It’s that time of year again – SEMI’s 2025 3D & Systems Summit event is just around the corner. Taking place in Dresden, Germany from June 25-27 at the Hilton Dresden Hotel, this year’s theme is Heterogenous Integration: Bolstering Europe’s Resilience. Attendees will gain insights on current geopolitical dynamics, market trends, and advancements in chiplet applications and hybrid bonding techniques.
With nine 3D InCites member companies speaking on topics ranging from workforce development to co-packaged optics, the 2025 Summit should be a wonderful event. In addition, we’re excited to see KLA’s Dave Thomas, Comet’s Isabella Drolz, TechSearch International’s Jan Vardaman, and Seung Kang from Adeia listed as featured speakers.
Unfortunately, Françoise and I won’t be attending or podcasting at this year’s Summit, but we’re excited to hear all about it. Steffen Kröhnert, a member of our advisory board will be attending. If you’ll be there, be sure to stop by a few of the member sessions and exhibits and say hi.
Read more about the event.
Adeia
Co-Optimization of AI Semiconductor Systems
- Thursday, June 26 from 12-12:20 p.m.
- Seung Kang
ASE
Topic coming soon
- Thursday, June 26 from 2-2:20 p.m.
- Christophe Zinck
Comet Yxlon
Solving the Semiconductor Talent Puzzle: Empowering Europe’s Future Innovators
- Wednesday, June 25 from 4:25-4:40 p.m.
- Isabella Drolz
Leveraging Hardware Enabled AI Image Analysis for Rapid 3D X-ray
- Friday, June 27 from 10:10-10:30 a.m.
- Joscha Malin and Christopher Nicholson
EV Group
Opening remarks and key takeaways for Session 2: Chiplet Applications: System Level Architectures
- Thursday, June 26 from 11:55 a.m. – 12 p.m. and 3-3:05 p.m.
- Thomas Uhrmann
Topic coming soon
- Thursday, June 26 from 6-6:20 p.m.
- Markus Wimplinger
Evatec
Advances in Thin-Film Deposition for Enabling Large-Body Packages at Panel Scale
- Friday, June 27 from 11-11:10 a.m.
- Markus Frei
KLA
Topic coming soon
- Wednesday, June 25 from 4:40-5:05 p.m.
- Sibo Chen
Implications on Wafer Processing of the Move from Pluggable to Co-Packaged Optics
- Friday, June 27 from 8:40-9:20 a.m.
- Dave Thomas
Lam Research
Advancing Heterogeneous Integration by Panel Level Packaging
- Friday, June 27 from 9:50-10:10 a.m.
- Maximillian Garneier
SEMI
Empowering Europe’s Semiconductor Future: How ECSA and ECDA Are Bridging Gaps in Talent and Inclusion
- Wednesday, June 25 from 5:20-5:35 p.m.
- Kartikey Srivastava
TechSearch International
Topic coming soon
- Thursday, June 26 from 10:45-11:05 a.m.
- Jan Vardaman
Panel Discussion: The Pilot Line’s Role in Bridging the Gap from R&D to Manufacturing
- Thursday, June 26 from 11:05-11:50 a.m.
- Moderated by Jan Vardaman
Member Exhibits
