Blogs Archives - Page 3 of 67

3D In Context View all

SEMI ISS 2023: Finding a Sustainable Path to a $1Trillion

Jan 16, 2023 · By Dean Freeman · 3D In Context

Two interesting pieces of climate news emerged in the second week of January 2023. The first was a report in the Wall Street Journal about the cost of damage due to climate incidences. The U.S. National Oceanic and Atmospheric Administration said this week that weather-related disasters caused $165 billion of...

Will 3D Packaging Extend Moore’s Law?

Jan 04, 2023 · By Dean Freeman · 3D In Context

There is a bit of debate about the role that heterogeneous packaging plays in furthering Moore’s Law. Moore’s Law has historically focused on the number of transistors doubling per unit area. In discussions at IEDM, it appears that the definition is being modified to include the chip stacking that is...

Is Energy Reduction the Key to a Successful Sustainability Program?

Dec 14, 2022 · By Dean Freeman · 3D In Context

Running a successful sustainability program is a significant challenge facing CEOs. In some instances, the simple solution is to go out and build a renewable power source or purchase power that is created from renewables in a power purchase agreement. Unfortunately, not all companies have the resources to build a...

Moore’s Law, Alive or Dead? We’re Learning More at IEDM 2022

Dec 07, 2022 · By Dean Freeman · 3D Event Coverage

Over the past 10ish years, there has been a great deal of debate about the longevity of Moore’s Law. The reshoring of semiconductor manufacturing to the United States has put Moore’s Law back on center stage. There are a group of folks. including Jensen Huang CEO of Nvidia, who recently...

Francoise in 3D View all

Are You Listening? The Top 3D InCites Podcast Episodes of 2022

Dec 29, 2022 · By Francoise von Trapp · Blogs

I got the notification while I was visiting with my family in Vermont over Christmas: Congratulations from Buzzsprout for 7500 podcast downloads! I was very excited because, in the podcast world, that’s a significant achievement. Did you know that there are over 2.4 million podcasts with over 66 million episodes...

Making Connections at SEMICON Europa 2022

Nov 22, 2022 · By Francoise von Trapp · Blogs

What a week! From keynotes, panel discussions, and podcast interviews, to booth parties and after-hours networking – the week at SEMICON Europa was all about making connections. For us, that meant hosting our first-ever 3D InCites member social event on Monday, November 14 at the iconic Augustiner Keller. Guests from...

Book Review: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

Nov 17, 2022 · By Francoise von Trapp · Blogs

I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser, IMAPS president, presented me with a signed copy of the book she co-edited with Steffen Khröhnert – Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces:...

The Power of Community at the IMAPS International Symposium

Oct 10, 2022 · By Francoise von Trapp · Blogs

One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the spirit of community this organization has cultivated over the years. It’s one of the reasons there is so much synergy between IMAPS and 3D InCites, and why we have become...

From Different Dimensions View all

The European Chips Act: A Once in a Lifetime Opportunity

Jan 18, 2023 · By Paul Lindner · Blogs

Semiconductors truly are the engines that power the world. Yet despite the increasingly prominent role that they play in enabling our everyday lives, until recently semiconductors have flown under the radar for the public. This changed with the arrival of the COVID pandemic, which forced a paradigm shift in how...

Learning about Plasma Technology Hands-on Through an Internship at Trymax

Jan 13, 2023 · By Francoise von Trapp · Blogs

Hello, I am Mandy Perdok. I am 20 years old and live in Milsbeek in the Netherlands. My hobbies include playing Netball (Team Sport), training/coaching the Netball youth team, and traveling. As a third-year student majoring in Chemical Engineering at the Fontys Hogeschool Eindhoven of Applied Science, I am completing...

Example of a modern-day 3D HI advanced package

Advanced Packaging Authority John Park Discusses 3DHI and the World of Chiplets

Jan 10, 2023 · By Bob Smith · Blogs

John Park, product management group director, of Custom IC & PCB Group at Cadence, is a go-to authority on advanced packaging, as I learned as he and I talked about the world of 3D ICs or 3D Heterogeneous Integration (3DHI). His extensive background in packaging, not chips, was fortified early...

Community Member Monthly Highlights – December

Dec 28, 2022 · By Trine Pierik · From Different Dimensions

Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for the New Year. Siemens Digital Industries Software announced that its Sokol™ Flex OS software now supports RISC-V embedded development with the availability of one of the industry’s first commercially supported,...

Packaging IFTLE View all

IFTLE 546: AMAT buys into Absolics; Samsung’s AP Team; Update on the CHIPS program under NIST

Jan 17, 2023 · By Phil Garrou · Blogs

Last year (IFTLE 512) we discussed the SKC formation of the US subsidiary Absolics, and its glass core substrate manufacturing capabilities. In recent news, Applied Materials recently announced that it will acquire $39 million worth of Absolics shares. Absolics is issuing new shares to raise capital to expand its glass...

IFTLE 545: Chiplet Definition and Standardization

Jan 12, 2023 · By Phil Garrou · Blogs

I wanted this blog to cover the recent whitepaper by Siemens’ EDA division on chiplet model standardization, and it will, but first I need to go over some introductory material on chiplets, and specifically, chiplet definition. Let me explain why. As part of the work that I do with the...

IFTLE 544: IPC Advanced Packaging Symposium Part 3: Intel, IBM and AMD

Jan 02, 2023 · By Phil Garrou · Blogs

This week we continue our look at the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, held in Washington, DC in October. Being the IPC, we could — and should — expect a focus on high-density laminates (HDL) and high-density build-up substrates (HDBU); but they also brought...

IIFTLE 542: What We Need to Know about the US IC Substrate Infrastructure

Dec 15, 2022 · By Phil Garrou · Blogs

The IPC Advanced Packaging Symposium: “Building the IC Substrate and Package Assembly Ecosystem” was held in Washington, DC in October. Being the IPC, we could and should expect the focus to be on high-density laminates (HDI) and high-density build-up substrates (HDBU). Based on the 2021 IPC report “North American Advanced...

SemiSisters View all

Is Diversity and Inclusion the Secret to Your Company’s Success?

Feb 10, 2022 · By Hemant Taneja · Blogs

Until recently, many companies considered diversity a “nice to have.” Companies supported diversity and inclusion because they wanted to be good citizens because it was the right thing to do, and – for some, cynically – because it was good PR. But now research is proving the business case for...

Smartphone Addiction is Not a Gender-Specific Problem

Jul 26, 2021 · By Francoise von Trapp · Blogs

An open letter to David Benjamin, EE Times Dear David, You really don’t get it. Why? Why, when more women are joining the microelectronics industry in technical and non-technical roles, would you resort to female stereotypes from the 1950s as a vehicle to discuss such an important topic as global...

2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors

Mar 25, 2021 · By Trine Pierik · SemiSisters

We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance of Diversity, Equity, and Inclusion in creating sustainability. Proceeds from the project will be used to seed the 3D InCites DEI Fund to support technology businesses owned by women and...

How is COVID 19 Impacting the Semiconductor Industry’s Diversity and Inclusion Efforts?

Aug 20, 2020 · By Francoise von Trapp · Blogs

A headline on CNN Business caught my eye last night: Working mothers are quitting to take care of their kids, and the US job market may never be the same. I started reading and went down a rabbit hole of related articles that revealed a few things: Unlike the recession...

Blogs

Reaching the One Trillion Mark by 2030: Watch Out for the Headwinds!

Sustainability 101: What Good Are Awards?

Community Member Preview: Chiplet Summit

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