3D Integration 101: Explore, Learn, Share

As I prepared to attend TSMC’s OIP 2018 Forum on October 3, 2018 two emails from TSMC caught my attention. They conveyed the news that

Creating smart cities while also protecting the personal data of its citizens is no easy task these days, particularly with growing public awareness and concern

Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites as contributing editor and as

“Driven” doesn’t even begin to describe Romanian-born Rozalia Beica, global director, strategic marketing, DowDupont. Neither rain, nor sleet, nor whizzing bullets overhead can keep this

The message remains consistent: following Moore’s Law is no longer economical for most IC designs. A major part of the IC value creation is moving

 3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on the scene as monolithic 3D

At the 2018 European MEMS, Imaging and Sensors Summits, I detected a shift in sentiment around the likelihood (and the feasibility) that fully-autonomous vehicles are

Last week, at the co-located 2018 European MEMS and Sensors/Imaging and Sensors Summits, held in Grenoble, France, I had the pleasure of gathering with 380

It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has

While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity issues, such as missing or

Throughout my years of writing about the semiconductor industry, I’ve met women from all over the world. I’ve often wondered what or who encouraged them

It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer level packaging (WLP) and heterogeneous

For the second consecutive year, SEMI Europe is co-locating its MEMS and Sensors/Imaging and Sensors Summits in Grenoble, France, in the heart of the Rhone-Alpes.

The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US

Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging,”

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages