ISS 2020: How to Win in Our Data-driven World
Jan 23, 2020 · By Herb Reiter · 3D Event Coverage, 3D In Context, 3D In-Depth, Blogs
3D In Context View all
Highlights from EDPS 2019
The Electronic Design Process Symposium – EDPS 2919 – is known in the IC design community as a rather small (50 – 100 participants), but a highly interactive workshop. The 26th edition, hosted again this year by SEMI at its Milpitas headquarters, October 3 -4, 2109 featured both EDPS IC design...
Strategic Materials Conference Focuses on Complex Challenges
Materials have a major impact on reliability, performance, cost and other key parameters of electronic solutions. SEMI’s recent Strategic Materials Conference (SMC 2019) brought materials suppliers and their customers together to discuss progress made in these areas. They also addressed how to solve the increasingly divergent and complex challenges current...
Reaping the Benefits of a Design and Manufacturing Ecosystem
As it does each year, TSMC recently brought 45 of its ecosystem partners together for its annual Open Innovation Platform® Forum to demonstrate to joint customers the value of a well-managed IC design and manufacturing ecosystem. TSMC and many of the partners presented recent accomplishments and explained in 33 technical...
A Look at US Investments in Heterogeneous Integration
The semiconductor industry is not only very capital-intensive, but investors experience very long payback times. Both limit the availability of private funding. If you are jealously looking at China and the billions of dollars they invest in semiconductors, I recommend you make a closer study of US investments in heterogeneous...
Francoise in 3D View all
What Role does the US-China Trade War Play in the Semiconductor Downturn?
The US-China trade war is top of mind for those who work in the semiconductor industry. How much of the current downturn is it responsible for? What impact will it have on the industry? It’s no surprise that it was a big topic of discussion recently during SEMICON West. Opinions...
Talking about Technology Megatrends at SEMICON West 2019
What a difference a year makes. First the aesthetic: after two years of maneuvering around a construction zone at SEMICON West, the Moscone Center renovation is complete and looks fabulous. It’s also so much easier to navigate between halls, and to and from the keynote stage at the newly christened...
A Look at imec’s Two-Step Wafer-level Mold Process
The recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its two-step wafer-level transfer mold process for 3D die-to-wafer assembly. The individual who nominated them for the award didn’t provide any more detail than that. But luckily at ECTC 2019, when...
SiP Technology To Enable Technology Megatrends
Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS...
Latest Posts - Page 3
MSEC 2019: MEMS and Sensors Have a Lot to offer for System Designers
San Diego’s Coronado Island Marriott Resort and Spa hosted SEMI’s MEMS and Sensors Executive Congress (MSEC 2019) from Oct 23...
Weathering the Storm and Positioning the Semiconductor Industry for Growth
2019 has been a sobering year for the semiconductor industry. It started out with such high hopes, coming off of...
The World Series 2019: The Technology of Baseball
I’m a huge baseball fan. And while my favorite team, the Arizona Diamondbacks didn’t even make it into the playoffs,...
IFTLE 429: Samsung 12-layer memory with 3D-TSV; SHIP Winners
Samsung Electronics has announced the development of 12-layer memory using 3D through silicon via (3D-TSV) chip packaging technology. TSVs vertically...
Are You Keeping The World Clean for Your Children and Grandchildren?
Adjusting or repairing some of the sprinkler heads on my lot is a regular Spring duty for me. This year,...
IFTLE 428: Panel Level Processing: We’ve Come A Long Way Baby!
It was in 1992 when Ted Tessier and I, in our paper, “Overview of MCM Technologies: MCM-D”, at the IMAPS...
How 5G is Enabling a Connected World
It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on...
IFTLE 427: TSMC’s Next-Gen 3D Technology – N3XT
Continuing our look out into the future, at the recent Hot Chips Conference, Dr. Phil Wong, VP of R&D at TSMC...
Moore’s Law Rises from the Dead Again Driven by 3D Transistor Technology
At Semicon West in July there was a great deal of discussion that Moore’s Law was dead and would likely...