Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)


July 24, 2017    Francoise von Trapp

In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions during SEMICON West 2017. For

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends


July 20, 2017    TechSearch International, Inc.

Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging


July 19, 2017    Amber Leann

  Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio of materials solutions for advanced

2017 3D InCites Awards Ceremony and Reception: A Retrospective

2017 3D InCites Awards Ceremony and Reception: A Retrospective


July 19, 2017    Francoise von Trapp

Once again this year, the industry came out in full force to honor excellence in heterogeneous integration at the 2017 3D InCites Awards Ceremony and

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)


July 19, 2017    Francoise von Trapp

At SEMICON West 2016, the big story was the end of the ITRS Roadmap for dimensional scaling according to Moore’s Law and the birth of

NXP and Nepes Create Value with their First FO PoP SiP for IoT

NXP and Nepes Create Value with their First FO PoP SiP for IoT


July 18, 2017    YOLE DEVELOPPEMENT

Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and cost reduction to the final

Three Patents Granted to Smoltek

Three Patents Granted to Smoltek


July 14, 2017    Smoltek

Smoltek, a leading Swedish nanotech company in the semiconductor industry, has expanded its patent portfolio in Asia the last month. New patents in Japan and

What is Driving the Growth of the Glass Material Market in Semiconductor Manufacturing?

What is Driving the Growth of the Glass Material Market in Semiconductor Manufacturing?


July 14, 2017    YOLE DEVELOPPEMENT

Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role in the semiconductor industry. It

Announcing the Winners of the 2017 3D InCites Awards!

Announcing the Winners of the 2017 3D InCites Awards!


July 12, 2017    Francoise von Trapp

The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields

Tech Session Highlights from ECTC 2017

Tech Session Highlights from ECTC 2017


July 10, 2017    Herb Reiter

Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as well as the iMAPS’ SiP

EV Group Unveils Breakthrough Low-Temp Laser Debonding for FOWLP

EV Group Unveils Breakthrough Low-Temp Laser Debonding for FOWLP


July 5, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation laser debonding

DAC 54: From Grey to Colorful and Solutions-minded Messaging

DAC 54: From Grey to Colorful and Solutions-minded Messaging


June 28, 2017    Francoise von Trapp

The 54th Design Automation Conference (DAC 54) at the Austin Convention Center was very different, compared to the last several years’ events. Walking the exhibition

EV Group Brings Home Its Fifth Triple Crown in VLSIresearch Customer Satisfaction Survey

EV Group Brings Home Its Fifth Triple Crown in VLSIresearch Customer Satisfaction Survey


June 28, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fifth

Warpage Issues in Fan-Out Wafer Level Packaging

Warpage Issues in Fan-Out Wafer Level Packaging


June 26, 2017    John Lau

As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it, however, most of them don’t

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications


June 21, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized

Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products

Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products


June 20, 2017    YOLE DEVELOPPEMENT

Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022.