Using Co-Design to Ensure Multi-Fabric System-Design Success

Using Co-Design to Ensure Multi-Fabric System-Design Success


January 16, 2018    MentorPCB

Today’s SoCs, multi-core CPUs and GPUs with their high performance, high bandwidth interconnect interfaces put demanding challenges across the entire system signal path, requiring system-wide

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth


January 19, 2018    SEMI

HALF MOON BAY, Calif. — January 17, 2018 — The SEMI Industry Strategy Symposium ( SEMI ISS) opened yesterday with the theme “Smart, Intuitive & Connected:

Notes from SEMI’s ISS 2018, Days 2 and 3

Notes from SEMI’s ISS 2018, Days 2 and 3


January 19, 2018    Francoise von Trapp

The remaining two days of SEMI’s ISS 2018 dawned foggy and damp, making it a heck of a lot easier to head to the ballroom

Notes from SEMI’s ISS 2018, Day One

Notes from SEMI’s ISS 2018, Day One


January 16, 2018    Francoise von Trapp

SEMI’s Industry Strategy Symposium (ISS) has been on my conference bucket list for some time, so when I was offered a press pass to attend

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2


January 15, 2018    Herb Reiter

Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations,

2018 Outlook for Advanced Packaging Materials

2018 Outlook for Advanced Packaging Materials


January 12, 2018    Ramachandran Trichur

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing

Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award

Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award


January 11, 2018    SEMI

MILPITAS, CA — January 11, 2018 — SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the

Is MEMS Packaging and Test the Next Opportunity for OSATs?

Is MEMS Packaging and Test the Next Opportunity for OSATs?


January 11, 2018    Emilie Jolivet

More than half of microelectromechanical systems MEMS packaging today is done by outsourced semiconductor and test services providers (OSATs) and Yole Développement (Yole) estimates OSATs’

The 14th 3D ASIP Conference Addresses a Spectrum  of 0pportunities, Part 1

The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1


January 9, 2018    Herb Reiter

Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and

IEDM 2017 Looks Way Beyond Moore’s Law

IEDM 2017 Looks Way Beyond Moore’s Law


January 3, 2018    Herb Reiter

The International Electronic Device Manufacturing Conference (IEDM) has always focused on device scaling, successfully guiding our industry for several decades along the challenging paths of Moore’s

TechSearch International Analyzes New Automotive Packaging Trends

TechSearch International Analyzes New Automotive Packaging Trends


January 3, 2018    TechSearch International, Inc.

More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for advanced driver assistance systems (ADAS).

New SEMI Japan President to Drive SEMI 2.0 in Japan

New SEMI Japan President to Drive SEMI 2.0 in Japan


January 2, 2018    SEMI

SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO Ajit Manocha, Hamajima assumes profit

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017


December 27, 2017    Paul Werbaneth

That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at 10:32 pm, a magnitude 3.9

Holiday Greetings from 3D InCites!

Holiday Greetings from 3D InCites!


December 21, 2017    Francoise von Trapp

Did you ever wonder how much easier Christmas Eve would be for Santa in a world enabled by heterogeneous integration? This video shows our vision. Enjoy!

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ


December 20, 2017    EV Group

  EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo


December 13, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an