IFTLE 444: Chip on Interposer on Substrate vs High Density Chips-Last Package Cost Modeling
Mar 26, 2020 · By Phil Garrou · Blogs, Packaging IFTLE
3D In Context View all
MEPTEC’s Annual IC Packaging Industry Update
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President of TechSearch International deliver her annual “State of the IC Packaging Industry” address titled, “Market Drivers for Advanced Packaging: 2020 and Beyond.” In her opening statement, Vardaman emphasized that our...
GSA Awards Dinner celebrates 25 years of Recognizing the Best of the Semiconductor Industry
A few thousand semiconductor experts, including many high-level executives, got together on December 5, 2019, celebrate the Global Semiconductor Alliance’s (GSA) 25th Anniversary at the annual GSA Awards Dinner, which took place at the Santa Clara Convention Center. The purpose of the evening was to acknowledge and celebrate the semiconductor...
Talking about Neural Networks and SoC Design Challenges
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addressed today’s hot topics —neural networks and System-on-Chip (SoC) design challenges — with short, but very informative presentations. Can...
Microtech Ventures brings a New MEMS and Sensors Summit to Town
From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation Summit at the DoubleTree Hotel in San Jose. I have to admit, until recently I didn’t follow MEMS and sensors (M&S) and didn’t notice the broad and rapid market acceptance...
Francoise in 3D View all
Products on Parade in the Exhibits at IWLPC 2019
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to support technology trends, and to spread the word about our new community membership opportunities on 3D InCites. But I’ll get to that part in a...
The IWLPC Fan-out PLP Smack Down
At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP (FO PLP)...
Weathering the Storm and Positioning the Semiconductor Industry for Growth
2019 has been a sobering year for the semiconductor industry. It started out with such high hopes, coming off of a banner year in 2018, during which we hit some significant milestones. Now we find ourselves in the midst of the worst downturn since 2008, minus the global financial crisis,...
How 5G is Enabling a Connected World
It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on the success of 5G. 5G will make smart factories more efficient; bring medical care to remote places; make the autonomous vehicle infrastructure possible so you stop rear-ending the person in...
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ISS 2020: How to Win in Our Data-driven World
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at...
IFTLE 438: Reliability Test For 0.3mm WLCSP; Copper RDL Trace Requirements
This week we continue our look presentations from SEMICON Europa’s Advanced Packaging Conference. Intel’s Reliability Test Beth Keser’s group at...
Successful Growth in 2020 Calls for a Sustainable Approach
On the whole, 2019 was a very interesting year for the global semiconductor industry. After a record-setting 2018, the market...
Novel Multi-die Integration Concept Offers Big Benefits
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of...
IFTLE 437: Packaging Trends for Artificial Intelligence
As it has in recent years, SEMICON Europa 2019 featured a dedicated Advanced Packaging Conference. In this and my next...
Raise A Glass to The New 3D InCites Community!
Happy New Year and welcome to the new 3D InCites community platform! We marked 2019 by celebrating our tenth anniversary,...
2020 Outlook: Optimism Ahead! The Opportunities are There
I am writing this viewpoint while 2019 will close in a couple of days. If I try to summarize what...
IFTLE 436: Fluxless µBumping; Latest on Stacking Technologies
The November Issue of Chip Scale Review contains some interesting advanced packaging information that is worthy of sharing in IFTLE:...
IFTLE 435: The Heterogeneous Integration Roadmap (HIR)
Before we start this week’s blog, let me take the opportunity to wish all IFTLE readers a Merry Christmas and...