A Tribute to Herb Reiter, Upon his Retirement
Oct 20, 2020 · By Francoise von Trapp · Blogs, Francoise in 3D
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Celebrating 25 Years of Advanced Packaging Innovation: Part 2
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning...
Celebrating 25 Years of Advanced Packaging Innovation: Part 1
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS...
Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging Conference
Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual...
A Race to the Finish: Announcing the Winners of the 2019 3D InCites Awards
The 2019 3D InCites Awards vote was a nail-biter right up until the end. While some categories seemed almost predictable...
Happy Holidays, from all the elves at 3D InCites!
The semiconductor industry could learn a few things from Santa’s elves. How about devices that package themselves? These guys may...
Seen on the Scene at Electronica 2018
This was my first Electronica, and all I can say is – It is massive. It covered everything to do...
Seen on the Scene at SEMICON Europa 2018
SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without...
Closing Out My 2018 Conference Season With SEMICON Europa and Electronica
In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS...
The MSEC 2018 Technology Showcase: Who Owns the Data?
The competition was fierce and the stakes high for the annual MSEC 2018 technology showcase. which took place during the...
MSEC 2018 Keynote Speaker Examines the Growing Importance of Cybersecurity
Just over a year ago, Napa Valley was in flames, and the annual MEMS and Sensors Executive Congress (MSEC) had...
Talking Nerdy with Exhibitors at IWLPC 2018
With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process...
Bridging the Interconnect Pitch Gap Calls for 3D Technologies
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s...
Hello, Microelectronics and Packaging? Your Opportunities are Calling
There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the...
How Do We Create Smart Cities Without Exploiting Personal Data?
Creating smart cities while also protecting the personal data of its citizens is no easy task these days, particularly with...
Dr. Phil Garrou Makes the Move to 3D InCites
Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites...
Ain’t No Mountain High Enough to Keep Rozalia Beica From Success
“Driven” doesn’t even begin to describe Romanian-born Rozalia Beica, global director, strategic marketing, DowDupont. Neither rain, nor sleet, nor whizzing...
3D VLSI is the New Active Interposer
3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on...
Will Fully-Autonomous Vehicles Ever Take Over Our Roads?
At the 2018 European MEMS, Imaging and Sensors Summits, I detected a shift in sentiment around the likelihood (and the...
MEMS, Imaging, and Sensors Summits Show The Power of Collaboration
Last week, at the co-located 2018 European MEMS and Sensors/Imaging and Sensors Summits, held in Grenoble, France, I had the...