Covering 3D IC technology and heterogeneous integration

Podcast of the week

Europe’s Advanced Packaging: Progress, Players, And The Road Ahead

Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project

Streamlined access to advanced electronic design automation (EDA) software for...

Applied Materials and TSMC Partner at the EPIC Center to Accelerate AI Scaling

Companies to work together at Applied’s EPIC Center in Silicon Valley to...

Hereaus Electronics’ Webinar: The Evolution of Thick Film Technology

Discover What’s Shaping the Future of Electronics!👉 Register now to...

Koh Young Webinar to Show How Data Transparency Strengthens SMT Production Resilience

Koh Young, the industry leader in True3D™ measurement-based inspection solutions,...

Siemens hardware-assisted verification validates Arm AGI CPU for scalable agentic AI

Siemens has collaborated with Arm to support verification of the Arm® AGI CPU and validate its performance for...

Cost-Effective High-Performance Flip Chip MicroLeadFrame®(fcMLF®) Package Introduction

Luke Hoefer, KyungSu KimAmkor Technology Inc.2045 E. Innovation CircleTempe, AZ...

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Event Coverage

VIEW Micro Metrology: Point of View at Device Packaging 2026

Backyard Olympics returns to Device Packaging 2026

Panelists Announced for “Addressing Barriers to Co-Packaged Optics” Panel Session at DPC 2026

Upcoming Events

Wirebonding Workshop & Table Top Exhibition

IMAPS Silicon Valley Memory Summit

CHIPcon 2026

THERMcon 2026

The 59th International Symposium on Microelectronics

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Packaging: The Make-or-Break Factor in mmWave Performance

From AI momentum to manufacturing reality

The Need for Speed: How Domestic Manufacturing Accelerates Delivery of Mission-Critical Technology

Top Stories

How Semiconductor Transistors Work: The On/Off Switches Powering Our Digital Society

SWAP Hub earns DoW Year 2 Award Investment from NSTXL

Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

Intel Foundry Achieves Breakthrough with World’s Thinnest GaN Chiplet Technology

Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?

Video of the week

First ‘Made in India’ Semiconductor Chip curtesy of CG Semi

Podcast of the week

Europe’s Advanced Packaging: Progress, Players, And The Road Ahead

Community News

Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project

Applied Materials and TSMC Partner at the EPIC Center to Accelerate AI Scaling

Hereaus Electronics’ Webinar: The Evolution of Thick Film Technology

Koh Young Webinar to Show How Data Transparency Strengthens SMT Production Resilience

Siemens hardware-assisted verification validates Arm AGI CPU for scalable agentic AI

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Cost-Effective High-Performance Flip Chip MicroLeadFrame®(fcMLF®) Package Introduction

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