Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It

Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It


September 13, 2018    Francoise von Trapp

It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has

Veeco Announces Changes to Executive Leadership Team

Veeco Announces Changes to Executive Leadership Team


September 6, 2018    Veeco

PLAINVIEW, N.Y., September 4, 2018 —Veeco Instruments Inc. (NASDAQ: VECO) today announced that John Peeler, Chairman, and Chief Executive Officer, will transition to the role

Package Designers Need Assembly-level LVS Signoff for HDAP Verification

Package Designers Need Assembly-level LVS Signoff for HDAP Verification


September 1, 2018    MentorPCB

While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity issues, such as missing or

Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge

Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge


August 29, 2018    Francoise von Trapp

Throughout my years of writing about the semiconductor industry, I’ve met women from all over the world. I’ve often wondered what or who encouraged them

Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology

Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology


August 27, 2018    Francoise von Trapp

It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer level packaging (WLP) and heterogeneous

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits


August 16, 2018    Francoise von Trapp

For the second consecutive year, SEMI Europe is co-locating its MEMS and Sensors/Imaging and Sensors Summits in Grenoble, France, in the heart of the Rhone-Alpes.

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story


August 13, 2018    Francoise von Trapp

The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging


August 6, 2018    John Lau

Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging,”

TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications


August 2, 2018    TechSearch International, Inc.

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies


August 2, 2018    Invensas Corporation

SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading global semiconductor foundry, UMC. This

Striking the Right Chord for Chiplet Integration

Striking the Right Chord for Chiplet Integration


July 30, 2018    Amin Shokrollahi

The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total

It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018

It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018


July 25, 2018    Francoise von Trapp

Emerging technologies like artificial intelligence (AI), machine learning (ML) are driving more than just the semiconductor market. They also drove the conversations I had with

Volumes Matter and Other Conversations from SEMICON West 2018

Volumes Matter and Other Conversations from SEMICON West 2018


July 25, 2018    Francoise von Trapp

The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things (IoT) devices. And suddenly, semiconductors

Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems

Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems


July 24, 2018    Veeco

PLAINVIEW, New York, July 9, 2018 – Veeco Instruments Inc. (Nasdaq: VECO) today announced that one of the world’s leading memory chip manufacturers has ordered

SEMICON West Confirms:  AI is the New Killer-app for Semiconductors

SEMICON West Confirms:  AI is the New Killer-app for Semiconductors


July 24, 2018    Herb Reiter

SEMICON West (San Francisco, July 10 to 12) confirmed that our industry’s rapid growth will continue. Machine learning (ML) and artificial intelligence (AI) will be

Why We need Lower Cost TSVs and How to Get Them

Why We need Lower Cost TSVs and How to Get Them


July 19, 2018    Francoise von Trapp

Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between dies at extremely low power