Thermal Metamaterials for Advanced Packaging Applications from Stanford University

Thermal Metamaterials for Advanced Packaging Applications from Stanford University


May 11, 2018    Paul Werbaneth

Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials with low thermal conductivity also

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets


May 8, 2018    UnitySC

Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity

Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry

Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry


May 8, 2018    Francoise von Trapp

Bitcoin, a cryptocurrency built on blockchain, has become one of the hottest topics to hit the semiconductor news feeds and the conference circuit since the

2018 TSMC Technology Symposium: Listen – Analyze – Act

2018 TSMC Technology Symposium: Listen – Analyze – Act


May 3, 2018    Herb Reiter

May 1st is a holiday in many countries, but not in the U.S. and not for TSMC. A very professional TSMC team and many of

Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 


Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 



May 2, 2018    Francoise von Trapp

Digital imaging has come a long way since its first consumer implementation in digital cameras to replaced film cameras in the early 21st century. In

There’s a Fan-out for That

There’s a Fan-out for That


April 24, 2018    Francoise von Trapp

Long gone are the days of the “killer app” and the notion that a single device market like personal computers (PCs) or smartphones alone can

Implementing High-Density Advanced Packaging for OSATs and Foundries

Implementing High-Density Advanced Packaging for OSATs and Foundries


April 17, 2018    MentorPCB

Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in response to system scaling demands.

The Future of Non-volatile Memory

The Future of Non-volatile Memory


April 11, 2018    Andrew Walker

Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above

Getting IC Package Design Right the First Time

Getting IC Package Design Right the First Time


April 10, 2018    Francoise von Trapp

Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated as it becomes more critical

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More


April 5, 2018    Francoise von Trapp

Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s

Packaging, Innovation, and Our Application-Driven World

Packaging, Innovation, and Our Application-Driven World


April 2, 2018    Paul Werbaneth

MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review, are on again in Silicon

Hybrid Bonding: From Concept to Commercialization

Hybrid Bonding: From Concept to Commercialization


April 2, 2018    Francoise von Trapp

Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications, from 2DS enhanced, to 3D

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Advanced Packaging Trends – Part II: Solving Lithography Challenges


March 26, 2018    Doug Anberg

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM) / redistribution layer (RDL) challenges.

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018


March 22, 2018    Paul Werbaneth

The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the

The Invention of NAND Flash Memory

The Invention of NAND Flash Memory


March 21, 2018    Andrew Walker

Part 3 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the invention of NAND flash memory. The above image

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives


March 21, 2018    Francoise von Trapp

How does the innovation of self-driving cars affect the business world we live in? This was the topic the iMAPS Global Business Council (GBC) chose