipate demand. Fortunately, billions of dollars are emerging to help increase capacity. Money is coming from all quarters and...

More Thoughts And Lessons Learned During My Career in Semiconductors

Jun 07, 2021 · By Herb Reiter · 3D In Context

In the Spring 2020 issue of the MEPTEC Report, Herb Reiter briefly emerged from his recent retirement to pen an article and interview based on lessons learned during his 50-year-long career in semiconductors. Turns out he had a lot to say. So with Ira Feldman and Bette Cooper’s blessing, we’re...

PART 2: Lessons 7-13 Learned from Fifty Years in the Semiconductor Industry – A Memoir

Jun 01, 2021 · By Herb Reiter · 3D In Context

In the Spring 2020 issue of the MEPTEC Report, Herb Reiter briefly emerged from his recent retirement to pen an article and interview based on lessons learned from fifty years in the semiconductor industry. Turns out he had a lot to say. So with Ira Feldman and Bette Cooper’s blessing,...

Francoise in 3D View all

Anyone Else Excited about a Hiatus from SEMICON West in July?

Jul 01, 2021 · By Francoise von Trapp · Blogs

People often tell me that I say out loud what everyone else is thinking. So there it is. It’s July 1, 2021, and I have to admit I’m feeling a little off. Probably because this time of year we are usually in the throes of SEMICON West preparations. Even last...

ECTC 2021: Economic Outlook Focuses on the Impact of the Pandemic

Jun 08, 2021 · By Francoise von Trapp · Blogs

For the first time in its 71-year history, the ECTC committee veered away from strictly technical topics to include a panel discussion on market trends and the economic outlook. Moderated by SemiEngineering’s Ed Sperling, much like a relay race, the session was structured to start with the big picture story,...

Introducing the 3D InCites Podcast

Jun 03, 2021 · By Francoise von Trapp · Blogs

Over the past month, you may have noticed a new addition to the 3D InCites platform. The 3D InCites Podcast made its debut on May 5, 2020, with a conversation with Kiterocket’s Joe Cestari, about how to successfully market a semiconductor business. The second episode featured 3D InCites bloggers, Julia...

The Role DEI Plays in Achieving a Sustainable Future

Apr 29, 2021 · By Francoise von Trapp · Blogs

I was recently invited by IMAPS UK to give a keynote at their annual conference, MicroTech 2021. The topic was Heterogeneous Integration (HI). I agreed, provided I was allowed to give the topic a new twist. I provided the following abstract, and the committee eagerly agreed to my proposal: A...

From Different Dimensions View all

The ESD Alliance: A Forum to Address Cross-Industry Issues

Jun 22, 2021 · By Bob Smith · Blogs

Members of the ESD Alliance are vital to the semiconductor industry, providing comprehensive solutions for the planning, design, and verification of complex SoCs. Their EDA, semiconductor IP, embedded software offerings, services, and solutions for 3D IC design and advanced packaging are found in most chip companies. They, in turn, rely...

Sustainability 101: Sustainability Reporting Standards and Trends

Jun 16, 2021 · By Julia Goldstein · Blogs

You have probably heard that what gets measured is what matters. That is the idea behind sustainability reporting. Companies that issue reports make a public statement about their past actions and future goals around environmental, social, and governance (ESG) issues. Sustainability reporting is no substitute for action, but it can...

3D InCites Launches WeChat Platform

Jun 10, 2021 · By Ina Chu · From Different Dimensions

Audiences in China have no access to social media apps like Facebook, Twitter, YouTube, and Instagram, but they’ve completely embraced the WeChat platform. Launched in 2011 by Tencent, WeChat has grown from a messaging app to a unique social media hybrid. It forms the basis of the daily digital life...

Trends in Semiconductor Manufacturing: Wafer-Level Packaging

May 18, 2021 · By Jim Straus · Blogs

One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global WLP market size is expected to reach $7.8 billion by 2022, registering a compound annual growth rate (CAGR) of 21.5% from 2016 to 2022. Broadly defined, WLP encompasses different integration...

Packaging IFTLE View all

IFTLE 491: IBM Simplifies Si Bridge Technology

Jul 12, 2021 · By Phil Garrou · Blogs

Continuing our coverage of ECTC 2021, let’s take a look at the session on Heterogeneous Integration (HI) using 2.XD/3D packaging, chaired by Subash Shinde of Notre Dame and John Knickerbocker of IBM. IBM Introduces Direct Bonded HI Si Bridge Technology Though they are not manufacturing chips or packages anymore, IBM...

IFTLE 490: TSMC considers Packaging Facility in the US; EMIB Technology Advances

Jun 30, 2021 · By Phil Garrou · Blogs

TSMC considers Packaging Facility in the US The Taipei Times is reporting (via Nikkei Japan) that TSMC is considering building an advanced IC packaging facility in the US. The potential US packaging plant would be equipped with the latest 3D stacking technologies. IC packaging is highly localized in Asia and...

IFTLE 489: AMAT Addresses Hybrid Bonding; DECA M-Series Continues to Develop

Jun 24, 2021 · By Phil Garrou · Blogs

Let’s take a final look at some of the presentations from the 2021 IMAPS Device Packaging workshop. Applied Materials Applied Materials (AMAT) discussed “Through Silicon Vias (TSVs) and Hybrid Bonding Solutions for Heterogeneous Integration…”. AMAT notes that hybrid bonding is not a new technology but rather has been commercialized for...

IFTLE 488: Nepes Readies Commercialization of mPoP Technology

Jun 15, 2021 · By Phil Garrou · Blogs

This week we’re looking at some packaging presentations from the 2021 IMAPS Device Packaging Workshop. The focus is on Nepes mPoP and Sumotomo Bakelite EMC. Nepes – Fan Out mPoP BC Kim described Nepes M-series fan-out package mPoP. mPoP is a stackable package-on-package structure used to provide an integrated solution...

SemiSisters View all

2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors

Mar 25, 2021 · By Trine Pierik · SemiSisters

We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance of Diversity, Equity, and Inclusion in creating sustainability. Proceeds from the project will be used to seed the 3D InCites DEI Fund to support technology businesses owned by women and...

How is COVID 19 Impacting the Semiconductor Industry’s Diversity and Inclusion Efforts?

Aug 20, 2020 · By Francoise von Trapp · Blogs

A headline on CNN Business caught my eye last night: Working mothers are quitting to take care of their kids, and the US job market may never be the same. I started reading and went down a rabbit hole of related articles that revealed a few things: Unlike the recession...

SemiSister Success Story: A Woman on the Edge of 3D Technology

May 01, 2020 · By Francoise von Trapp · Blogs

Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first person to show me what a TSV wafer looked like when I visited CEA-Leti’s cleanroom in 2009 during my Tour de France in 3D. At the time, she was a...

Diversity, Parity, Prosperity: Perspective of an Industry Veteran

Apr 02, 2020 · By Paul Werbaneth · Blogs

“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1 in 5 Students Is a Woman.” The New York Times, 08 December 2019 “The semiconductor industry isn’t known as a standout example of diversity and inclusion. But that’s changing.” Jane...

Blogs

IFTLE 492: Will Intel Acquire GlobalFoundries? Intel/IBM R&D Partnership

Semiconductor Summer Conference Highlights: Hardware is Back Baby!

Sustainability 101: Circular Economy, Part I –What is Zero Waste?

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