Strategic Partnership with ESD Alliance Extends SEMI’s Reach to Semiconductor Design

Strategic Partnership with ESD Alliance Extends SEMI’s Reach to Semiconductor Design


April 19, 2018    Herb Reiter

On Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System Design (ESD) Alliance, representing the

Kamel Ait-Mahiout Appointed as CEO of UnitySC

Kamel Ait-Mahiout Appointed as CEO of UnitySC


April 17, 2018    UnitySC

Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced that

Implementing High-Density Advanced Packaging for OSATs and Foundries

Implementing High-Density Advanced Packaging for OSATs and Foundries


April 17, 2018    MentorPCB

Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in response to system scaling demands.

The Future of Non-volatile Memory

The Future of Non-volatile Memory


April 11, 2018    Andrew Walker

Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above

Getting IC Package Design Right the First Time

Getting IC Package Design Right the First Time


April 10, 2018    Francoise von Trapp

Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated as it becomes more critical

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More


April 5, 2018    Francoise von Trapp

Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s

Packaging, Innovation, and Our Application-Driven World

Packaging, Innovation, and Our Application-Driven World


April 2, 2018    Paul Werbaneth

MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review, are on again in Silicon

Hybrid Bonding: From Concept to Commercialization

Hybrid Bonding: From Concept to Commercialization


April 2, 2018    Francoise von Trapp

Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications, from 2DS enhanced, to 3D

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Advanced Packaging Trends – Part II: Solving Lithography Challenges


March 26, 2018    Doug Anberg

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM) / redistribution layer (RDL) challenges.

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018


March 22, 2018    Paul Werbaneth

The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the

The Invention of NAND Flash Memory

The Invention of NAND Flash Memory


March 21, 2018    Andrew Walker

Part 3 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the invention of NAND flash memory. The above image

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives


March 21, 2018    Francoise von Trapp

How does the innovation of self-driving cars affect the business world we live in? This was the topic the iMAPS Global Business Council (GBC) chose

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control


March 20, 2018    UnitySC

Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of

Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS DPC 2018

Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS DPC 2018


March 14, 2018    Francoise von Trapp

As it has for the past 14 years, the global microelectronics industry gathered at Wekopa Resort and Conference Center in Fountain Hills, AZ, March 6-8,

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education


March 12, 2018    Francoise von Trapp

March 7, 2018, the day of the 2018 3D InCites Awards Ceremony, dawned chillier than normal for this time of year in Fountain Hills, AZ.

Citius, Altius, Fortius Redux: More From SEMICON Korea 2018

Citius, Altius, Fortius Redux: More From SEMICON Korea 2018


March 4, 2018    Paul Werbaneth

The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their sights on SEMICON China this