3D Integration 101: Explore, Learn, Share

On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became

Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation. However, in the past few

IFTLE has been saying for a few years that the decades-long scenario of moving from one node to the next was, for most if not

Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth, I talked to people I’ve

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard

“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected. The availability of large

In the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a swirl of presentations, conversations, and

Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that of an IC substrate. The

An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing

In the past few weeks, a reader sent a message to IFTLE titled “Time to bring back Lester the Lightbulb” with a link to a

While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write the review before I finish

Like most career women, balancing work and family life is a juggling act, leaving precious little time for hobbies. However, I’ve recently acquired quite a

Not all SemiSisters are engineers. In fact, many of us joined this industry from a variety of career backgrounds with non-STEM educations including financial, business

When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits (ICs), there were only a

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User

As packaging practitioners/experts themselves, regular readers know that IFTLE is always on the lookout for the latest applications and the latest chips going into those