Hesse GmbH wins OWL Innovation Award 2025/26 in the “Market Visions” Category
Jun 12, 2026 · By Hesse Mechatronics, Inc · Press Releases
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MacDermid Alpha’s Ravi Bhatkal Elected Vice Chairman of INEMI Board of Directors
MacDermid Alpha Electronics Solutions, a business of Element Solutions Inc, is pleased to announce that Dr. Ravi Bhatkal, Vice President...
ACM Research Ships First PECVD SiCN System for Advanced Semiconductor Applications
ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications,...
Indium Corporation Joins India’s IDSPS Industry Consortium Partnership
Indium Corporation® today announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting...
Siemens collaborates with TSMC to advance AI for Semiconductor Design
Siemens collaborates with TSMC to advance AI-powered automation across the semiconductor design workflow, including AI automated Design Rule Check (DRC)...
Applied Materials Announces Advantest as Innovation Partner for EPIC Platform in Silicon Valley
Companies will co-innovate to bridge the gap between front-end manufacturing and back-end testing of semiconductors and advanced packaging Advantest to...
Amkor Advances Arizona’s Semiconductor Future
Innovating the future of semiconductor packaging, creating local opportunities and strengthening our community! West-MEC on the opened the nation’s first...
CG Semi included in newly approved Semiconductor SEZs
Central government has notified a special economic zone (SEZ) proposed by Tata Semiconductor Manufacturing at Dholera in the western state...
PacTech Launches Scalable Modular Wet-Bench System for Advanced Semiconductor Packaging
Nauen, Germany – April 14, 2026 – PacTech – Packaging Technologies GmbH, a global provider of advanced packaging equipment and plating...
Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology
Siemens and NVIDIA have achieved a major verification breakthrough, capturing trillions of pre‑silicon design cycles in days using Siemens’ Veloce...
Indium Corporation Announces Strategic Agreement for Domestic Critical Metals Recovery
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, announced that it has executed...
Mechanical Stress in Semiconductor Development
3D NAND subarray structures tilt during slit processing, demonstrating stress evolution, including deformation.
BESI at the center of the Packaging Power Shift
Why the takeover interest in BESI reflects a broader transformation in semiconductor equipment Step by step, this industry is coalescing...
The Silicon Desert
The Silicon Desert Map showcases Arizona technology companies that comprise Semiconductor, Hardware, Software, Emerging Technologies, IT, IoT, AI, Manufacturing, Research and Development, as well...
Finetech Secures Eurostars Funding to Advance Sub-micron Integration of Dual-color MicroLED Microdisplays
An 18-month Eurostars-3 R&D project will address one of the key bottlenecks in next-generation display manufacturing: the sub-micron integration of...
Arm expands compute platform to silicon products in historic company first
News highlights Arm extends its platform breadth to include production silicon products for the first time, offering the broadest choice...
Indium Corporation Indium12.9HF Receives New Product Introduction Award
CLINTON, N.Y., March 23, 2026 — Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a...
Metalor Technologies Completes Acquisition of Gannon & Scott
Metalor Technologies announced today that, following approval by the relevant regulatory authorities, it has completed the previously announced acquisition of...
Path to Commercialization: LPKF Develops Glass Components for Quantum Computers in Funded QVLS-iLabs Future Cluster
LPKF develops glass components for ion traps, vacuum chambers and quantum sensors in three projects / Laser micromachining of glass...
Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley
March 10, 2026– Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth...