Fan-out Panel-level Packaging Comes to the ECTC Technology Corner

Fan-out Panel-level Packaging Comes to the ECTC Technology Corner


June 12, 2019    Francoise von Trapp

On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became

Advanced Substrates: The Winds of Change

Advanced Substrates: The Winds of Change


June 12, 2019    YOLE DEVELOPPEMENT

Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation. However, in the past few

IFTLE 416: What’s Coming Next on the IC Front End? Samsung Gates All Around

IFTLE 416: What’s Coming Next on the IC Front End? Samsung Gates All Around


June 11, 2019    Phil Garrou

IFTLE has been saying for a few years that the decades-long scenario of moving from one node to the next was, for most if not

The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors

The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors


June 10, 2019    Julia Goldstein

Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth, I talked to people I’ve

The Importance of a Well-coordinated Semiconductor Supply Chain

The Importance of a Well-coordinated Semiconductor Supply Chain


June 6, 2019    Herb Reiter

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard

Heterogeneous Integration Component Flavors SEMI ASMC 2019

Heterogeneous Integration Component Flavors SEMI ASMC 2019


June 5, 2019    Paul Werbaneth

“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected. The availability of large

Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019

Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019


June 4, 2019    Francoise von Trapp

In the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a swirl of presentations, conversations, and

IFTLE 415:Substrate-like PCBs; Three Top Ten Packaging Houses are China-based

IFTLE 415:Substrate-like PCBs; Three Top Ten Packaging Houses are China-based


June 1, 2019    Phil Garrou

Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that of an IC substrate. The

Book Review: Handbook of 3D Integration – Volume 4

Book Review: Handbook of 3D Integration – Volume 4


May 23, 2019    Herb Reiter

An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing

IFTLE 414: Lester the Lightbulb… Revisited 

IFTLE 414: Lester the Lightbulb… Revisited 


May 22, 2019    Phil Garrou

In the past few weeks, a reader sent a message to IFTLE titled “Time to bring back Lester the Lightbulb” with a link to a

Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing

Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing


May 21, 2019    Francoise von Trapp

While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write the review before I finish

Women in Semiconductors: A Rising Tide Will Lift All Boats

Women in Semiconductors: A Rising Tide Will Lift All Boats


May 20, 2019    Amy Leong

Like most career women, balancing work and family life is a juggling act, leaving precious little time for hobbies. However, I’ve recently acquired quite a

A Non-Techie SemiSister Tackles The Elusive Semiconductor Language

A Non-Techie SemiSister Tackles The Elusive Semiconductor Language


May 16, 2019    Kate Roe

Not all SemiSisters are engineers. In fact, many of us joined this industry from a variety of career backgrounds with non-STEM educations including financial, business

3D Test: No Longer a Bottleneck!

3D Test: No Longer a Bottleneck!


May 15, 2019    Erik Jan Marinissen

When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits (ICs), there were only a

U2U 2019 Conference Dives into 2.5/3D IC Design

U2U 2019 Conference Dives into 2.5/3D IC Design


May 13, 2019    Herb Reiter

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User

IFTLE 413: Beware of Technology Hype for the Automotive Market

IFTLE 413: Beware of Technology Hype for the Automotive Market


May 10, 2019    Phil Garrou

As packaging practitioners/experts themselves, regular readers know that IFTLE is always on the lookout for the latest applications and the latest chips going into those