Enabling defect-free copper via fill, ultra-fine line and space, and scalable pathways for AI and HPC packaging
(Waterbury, CT USA) – February 11, 2026 – MacDermid Alpha Electronics Solutions, a leading
supplier of integrated materials and chemistries to the electronics industry, will participate in the
IMAPS 22nd Annual Device Packaging Conference. The company will showcase its
comprehensive portfolio of wafer fabrication and IC substrate technologies engineered to address
the performance, reliability, and scalability challenges of advanced semiconductor manufacturing.
Maximize Reliability and Performance for Today’s Complex Architectures
The rapid adoption of high-performance computing (HPC) and artificial intelligence (AI) is
accelerating the need for more advanced packaging solutions. Continuous device scaling is
driving semiconductors to become smaller, thinner, and more powerful, significantly increasing
power density and thermal loads. These trends place unprecedented demands on interconnect
performance and long-term reliability, making materials partner selection a critical factor in yield,
scalability, and total cost of ownership.
At IMAPS, MacDermid Alpha will highlight how its advanced metallization chemistries, including
low alpha tin materials, dual damascene processes, and panel level packaging solutions, support
defect reduction, yield optimization, and scalable manufacturing for high-density, highperformance
architectures. These technologies support manufacturers in meeting stringent performance and reliability
requirements for next-generation applications such as HPC, high-bandwidth memory (HBM), and
AI accelerators.
“As architectural density and complexity continue to increase, semiconductor manufacturers
require materials that deliver maximum performance, uncompromising reliability, and consistent
yields,” said Brian Gokey, Vice President – Wafer Level Packaging, MacDermid Alpha. “As a
strategic partner, MacDermid Alpha combines continuous innovation and expert technical support with an agile and flexible development process to deliver unique solutions that enable lower cost
of ownership through process efficiency and the fastest time to market.”
Interconnect Solutions at the Forefront of Technology
During the WLP2 Conference Session, Saminda Dharmarathna, Ph.D., R&D Line of Business
Partner – IC Substrates, will introduce an innovative copper electroplating process specifically
developed for advanced IC substrates. As demand grows across AI, 5G, and HPC applications,
IC substrates are increasingly incorporating wafer-level precision manufacturing techniques. This
evolution requires new plating solutions capable of achieving ultra-fine line and space (L/S)
features, defect-free via filling, and highly planar surfaces, all critical to multilayer stack integrity,
electrical performance, and long-term reliability.
Saminda’s presentation will highlight how this scalable and efficient technology addresses the
combined challenges of miniaturization, defect control, and manufacturability at scale.
Paper Title: Enabling AI and HPC: Defect-Free, Co-Planar Copper Via-Fill Plating Process
for Advanced IC Substrates
Date/Time: March 4, 16:00–16:30
MacDermid Alpha’s technical experts will be available at Booth 503 throughout the conference
to discuss how its integrated solutions, advanced materials, and collaborative partnership
approach are enabling scalable, proven, high-reliability semiconductor packaging solutions –
supporting customers from development to high-volume manufacturing.
For more information visit our website: macdermidalpha.com
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Contacts:
MacDermid Alpha Electronics Solutions
Emma Giles – Strategic Business Partner – Circuitry Solutions and Wafer Level Packaging
Phone: +44 (0) 7768 644414
MacDermid Alpha Electronics Solutions
Joanna Locke, Public Relations Manager
Office: +44 (0) 1235 773103
PublicRelations@MacDermidAlpha.com
www.macdermidalpha.com
