Press Releases

The SMTAI Conference to Feature a Presentation by NHanced Semiconductors VP Charles Woychik on Hybrid Bonding in Chiplet Architectures

Woychik’s presentation will highlight the role of hybrid bonding in supporting die-to-wafer and wafer-to-wafer in delivering high-density, low-latency interconnection technology...

SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years

Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported in its latest 300mm...

Kuehne+Nagel Strengthens Global Air Logistics Network with New Bengaluru Gateway

Kuehne+Nagel has launched a new air logistics gateway in Bengaluru, India, underscoring its commitment to adapt quickly to shifting market...

SEMICON Europa 2025 to Highlight Innovations in Advanced Packaging, Fab Management, and MEMS and Imaging Sensors to Bolster Europe’s Semiconductor Resilience

Programs to Focus on Sustainable Solutions to Meet Evolving Industry Requirements  Semiconductor industry experts will convene at SEMICON Europa 2025,...

Award Winning NOVAFAB® Fine Grain Copper Electroplating Process for Hybrid Bonding Applications

MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to have...

Indium Corporation Commemorates 30th Anniversary of Asia-Pacific Hub in Singapore

Indium Corporation, a leading materials manufacturer and supplier for global electronics markets, celebrates 30 years of service at its Asia-Pacific...

EV Group Highlights Hybrid Bonding, Lithography, and Support for U.S. Semiconductor Onshoring at SEMICON West 2025

EVG celebrates 30th anniversary of its North America subsidiary in Arizona EV Group (EVG), a leading provider of innovative process...

Indium Corporation Expert to Present on Innovative Thermal Management Solution at IMAPS Thermal Conference

Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on a new liquid metal...

StratEdge Highlights High-Performance Packaging at IMAPS and BCICTS

Experts available to discuss high-frequency, high-reliability packaging solutions in San Diego and Scottsdale StratEdge Corporation, a leader in the design...

Indium Corporation Experts to Present on Thermal Interface Materials (TIM) at IMAPS Microelectronics Symposium

Indium Corporation experts will deliver technical presentations on thermal interface materials (TIMs) at the International Symposium on Microelectronics, organized by the International...

PDF Solutions Secures Landmark Contract with Global IDM Customer

Large 2025 Contract Validates High-Volume Manufacturing Strategy PDF Solutions, Inc. announced a landmark contract signing: a significant multi-year agreement to expand...

Nordson Electronics Solutions Enables Seamless Integration of actnano PFAS-free Coatings with ASYMTEK Select Coat® Conformal Coating Systems

Simplify sustainability by reducing energy, eliminating curing ovens, and enhancing throughput with environmentally conscious conformal coating solutions Nordson Electronics Solutions,...

Brewer Science Expands U.S. Operations with New Chandler, Arizona Office and Lab

Collaboration with semiconductor customers and research partners, access to talent among key considerations Brewer Science, Inc., a global leader in...

Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire

Indium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves...

ACM Research Unveils Ultra ECDP Electrochemical Deplating Tool for Compound Semiconductor Gold Etch Processes

The Ultra ECDP System Delivers Superior Uniformity and Minimized Undercut for High-Precision Au Bump, Thin Film, and Deep-Hole Deplating ACM...