Featured Member
Upcoming Events
Job Openings
Top Stories
Member Monthly Highlights – November
Learning About Strategic Semiconductor Communication: My Internship at Kiterocket
Getting Every Semiconductor Company to Net Zero
Sustainability 101: A Closer Look at E-waste
IFTLE 575: Intel’s Interest in Glass Core Substrates
Tapping into the Power of the Microelectronics Community
Trending Topic
#advanced packaging · #heterogeneous integration 
Community Member Conversations from IMAPS 2023
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics... IFTLE 573: CHIPS Act Microelectronics Commons Regional Innovation Hub Winners
Microelectronics Commons The Microelectronics Commons is a Department of Defense (DoD) initiative that aims to create direct pathways to commercialization... IFTLE 572: North American Advanced Packaging, New Materials, and New Leaders
This week, we finish our look at papers presented during the IMAPS CHIPCon Conference held in July, 2023, where we... IMAPS Keynotes Focus on Heterogeneous Integration for HPC, AI, and EVs
This year’s IMAPS keynotes focused on advancements in heterogeneous integration (HI) technologies and chiplet architectures enabled by HI, driven by... The IMAPS 2023 International Symposium Inspires Generations of Microelectronics Leaders
It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in... How is X-ray Inspection Used in Semiconductor Manufacturing?
Technology is Key With the ever-present pressure to produce more efficient devices with more power, the sizes of the structures... IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This... IFTLE 569: IMAPS CHIPcon – Samsung’s Advanced Packaging
IMAPS CHIPCon conference was held at the end of July 2023. CHIPcon was created to focus on chiplets and Heterogeneous... Changes at 3D InCites: The Advisory Board Gets a Reboot and More
Fourteen years in existence, 3D InCites has been through some changes, from being a basic blogging platform focused only on... IFTLE 568: Government Agency Roles in Onshoring Microelectronics
In Part 4 of my coverage of the IMAPS Onshoring Workshop, we look at how government agency roles impact onshoring...
Community Member Conversations from IMAPS 2023
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
IFTLE 573: CHIPS Act Microelectronics Commons Regional Innovation Hub Winners
Microelectronics Commons The Microelectronics Commons is a Department of Defense (DoD) initiative that aims to create direct pathways to commercialization...
IFTLE 572: North American Advanced Packaging, New Materials, and New Leaders
This week, we finish our look at papers presented during the IMAPS CHIPCon Conference held in July, 2023, where we...
IMAPS Keynotes Focus on Heterogeneous Integration for HPC, AI, and EVs
This year’s IMAPS keynotes focused on advancements in heterogeneous integration (HI) technologies and chiplet architectures enabled by HI, driven by...
The IMAPS 2023 International Symposium Inspires Generations of Microelectronics Leaders
It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in...
How is X-ray Inspection Used in Semiconductor Manufacturing?
Technology is Key With the ever-present pressure to produce more efficient devices with more power, the sizes of the structures...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
IFTLE 569: IMAPS CHIPcon – Samsung’s Advanced Packaging
IMAPS CHIPCon conference was held at the end of July 2023. CHIPcon was created to focus on chiplets and Heterogeneous...
Changes at 3D InCites: The Advisory Board Gets a Reboot and More
Fourteen years in existence, 3D InCites has been through some changes, from being a basic blogging platform focused only on...
IFTLE 568: Government Agency Roles in Onshoring Microelectronics
In Part 4 of my coverage of the IMAPS Onshoring Workshop, we look at how government agency roles impact onshoring...Community Members
