Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow

Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow


September 21, 2017    MentorPCB

Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is rapidly gaining popularity in the

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem


September 20, 2017    Herb Reiter

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into

 Integrated Solid-state Capacitors Based on Carbon Nanostructure 

 Integrated Solid-state Capacitors Based on Carbon Nanostructure 


September 20, 2017    Smoltek

The constant demand for miniaturization, added functionality and increased performance of electronic devices systematically drives higher integration by adding more devices on a single chip.

Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards

Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards


September 14, 2017    YOLE DEVELOPPEMENT

In the AMD-NVIDIA battle, System Plus Consulting’s experts continue to pursue innovation and monitor progress. At the beginning of the year, AMD was pleased to

Temporary Bonding and Debonding Technologies for Fan-out Wafer-Level Packaging

Temporary Bonding and Debonding Technologies for Fan-out Wafer-Level Packaging


September 14, 2017    Dr. Tony Flaim

Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within an affordable package. It enables

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing


September 14, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received multiple

Fan-out Packaging Confirms its Success Story

Fan-out Packaging Confirms its Success Story


September 14, 2017    YOLE DEVELOPPEMENT

Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole). Will

Rudolph Announces Multiple Customers’ Acceptance  of its Firefly Inspection System

Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System


September 14, 2017    Rudolph Technologies

Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017


September 12, 2017    Rudolph Technologies

Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable

Technology Showcase Finalists Revealed for European MEMS & Sensors Summit

Technology Showcase Finalists Revealed for European MEMS & Sensors Summit


August 28, 2017    SEMI

GRENOBLE, France ─ August 28, 2017 – SEMI®, with its Strategic Association partner MEMS & Sensors Industry Group® (MSIG), today announced its shortlist of competitors

MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE

MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE


August 28, 2017    MRSI Systems

North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be

Plasma-Therm and Trymax Partner to Distribute Resist Ashing Products in North America

Plasma-Therm and Trymax Partner to Distribute Resist Ashing Products in North America


August 24, 2017    Ludo Vandenberk

ST. PETERSBURG, Florida and NIJMEGEN, The Netherlands (Aug. 15, 2017) – Plasma-Therm LLC, and Trymax Semiconductor Equipment BV, announced today that they have entered into

New Solution for Testing Chips Prior to 3D Stacking

New Solution for Testing Chips Prior to 3D Stacking


August 21, 2017    Erik Jan Marinissen

Stacking chips on top of each other (aka 3D stacking) is a well-known approach to make more compact and powerful systems. Until now, it was

Will Fully Autonomous Vehicles Solve Global Transportation Problems?

Will Fully Autonomous Vehicles Solve Global Transportation Problems?


August 18, 2017    Francoise von Trapp

Automotive electronics, with the Holy Grail being fully autonomous vehicles, is currently being touted as one of the biggest growth drivers for the semiconductor industry.

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing


August 18, 2017    MRSI Systems

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law


August 15, 2017    Eric Beyne

In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS