VLSI 2020: 3D Continues to Dominate Advanced Semiconductor Technology
Jul 06, 2020 · By Dean Freeman · Blogs, From Different Dimensions
3D In Context View all
Geopolitics and Manufacturing: A Changing Landscape
At the March 11 MEPTEC Luncheon at SEMI, Paul Pickering, Managing Director at Microtech Ventures, braved, together with a rather small audience, the ongoing Coronavirus threat. Because our semiconductor supply chain relies on many countries that are currently suffering under this virus, there is no better time to address this...
FLEX/MSTC 2020: Change has Never Been So Fast…
SEMI, together with FlexTech, the MEMS & Sensors Industry Group, the Nano-Bio Materials Consortium (NBMC) and NextFlex, held FLEX/MSTC 2020 at the DoubleTree in San Jose from February 24 to 27. Executives from above industry organizations and their member companies presented current capabilities of flexible hybrid electronics (FHE), MEMS and...
Is The HIR the Best Path to Increased Revenues?
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry to achieve $ 1 Trillion in revenues. SEMI hosted the event at its headquarters in Milpitas. Almost 200 IC design and manufacturing experts joined, to celebrate the release of the 2019...
Has Google Discovered the Advantages of Advanced IC Packaging Technologies?
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti S. Chauhan, Technical Program Manager for Data Center Quality, presented her perspectives on the benefits and challenges of advanced IC packaging technologies. Considering that Alphabet, Google’s parent company, controls about...
Francoise in 3D View all
Coronavirus Gives Rubbing Elbows a New Meaning at IMAPS DPC 2020
As the domino effect of electronics industry event cancellations continued in response to the global threat of a potential Coronavirus pandemic, one industry association, the International Microelectronics, and Packaging Society is committed to carrying on this year’s event agenda, at least in the United States. The IMAPS International Device Packaging...
Heterogeneous Integration Technology Gets its Own Competence Center
The team at EV Group has done it again. They looked around at where the microelectronics industry is headed, identified a gap and set out to fill it. This time, the gap fell in between research and development (R&D) and the ramp to manufacturing for customer products built using heterogeneous...
And the Winners of the 2020 3D InCites Awards Are…
The 2020 3D InCites Awards program has been a bit of a nail biter for us all, as we waited for the judges’ votes to see how they aligned with the online votes. Remember: the online votes serve as one judge. So, it was possible to win the online vote...
Ensuring Device Reliability in Automotive Electronics
More than 90% of all traffic deaths are caused by human error.1 I’m sure you’ve all heard this statistic repeatedly over the past few years. After all, this 2016 finding by the US National Highway Traffic Safety Administration (NHTSA) is fueling the semiconductor industry’s mission to develop the automotive electronics...
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IFTLE 449: Advanced Packaging and Chiplets at the IMAPS DPC
ECTC Meeting Goes Virtual For those that have not seen the announcement, the Electronics Component Technology Conference (ECTC) held annually...
Temporary Wafer Bonding System Is Based On Electrostatics, Not Adhesives
Temporary wafer bonding is widely employed in semiconductor device fabrication and in semiconductor device packaging applications, particularly now that changes...
Chiplets: The New Era Begins
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important....
Chiplets Promise to put Moore’s Law Back on Track
Moore’s Law may not be dead, but at 55 years old, it’s certainly feeling its age, with the pace of...
Commerce Department Tightens the Screws on the US Semiconductor Industry
On April 28, the commerce department issued the following news release that could deeply impact the US semiconductor industry: “The...
SemiSister Success Story: A Woman on the Edge of 3D Technology
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first...
Covid-19: The Way Forward for Semiconductor Success
In 2002, the first consulting client for my newly founded eda2asic consulting company was Synplicity, located in Sunnyvale. They focused...
IFTLE 448: Impact of Package Pitch on PCB Fabrication
While the focus of IFTLE remains on the latest advances in advanced chip packaging, we have mentioned before that we...
Six Ways to Repurpose Your Tradeshow Investment
Like all global industries, the tech industry is being challenged in unprecedented ways as the outbreak of the novel coronavirus...