Thank you to our valued IMAPS exhibitors for your continued support and partnership. Your participation helps make our events successful, fosters industry connections, and showcases the latest innovations shaping the microelectronics and advanced packaging community. Below are recent news announcements, press releases, and exhibitor spotlights from some of our exhibiting companies, highlighting their invitations to attendees and providing a preview of the products, technologies, and solutions they will be showcasing at the IMAPS Symposium. To learn more about all participating exhibitors, be sure to visit the Exhibitor Directory for a complete listing of companies and their offerings.
We invite you to visit Amkor Technology at Booth #225 during the IMAPS Symposium 2026.
Meet with our technical and business leaders to discuss Amkor’s latest innovations in advanced packaging, System-in-Package (SiP), wafer-level packaging, AI infrastructure, data center, automotive, and high-performance computing solutions.
While you’re there, learn more about Amkor’s new advanced packaging and test facility in Peoria, Arizona, and how it will help support next-generation semiconductor manufacturing in the United States.
Interested in joining our team? We will also be happy to discuss current career opportunities across engineering, manufacturing, operations, and corporate functions.
We would welcome the opportunity to meet with you one-on-one during the event. Please send a message to Marcom@amkor.com to schedule a meeting or stop by Booth #225. We look forward to seeing you at IMAPS Symposium.
As a global technology leader in advanced materials for semiconductor devices, we go beyond the material to deliver innovation, sustainability, and dedicated end-to-end support for your application’s entire life cycle.
Come meet our technical team at booth 121 to learn more about our world-class packaging materials, sustainable solutions, and why NAMICS is the world’s leading supplier of capillary underfills.
Discover how MRSI die bonding solutions support advanced microelectronics and packaging applications.
- Explore interactive Augmented Reality product demonstrations
- Meet with MRSI experts to discuss your manufacturing challenges
- Learn about high-speed, high-precision die bonding technologies
- Schedule a one-on-one meeting during the event
- Reserve a tour of our Tewksbury facility
Visit Booth #219 and experience MRSI products in Augmented Reality, or schedule a meeting with our team before the show.
We’re excited to be heading to Boston for the 59th International Symposium, organized by IMAPS. The Symposium will focus on Intelligent Packaging for the AI Era: Heterogeneous Integration and Photonics. It offers one of the most robust programs for microelectronics and advanced packaging technical content.
Join us at booth 533 in Encore Hotel Boston to explore our latest solutions, exchange ideas with customers and partners, and build new connections across the industry.
AEMtec`s expertise covers Wafer Test, Fan-Out Wafer Level Packaging, Wafer Bumping, Opto Packaging, and a wide range of Advanced Technologies, enabling us to develop tailored solutions for specific application requirements.
Stop by our booth and discover the world of miniaturization through engaging conversations with our experts.
As Toray celebrates its 100th anniversary, we are pleased to showcase our latest material solutions for advanced semiconductor packaging at IMAPS Symposium. We invite you to learn more about our technologies for Polymer Hybrid Bonding, Glass Reinforcing Materials, and Adhesives for Co-Packaged Optics (CPO), along with our dielectric coating and film products for next-generation packaging applications.
Please stop by our booth to meet our team and explore how Toray’s innovative materials can support your future developments.
We look forward to welcoming you with our 100th year anniversary Japanese sake, so please stop by our booth and ask for “free SAKE”!
Visit NEMS at Booth #211!
Discover our advanced plasma solutions for FOWLP, FOPLP, SiPh/CPO, Glass Core, 2.5D/3D Packaging, and Hybrid Bonding. Come meet us and explore how NEMS plasma technologies can help enable next-generation semiconductor packaging.
We look forward to seeing you !
Visit ES Components at IMAPS Symposium!
As an exhibitor at this year’s IMAPS Symposium, ES Components invites you to stop by our booth# 202 and learn more about our capabilities and how we support advanced microelectronics and semiconductor programs.
Discover how our expertise in bare die, wafer processing, component sourcing, and long-term EOL storage solutions can help address your current and future component requirements.
We look forward to meeting you and discussing how ES Components can support your next program.
Stop by our booth 202 and let’s connect!
Stop by the JX Advanced Metals booth to explore our innovative materials for hybrid bonding, advanced packaging, and thermal management. Our team will be available to discuss your technical challenges and future needs.
Visit Colt Refining at Booth 502!
We invite all iMAPS conference attendees to stop by Booth 502 to meet our team and learn how we can maximize your precious metal returns. While you are there, watch our quick video to be entered into our exclusive raffle for a chance to win a pure silver coin! We look forward to seeing you on the exhibition floor.
Stop by and see Scanning Acoustic Microscopy in action!
Come say hello to PVA TePla and discover how our Metrology Systems and Material Solutions help customers detect, measure, and characterize materials and components with the highest precision. From Scanning Acoustic Microscopy and Ultrasonic Non-Destructive Testing to Hyperspectral Vision, our technologies support applications ranging from semiconductor production to energy and aerospace.
We look forward to meeting you!
Visit EV Group (EVG) in booth 618 at the IMAPS (International Microelectronics Assembly and Packaging
Society) 2026 exhibition and conference in Boston, MA, from September 29-October 1. EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes. EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
EVG’s high-volume-manufacturing-ready products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications. With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base – from the initial development through to the final integration at the customer’s site.
Founded in 1980, EVG services and supports an elaborate network of global customers and partners all over the world, with more than 1700 employees worldwide and fully-owned subsidiaries in the U.S., Japan, South Korea, China, Taiwan and Singapore.
EVG Business Development Manager, Dr. Ksenija Varga, will present two papers during
the symposium:
Plasma Dicing Innovations on Film‑Frame‑Carriers for High Bandwidth Memory (HBM) and Heterogeneous Integration Devices
Session details:
W-PM1 – MATERIALS AND PROCESSES FOR LARGE FORM FACTOR PACKAGE
ASSEMBLY
Cezanne 1-2
13:00-14:30
Wednesday, 30 September, 2026
Copper Pillar Patterning Using Digital Exposure Technology with Dry Film Resists for 2.5D PLP Session details:
TH-AM1 – FOWLP/PLP FOR LARGE SCALE HETEROGENEOUS INTEGRATION
Cezanne 1-2
09:30-11:55
Thursday, 1 October, 2026
ACM Research delivers advanced semiconductor and packaging solutions that help manufacturers solve complex process challenges while improving productivity, efficiency and yield. ACM Research’s portfolio spans cleaning, electroplating, stress-free polishing, vertical furnace processing, track, PECVD and wafer- and panel-level packaging technologies, enabling next-generation semiconductor devices and advanced packaging applications.
Visit us at booth #218 to discuss your advanced packaging needs, and learn more at www.acmr.com.
Have a Semiconductor Challenge? Let’s Solve It Together.
For 56 years, Tektronix Component Solutions has powered the world-renowned Tektronix instrumentation brand with industry leading semiconductor test and assembly expertise. Today, we bring that same trusted expertise to customers, helping them bring products to market with confidence.Tektronix Component Solutions provides end-to-end semiconductor services, including wafer inspection, wafer testing, package testing, package assembly, and engineering solutions for high-performance and high-reliability applications. Visit Booth 105 at IMAPS Symposium to connect and explore how we can support your next program. We look forward to meeting you!
xyztec is proud to return as a Silver Sponsor of this year’s IMAPS Symposium, marking 10 years of involvement.
For more than 25 years, xyztec has focused on bond testing solutions for semiconductor and advanced packaging applications. Our Sigma systems are designed to deliver accurate and repeatable mechanical testing, supported by extensive application knowledge and a wide range of automation capabilities.
Visit us at booth 327 to meet our team, discuss your bond testing challenges, and experience the capabilities of the Sigma bond tester live. We look forward to seeing you in Boston!
Let’s talk power. Visit Saras Micro Devices at Booth #520 and discover how we’re redefining power delivery with fully integrated, embeddable passive module solutions. Come connect and see what’s possible.
NorCom Systems invites you to visit us at IMAPS 2026, the 59th International Symposium on Microelectronics, taking place September 28 – October 1, 2026, in Boston, MA. Visit NorCom Systems at Booth #220! Discover how NorCom Systems is advancing leak testing by eliminating the need for forever chemicals in bubble leak testing and the need for helium in fine leak testing.
At our booth, we’ll be showcasing our latest capabilities:
· Fine and gross leak detection at the same time.
· Test cycles can be less than 10 minutes to MIL-STD-883 TM 1014.
· Optical leak testing that automatically provides a report.
· Solutions for medical, electronic, and semiconductor applications.
With more than 25 years of experience in leak test technology, our team looks forward to discussing your testing requirements and demonstrating our latest solutions.
Advanced Materials Technology (AMT) provides highly customized test wafer, test substrate, and TEG (Test Element Group) solutions for advanced packaging technology development. Our solutions support a wide range of applications, including hybrid bonding, TSV, RDL, bump formation, and heterogeneous integration. Through close collaboration with customers and trusted manufacturing partners, we help accelerate the development and evaluation of next-generation semiconductor packaging technologies. Please visit our booth (#322) to see our solutions!
Meet H&iruja at Booth 524 — Making Our U.S. Exhibition Debut at IMAPS Symposium
Discover “The Engineering Group Behind Better PVD.”
H&iruja is a technology-driven PVD equipment company delivering advanced solutions for next-generation packaging applications, including wafer-level packaging, panel-level packaging, and glass-core substrates.
At our first exhibition in the U.S., we invite you to meet the engineering team behind our technology and explore how H&iruja is addressing the evolving demands of advanced packaging with precision, flexibility, and deep process expertise.
Visit us at Booth 524 and discover the engineering behind better PVD.
Attending IMAPS Symposium in Boston? Stop by Booth 113 and visit QP Technologies and Promex!
As sister companies, QP Technologies and Promex bring complementary microelectronics and advanced packaging capabilities together. From wafer preparation, flip chip, wire bonding, and custom packaging to SMT, heterogeneous integration, and complex assembly, our teams support a wide range of applications and production needs.
Come meet the team, learn more about what we do, and talk with us about your next project. We look forward to seeing you in Boston!
We look forward to seeing you and discussing how we can support your next innovation!
Please stop by to say hello to Finetech at booth 416 and discuss ways we can assist you in developing solutions to your advanced die bonding and complex packaging needs!
Visit Neu Dynamics (NDC) at Booth # 316: US Based Machining & Molding | Representatives for Packaging Assembly Equipment
Stop by Booth # 316 to connect with Neu Dynamics Team during IMAPS Boston Symposium to discuss Machining and Molding Capabilities, as well as Packaging Assembly Equipment.
Microelectronics Packaging demands tighter tolerances and higher thermal performance, therefore, having the right assembly solutions and engineering support in place is critical. NDC represents several equipment manufacturers, with the latest advancements in semiconductor package assembly, including; Thermo-Compression Bonders, Hybrid Bonders, Vacuum Soldering, Sintering Systems, Precision Die Attach, Wire Bonding and Transfer Molding, for turnkey manufacturing. Troubleshooting an active Packaging challenge? Evaluating new Production Equipment? NDC is prepared to help optimize your processes!
We look forward to seeing you in Boston!
Visit Palomar Technologies at IMAPS Symposium
Palomar Technologies helps customers solve complex microelectronics assembly challenges through deep process expertise, advanced packaging capabilities, and precision assembly systems.
Visit booth #407 at IMAPS Symposium to meet the Palomar team and discuss your die attach, wire bonding, vacuum reflow, process development, and advanced assembly needs.
Nitride Global, Inc., a growth stage advanced materials company in the semiconductor space, specializes on aluminum oxynitride (AlON), a transformative advanced packaging thermal management and dielectric technology for 3D packaging, co-packaged optics, power electronics, RF and immersion cooling, alongside ultra-wide bandgap aluminum nitride (AlN) crystals & substrates.
We invite you to join us at our booth to see the latest developments in areas such as multi-layer substrates, 3D packaging gap fill, quantum sensor concept and others.
Working with LTCC or HTCC? Let’s talk!
Visit Haiku Tech at Booth #427 during the IMAPS Symposium 2026 to learn about our manufacturing solutions for advanced ceramic components.
From process and materials development to tape casting, punching, screen printing, stacking and laminating, our equipment is designed to support demanding LTCC and HTCC production requirements—from R&D and prototyping to production-scale manufacturing.
Bring us your application or manufacturing challenge—we’d be happy to discuss it with you at Booth #427.
Visit us at IMAPS and discover how Kyocera Semiconductor Group is enabling the next generation of advanced packaging and high-reliability semiconductor solutions. We look forward to meeting you at our booth #510!
Microdul AG, Zurich, Switzerland https://microdul.com/en/
Microdul AG – is your trusted partner for advanced microelectronics. We master the processes at all implementation stages – from development (ASIC Design) and engineering through production and test of custom applications. We strive to delight and inspire our customers.
StratEdge Corporation, a leader in the design and production of high-frequency, high-power, and high-reliability packages, will feature its molded ceramic packages at the IMAPS International Symposium on Microelectronics, September 29-30, Booth 312, in Boston. Come visit our booth to meet our experts and discuss your packaging requirements.
We are excited to connect with you at the upcoming IMAPS 2026 International Symposium on Microelectronics Assembly and Packaging!
As demands for high-frequency RF, high-density interposers, and photonic integration continue to surge, Mosaic Microsystems is at the forefront of providing scalable, high-precision glass substrate solutions.
Visit Us at Booth 504 Stop by our booth on the exhibit floor to meet our technical team, discuss your custom packaging requirements, and learn how our thin glass handling and processing capabilities can accelerate your product roadmap
Visit BTU International at Booth #308 during the IMAPS Symposium to discover the latest innovations in advanced packaging reflow technology. Our experts will be showcasing cutting-edge solutions designed to meet the thermal processing challenges of next-generation semiconductor packaging, including flux-free Formic Acid Reflow for superior oxide reduction and cleaner processes, low-vibration reflow technology for enhanced process stability, and TrueFlat™ technology that minimizes package warpage and improves yield in advanced packaging applications. Stop by Booth #308 to learn how BTU’s industry-leading reflow platforms are helping manufacturers achieve greater reliability, higher throughput, and exceptional process control for today’s most demanding advanced packaging requirements.
XTPL delivers next-generation additive, maskless, CAD-driven printing technology for advanced semiconductor and electronic packaging applications. Our Ultra Precise Dispensing (UPD®) technology enables the direct printing of conductive and non-conductive materials with single-digit micron accuracy — supporting advanced interconnects, repair, prototyping, and heterogeneous integration.
Visit us at booth #412 to discuss your advanced packaging challenges and see how XTPL can enable smaller, more precise, and more efficient solutions.
ASMPT will be exhibiting at iMAPS Symposium 2026, taking place from 28 September to 1 October in Boston, Massachusetts. Visitors to Booth #424 can explore ASMPT’s latest innovations in advanced packaging, heterogeneous integration, and photonics assembly.
As semiconductor packaging continues to evolve, technologies such as chiplet integration, optical connectivity, and advanced interconnect solutions are playing an increasingly important role in enabling next-generation electronic systems. ASMPT will showcase its First-Level Interconnect (FLI) technologies, including Fan-Out Panel-Level Packaging (FOPLP), Thermo-Compression Bonding (TCB), and Hybrid Bonding, alongside advanced assembly solutions for Co-Packaged Optics (CPO) and photonics applications.
The event provides an excellent opportunity to connect with ASMPT’s experts and learn how the company’s solutions support the journey from concept development to high-volume manufacturing for advanced packaging applications.
Kurtz Ersa Inc. will exhibit for the first time at the IMAPS Symposium 2026, held Sept. 29-Oct. 1 at Encore Boston Harbor – 1 Broadway, Everett, MA 02149. The company will host a tabletop display at the event and will focus on its comprehensive semiconductor product line developed for vacuum soldering, advanced packaging and microelectronics assembly. The symposium marks a strategic expansion of Kurtz Ersa’s tradeshow presence into the dedicated semiconductor manufacturing community, complementing its established footprint at SMT and PCB assembly events.
Visit Lintec of America at the 2026 IMAPS SYMPOSIUM! Booth #422
September 28th – October 1st, 2026; Encore Boston Harbor Hotel – Boston, Massachusetts.
MicroCircuit Laboratories (MCL) has officially launched production volumes of its innovative Robotic Cover Sealer (RCS), a new generation of hermetic package seam sealers engineered for high-reliability (hi-rel) microelectronic packaging.
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 28-October 1 at the Encore Boston Harbor in Everett, MA. Attendees are invited to visit Booth 426 to connect with KYZEN’s Scott Cain and learn more about KYZEN’s innovative MICRONOX cleaning solutions engineered for today’s most advanced and sensitive semiconductor applications.
Visit Rochester Electronics in BOOTH 318 at the IMAPS (International Microelectronics Assembly and Packaging Society) 2026 exhibition and conference in Boston, MA, from September 29-October 1. Globally headquartered in Newburyport, Massachusetts, Rochester Electronics is a global stocking distributor, licensed semiconductor manufacturer, and provider of semiconductor manufacturing services, offering the world’s largest continuous source of semiconductors. For over 45 years, Rochester has partnered with over 70 leading semiconductor manufacturers to provide its valued customers with a continuous source of critical semiconductors.
