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Semiconductor Sustainability From the Venture Capital Perspective

Oct 13, 2021 · By Dean Freeman · 3D In Context

The sustainability wave in the tech space is gaining momentum. Alphabet, Amazon, Apple, Facebook, and Microsoft have all set very aggressive sustainability targets (Figure 1). Most of these companies are shooting for net-zero emissions by 2030, or at least have Scope 1 and 2 emissions at zero at that time....

The 3D Era is Upon Us

Oct 05, 2021 · By Dean Freeman · 3D In Context

Building integrated circuits (ICs) in the third dimension has been taking place since trench capacitors were introduced for DRAM in the 1980s. The trend continued with the introduction of the damascene process and copper, which quickly grew the back end of the line metallization from 2-3 layers into today’s interconnect...

A Look at Semiconductor Equipment Supplier Sustainability Efforts

Sep 14, 2021 · By Dean Freeman · 3D In Context

Most semiconductor equipment companies have been focused on sustainability programs longer than most other industries. In part, some of the focus is probably due to customers, such as Intel and ST Microelectronics, that have had sustainability or environmental programs of some sort since 1993. In 2019, at the last face-to-face...

Golden Era or Short-Term Cycle?

Sep 01, 2021 · By Dean Freeman · 3D In Context

Day 2 of SEMI’s Innovation for a Transforming World featured the outlook on semiconductor market growth over the next 2-3 years. The pandemic to a certain extent has turned the semiconductor and the supporting markets on their head so to speak. After a strong 2018, 2019 saw slower growth. As...

Francoise in 3D View all

Panel Level Packaging Consortium 2.0 Gains Ground

Oct 12, 2021 · By Francoise von Trapp · Blogs

Sometimes, in the face of adversity, great things can be accomplished. In this case, the adversity was the COVID-19 crisis, and the great things accomplished were the goals of the Panel Level Packaging Consortium 2.0. In a recent article published by Fraunhofer IZM, Dr. Tanya Braun, group leader of the...

Understanding the Nuances of Chiplet Design

Sep 29, 2021 · By Francoise von Trapp · Blogs

Chiplets are the new “It” heterogeneous integration technology. In fact, the big news in Taiwan this week is that Apple is entertaining the idea of using TSMC’s 3D interconnect fabric – which is based on the company’s approach to chiplet integration. According to Taiwan News, other companies considering the technology...

How Europe Should Navigate Its Semiconductor Supply Chain Challenges

Sep 09, 2021 · By Francoise von Trapp · Blogs

Over the last 18 months, the European semiconductor industry has felt the repercussions of supply chain interruptions due COVID 19 and trade wars, combined with exploding global demand for chips driven by the digital transformation. There are also questions about regional sovereignty and the need to strengthen the local supply...

How Can We Tap into $52 Billion to Reshore Advanced Packaging?

Aug 23, 2021 · By Francoise von Trapp · Blogs

One of the things that are missing from virtual events is the candid conversations we engage in when we meet up with industry colleagues in the halls and cocktail receptions at in-person events. In a way, that’s the tone we’re trying to capture in the conversations we have on the...

From Different Dimensions View all

Why An Internship in Fan-out Technology Was My Dream Come True

Oct 04, 2021 · By Bhaumi Panchal · Blogs

I joined ERS electronic GmbH for an internship in fan-out technology from October 2020 to June 2021 as a mandatory part of my Master’s degree in Mobile and Embedded Systems at the University of Passau. My internship at ERS gave me great exposure to the inner workings of the semiconductor...

Sustainability 101: Chemicals of Concern – Beyond RoHS

Sep 20, 2021 · By Julia Goldstein · Blogs

Semiconductor manufacturing involves many “chemicals of concern,” or compounds that are hazardous to human health and the environment. The hazardous compounds fall into several categories: Solvents—etchants, cleaners, and similar substances that are rinsed off the wafer Process chemicals—solids, liquids, or gases that undergo chemical reactions to form either sacrificial or...

You’ve Been Through an M&A – Maybe It’s Time to Rebrand?

Sep 07, 2021 · By Andrew DePoy · Blogs

Much consolidation has happened in the semiconductor industry over the last decade or so. And it’s not over yet if recent news is anything to go by. By consolidation, I’m referring to specific mergers and acquisitions (M&As) between companies making similar products, materials, or devices. It’s happened in the materials...

Total Cost of Ownership Success Begins (or Ends) with Your Equipment

Aug 26, 2021 · By Nordson ASYMTEK · From Different Dimensions

Lower cost. Everyone wants it. There are many ways to reach it. On the surface, a low initial purchase price seems like the obvious solution. But is that really the best way to control cost? Savvy buyers look at the total cost of ownership to maximize their return on investment....

Packaging IFTLE View all

IFTLE 499: SEMI Heterogeneous Integration Summit Part 1

Oct 07, 2021 · By Phil Garrou · Blogs

The SEMI Connecting Heterogeneous Systems Summit (Sept 1-3, 2021) highlighted the latest in heterogeneous integration and sensing technology advances. Let’s take a look at some of those presentations starting with ASE. ASE At the SEMI Summit Mark Gerber, Sr Dir of Engineering and Technical Marketing described five key semiconductor growth drivers....

IFTLE 498: Sapphire Rapids – Intel Chiplet Architecture Begins

Sep 30, 2021 · By Phil Garrou · Blogs

X-FAB – First Foundry to Offer Micro Transfer Printing Before we take a look at Intel’s Sapphire Rapids, a quick update on micro-transfer printing (MTP) [ see IFTLE 484, “Massively Parallel Pick & Place from the X-Men”] X-FAB, the analog/mixed-signal and specialty semiconductor foundry, has announced it has made substantial...

IFTLE 497: Ajinomoto Expands Materials Offerings; BESI readies for Chiplet Era

Sep 22, 2021 · By Phil Garrou · Blogs

Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel dielectric materials for fine RDL in 5G applications. IFTLE has discussed ABF films in previous blogs [ see IFTLE 479 “ABF substrate shortages…”]. High-speed transmission and large body size require...

IFTLE 496: Intel discusses US Mega-FAB; Google To Build Own ARM-based Processor Chips

Sep 15, 2021 · By Phil Garrou · Blogs

Intel Mega-Fab coming to the US Intel’s Gelsinger was recently interviewed by the Washington Post. Here are some of the key points that came up in the interview: Gelsinger: “if we were sitting here in 1990, the U.S. would be building 37 percent of the world’s semiconductors. Europe would be...

SemiSisters View all

Smartphone Addiction is Not a Gender-Specific Problem

Jul 26, 2021 · By Francoise von Trapp · Blogs

An open letter to David Benjamin, EE Times Dear David, You really don’t get it. Why? Why, when more women are joining the microelectronics industry in technical and non-technical roles, would you resort to female stereotypes from the 1950s as a vehicle to discuss such an important topic as global...

2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors

Mar 25, 2021 · By Trine Pierik · SemiSisters

We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance of Diversity, Equity, and Inclusion in creating sustainability. Proceeds from the project will be used to seed the 3D InCites DEI Fund to support technology businesses owned by women and...

How is COVID 19 Impacting the Semiconductor Industry’s Diversity and Inclusion Efforts?

Aug 20, 2020 · By Francoise von Trapp · Blogs

A headline on CNN Business caught my eye last night: Working mothers are quitting to take care of their kids, and the US job market may never be the same. I started reading and went down a rabbit hole of related articles that revealed a few things: Unlike the recession...

SemiSister Success Story: A Woman on the Edge of 3D Technology

May 01, 2020 · By Francoise von Trapp · Blogs

Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first person to show me what a TSV wafer looked like when I visited CEA-Leti’s cleanroom in 2009 during my Tour de France in 3D. At the time, she was a...

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IFTLE 500: We’ve Come a Long Way, Baby!

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