IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing


August 19, 2019    Phil Garrou

A year after GLOBALFOUNDRIES cancels its 7nm program, the company is developing 3D chip stacks fabricated using GLOBALFOUNDRIES’s 12nm FinFET process and features ARM’s mesh interconnect technology in 3D. This alternative to costly node shrinking may help GLOBALFOUNDRIES maintain a market presence.

How to Transform Innovative Technologies Into Customer-Specific Solutions

How to Transform Innovative Technologies Into Customer-Specific Solutions


August 14, 2019    Herb Reiter

Technology innovations don’t reach customers right away. It takes careful collaboration with the right partners to transform a new and innovative technology into high-value, customer-specific solutions.

What is Happening to the Memory Market?

What is Happening to the Memory Market?


August 12, 2019    Herb Reiter

Because memory represents typically about half the silicon content of a system, and multi-die packages typically combine many memory devices with one or more logic

IFTLE 422: Is Advanced Packaging Production Returning to the US by SHIP?

IFTLE 422: Is Advanced Packaging Production Returning to the US by SHIP?


August 9, 2019    Phil Garrou

Is advanced packaging production coming back to the USA?  The Navy (i.e. NSWC Crane) is currently seeking proposals from the industry for the development of

A Look Inside The  3D Technology Toolbox For STCO

A Look Inside The 3D Technology Toolbox For STCO


August 8, 2019    Eric Beyne

System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. Eric Beyne, imec fellow and program director of imec’s 3D system integration program and Julien Ryckaert, program director 3D hybrid scaling at imec, unravel the STCO principle, open up the 3D technology toolbox and bring up two promising cases: logic on memory, and backside power delivery.

Advanced SiPs Help More than Moore Reach Maturity

Advanced SiPs Help More than Moore Reach Maturity


August 6, 2019    Herb Reiter

Earlier this summer, 175 system-in-package (SiP) experts from all over the world met at the Marriott Hotel in Monterey’s Old Town at the IMAPS Advanced

New Details About More-than-Moore Test Technology Advances

New Details About More-than-Moore Test Technology Advances


July 31, 2019    Herb Reiter

SEMICON West and the Electronic System (ES) Design West were, for the first time, co-located at the Moscone Center in San Francisco, from July 9

IFTLE 421: Intel Showcases Co-EMIB Advanced Packaging Architecture

IFTLE 421: Intel Showcases Co-EMIB Advanced Packaging Architecture


July 30, 2019    Phil Garrou

Building on its previous announcements of embedded interconnect bridge (EMIB) and Foveros technologies, Intel recently provided details on three new enabling technologies for advanced packaging: Co-EMIB, managed data input/output (MDIO) and omnidirectional interconnect (ODI).

How 3D Keeps the Semiconductor Industry Scaling

How 3D Keeps the Semiconductor Industry Scaling


July 25, 2019    Dean Freeman

Imec did their usual stellar job of demonstrating what needs to happen in the semiconductor manufacturing world to enable the next generation of semiconductor devices

IFTLE 420: Low-Loss NCF and Laser-Assisted TCB

IFTLE 420: Low-Loss NCF and Laser-Assisted TCB


July 23, 2019    Phil Garrou

Since it first appeared several years ago, IFTLE has been a big-time proponent of pre-applied non-conductive film (NCF) combined with thermal compression bonding (TCB) for

What Role does the US-China Trade War Play in the Semiconductor Downturn?

What Role does the US-China Trade War Play in the Semiconductor Downturn?


July 22, 2019    Francoise von Trapp

The US-China trade war is top of mind for those who work in the semiconductor industry. How much of the current downturn is it responsible

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

SEMICON West Keynotes Look to a Future Beyond Moore’s Law


July 18, 2019    Herb Reiter

Reporting from the SEMICON West keynote talks, Herb Reiter relays the perspectives of industry experts on everything from More than Moore, to hot topics and future technologies.

Talking about Technology Megatrends at SEMICON West 2019

Talking about Technology Megatrends at SEMICON West 2019


July 16, 2019    Francoise von Trapp

What a difference a year makes. First the aesthetic: after two years of maneuvering around a construction zone at SEMICON West, the Moscone Center renovation

IFTLE 419: Update on GlobalFoundries Foundry Status and Cree’s SiC Plans     

IFTLE 419: Update on GlobalFoundries Foundry Status and Cree’s SiC Plans     


July 15, 2019    Phil Garrou

Is GlobalFoundries looking for an exit or simply shedding parts of the company that do not fit its new focus? Back in IFTLE 406 we

A Look at imec’s Two-Step Wafer-level Mold Process

A Look at imec’s Two-Step Wafer-level Mold Process


July 7, 2019    Francoise von Trapp

The recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its two-step wafer-level transfer mold process

SiP Technology To Enable Technology Megatrends

SiP Technology To Enable Technology Megatrends


July 2, 2019    Francoise von Trapp

Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures