3D Integration 101: Explore, Learn, Share

Over the years on 3D inCites, we’ve discussed the debate about the advantages and disadvantages of using glass substrates for advanced packaging applications. Thanks to

As IFTLE has been predicting for many years, the baton is once again being passed. In the early days of advanced microelectronics, packaging breakthroughs were

I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve watched it grow from its

“It’s relatively easy to build a fancy new transistor in the lab, but in order to replace what we’re doing today, you need to be

On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became

Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation. However, in the past few

IFTLE has been saying for a few years that the decades-long scenario of moving from one node to the next was, for most if not

Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth, I talked to people I’ve

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard

“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected. The availability of large

In the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a swirl of presentations, conversations, and

Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that of an IC substrate. The

An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing

In the past few weeks, a reader sent a message to IFTLE titled “Time to bring back Lester the Lightbulb” with a link to a

While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write the review before I finish

Like most career women, balancing work and family life is a juggling act, leaving precious little time for hobbies. However, I’ve recently acquired quite a