Supporting the 3D Megatrend in Semiconductor Manufacturing
Sep 18, 2019 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 3
Talking about Technology Megatrends at SEMICON West 2019
What a difference a year makes. First the aesthetic: after two years of maneuvering around a construction zone at SEMICON...
A Look at imec’s Two-Step Wafer-level Mold Process
The recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its...
SiP Technology To Enable Technology Megatrends
Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also...
Good News about Glass Substrates
Over the years on 3D inCites, we’ve discussed the debate about the advantages and disadvantages of using glass substrates for...
DBI® Ultra Changes the Game for Heterogeneous Integration
I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve...
Fan-out Panel-level Packaging Comes to the ECTC Technology Corner
On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about....
Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019
In the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a...
ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging
Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview...
Book Review: Advances in Embedded and Fan-out Wafer Level Packaging Technology
When asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level...
Could ON Semiconductor be GlobalFoundries’ White Knight?
In light of recent rumors, could ON Semiconductor’s acquisition of GlobalFoundries’ East Fishkill fab save the company from being carved...
Arizona SEMI Breakfast Forum Focuses on Sensors Enabling a Connected World
Why are sensors not on the same growth trajectory as CMOS? In the face of a shaky global economy, where...
Celebrating 25 Years of Advanced Packaging Innovation: Part 2
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning...
Celebrating 25 Years of Advanced Packaging Innovation: Part 1
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS...
Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging Conference
Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual...
A Race to the Finish: Announcing the Winners of the 2019 3D InCites Awards
The 2019 3D InCites Awards vote was a nail-biter right up until the end. While some categories seemed almost predictable...
Happy Holidays, from all the elves at 3D InCites!
The semiconductor industry could learn a few things from Santa’s elves. How about devices that package themselves? These guys may...
Seen on the Scene at Electronica 2018
This was my first Electronica, and all I can say is – It is massive. It covered everything to do...
Seen on the Scene at SEMICON Europa 2018
SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without...
Closing Out My 2018 Conference Season With SEMICON Europa and Electronica
In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS...