Warpage Issues in Fan-Out Wafer Level Packaging

Warpage Issues in Fan-Out Wafer Level Packaging


June 26, 2017    John Lau

As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it, however, most of them don’t

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications


June 21, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized

Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products

Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products


June 20, 2017    YOLE DEVELOPPEMENT

Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022.

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP


June 16, 2017    Francoise von Trapp

  For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly design kits (ADK), similar

Impressions from ECTC 2017

Impressions from ECTC 2017


June 12, 2017    Francoise von Trapp

Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC

Artificial Intelligence: A New Era of the Advanced Packaging Industry

Artificial Intelligence: A New Era of the Advanced Packaging Industry


June 8, 2017    YOLE DEVELOPPEMENT

Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV & 2.5D business update report, Yole

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging


June 7, 2017    Herb Reiter

Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies,

Fifty Shades of Fan-out Discussed at ECTC 2017

Fifty Shades of Fan-out Discussed at ECTC 2017


June 6, 2017    Francoise von Trapp

The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place

Heterogeneous Integration Makes an End Run Around 7nm Silicon at SEMI ASMC 2017

Heterogeneous Integration Makes an End Run Around 7nm Silicon at SEMI ASMC 2017


June 5, 2017    Paul Werbaneth

I like to think that someday soon a perfectly ripe tomato growing on a vine is going to signal its condition via the 5G network

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group Expands Production Capacity at Corporate Headquarters in Austria


June 1, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging


May 30, 2017    Rudolph Technologies

Wilmington, Mass. (May 23, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep S Lithography System for fan-out

Will IoT be the Next Killer App for Semiconductors?

Will IoT be the Next Killer App for Semiconductors?


May 30, 2017    Herb Reiter

At the end of April, I attended the Internet of Things (IoT) Developers Conference at the Santa Clara Convention Center. Because our semiconductor industry is

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory


May 23, 2017    Andrew Walker

Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years of progress. Here we look

SMIC Signs License Agreement For Invensas’ DBI Technology

SMIC Signs License Agreement For Invensas’ DBI Technology


May 22, 2017    Invensas Corporation

Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide


May 17, 2017    EV Group

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16,

Are Glass Substrates the Next Option for Fan-out Packaging?

Are Glass Substrates the Next Option for Fan-out Packaging?


May 16, 2017    John Lau

As you all may know, in most fan-out wafer level packages (FOWLP) such as embedded wafer level ball grid array (eWLB) by Infineon and STATS