The Path to Smarter Fabs

The Path to Smarter Fabs


September 18, 2019    Herb Reiter

Working from the mantra “None of us knows as much as all of us,” SEMI invited manufacturers of electronic components and systems to come together

Supporting the 3D Megatrend in Semiconductor Manufacturing

Supporting the 3D Megatrend in Semiconductor Manufacturing


September 17, 2019    Francoise von Trapp

We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not

IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips

IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips


September 11, 2019    Phil Garrou

Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s S10, the Xiaomi Mi 9 and LG G8 smartphones. And in other news, advanced packaging was the Cinderella Story at Hot Chips 2019.

EPS 2019: Imagining Thomas Edison as the Father of Advanced Packaging

EPS 2019: Imagining Thomas Edison as the Father of Advanced Packaging


September 10, 2019    Paul Werbaneth

Thomas Alva Edison didn’t invent semiconductor device packaging, but he might have, had he lived just one more generation. “I find out what the world

 IFTLE 424: Fingerprint Sensors Are Going Ultrasonic 

 IFTLE 424: Fingerprint Sensors Are Going Ultrasonic 


August 30, 2019    Phil Garrou

IIFTLE is always on the lookout for technologies that will require advanced packaging solutions. Fingerprint sensors for today’s latest smartphones appear to be one of

Your Electronics Industry Publications, Blogs, and Online Communities Need Your Support

Your Electronics Industry Publications, Blogs, and Online Communities Need Your Support


August 26, 2019    Francoise von Trapp

Everyone in the semiconductor industry seems so shocked by the steady stream of electronics industry publications closures and cutbacks over the past year. From where

The Importance of Fully Characterized Semiconductor Materials

The Importance of Fully Characterized Semiconductor Materials


August 23, 2019    Herb Reiter

More than 20 years ago, the cooperation between fabless IC vendors and wafer foundries started to dominate over the integrated device manufacturing (IDM) business model

The Need For and Value of Semiconductor Industry Organizations

The Need For and Value of Semiconductor Industry Organizations


August 21, 2019    Herb Reiter

Recognizing the need for and value of semiconductor industry organizations, in 1994, Jodi Shelton and CEOs of fabless IC companies founded the Fabless Semiconductor Association

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing


August 19, 2019    Phil Garrou

A year after GLOBALFOUNDRIES cancels its 7nm program, the company is developing 3D chip stacks fabricated using GLOBALFOUNDRIES’s 12nm FinFET process and features ARM’s mesh interconnect technology in 3D. This alternative to costly node shrinking may help GLOBALFOUNDRIES maintain a market presence.

How to Transform Innovative Technologies Into Customer-Specific Solutions

How to Transform Innovative Technologies Into Customer-Specific Solutions


August 14, 2019    Herb Reiter

Technology innovations don’t reach customers right away. It takes careful collaboration with the right partners to transform a new and innovative technology into high-value, customer-specific solutions.

What is Happening to the Memory Market?

What is Happening to the Memory Market?


August 12, 2019    Herb Reiter

Because memory represents typically about half the silicon content of a system, and multi-die packages typically combine many memory devices with one or more logic

IFTLE 422: Is Advanced Packaging Production Returning to the US by SHIP?

IFTLE 422: Is Advanced Packaging Production Returning to the US by SHIP?


August 9, 2019    Phil Garrou

Is advanced packaging production coming back to the USA?  The Navy (i.e. NSWC Crane) is currently seeking proposals from the industry for the development of

A Look Inside The  3D Technology Toolbox For STCO

A Look Inside The 3D Technology Toolbox For STCO


August 8, 2019    Eric Beyne

System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. Eric Beyne, imec fellow and program director of imec’s 3D system integration program and Julien Ryckaert, program director 3D hybrid scaling at imec, unravel the STCO principle, open up the 3D technology toolbox and bring up two promising cases: logic on memory, and backside power delivery.

Advanced SiPs Help More than Moore Reach Maturity

Advanced SiPs Help More than Moore Reach Maturity


August 6, 2019    Herb Reiter

Earlier this summer, 175 system-in-package (SiP) experts from all over the world met at the Marriott Hotel in Monterey’s Old Town at the IMAPS Advanced

New Details About More-than-Moore Test Technology Advances

New Details About More-than-Moore Test Technology Advances


July 31, 2019    Herb Reiter

SEMICON West and the Electronic System (ES) Design West were, for the first time, co-located at the Moscone Center in San Francisco, from July 9

IFTLE 421: Intel Showcases Co-EMIB Advanced Packaging Architecture

IFTLE 421: Intel Showcases Co-EMIB Advanced Packaging Architecture


July 30, 2019    Phil Garrou

Building on its previous announcements of embedded interconnect bridge (EMIB) and Foveros technologies, Intel recently provided details on three new enabling technologies for advanced packaging: Co-EMIB, managed data input/output (MDIO) and omnidirectional interconnect (ODI).