Women in Semiconductors: A Rising Tide Will Lift All Boats

Women in Semiconductors: A Rising Tide Will Lift All Boats


May 20, 2019    Amy Leong

Like most career women, balancing work and family life is a juggling act, leaving precious little time for hobbies. However, I’ve recently acquired quite a

A Non-Techie SemiSister Tackles The Elusive Semiconductor Language

A Non-Techie SemiSister Tackles The Elusive Semiconductor Language


May 16, 2019    Kate Roe

Not all SemiSisters are engineers. In fact, many of us joined this industry from a variety of career backgrounds with non-STEM educations including financial, business

3D Test: No Longer a Bottleneck!

3D Test: No Longer a Bottleneck!


May 15, 2019    Erik Jan Marinissen

When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits (ICs), there were only a

U2U 2019 Conference Dives into 2.5/3D IC Design

U2U 2019 Conference Dives into 2.5/3D IC Design


May 13, 2019    Herb Reiter

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User

IFTLE 413: Beware of Technology Hype for the Automotive Market

IFTLE 413: Beware of Technology Hype for the Automotive Market


May 10, 2019    Phil Garrou

As packaging practitioners/experts themselves, regular readers know that IFTLE is always on the lookout for the latest applications and the latest chips going into those

ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging

ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging


May 6, 2019    Francoise von Trapp

Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview post! This year’s event takes

ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options

ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options


May 6, 2019    Phil Garrou

At the recent IMAPS Device Packaging Conference in Fountain Hills, AZ. Kyung Suk (Dan) Oh, Package Development VP at Samsung, discussed “Electronics Packaging Technologies for

Be a Champion for Change – Highlights from the First SEMI Diversity and Inclusion Forum

Be a Champion for Change – Highlights from the First SEMI Diversity and Inclusion Forum


May 2, 2019    Ariana Raftopolous

Everyone found their seat as SEMI President and CEO, Ajit Manocha, took the stage to kick off the first SEMI Diversity and Inclusion Forum. Ajit

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation


May 1, 2019    Herb Reiter

In 1994 TSMC, a small wafer foundry from Taiwan held its first Technology Symposium. Since 1999 I have had the privilege to work with TSMC

Book Review: Advances in Embedded and Fan-out Wafer Level Packaging Technology

Book Review: Advances in Embedded and Fan-out Wafer Level Packaging Technology


April 30, 2019    Francoise von Trapp

When asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level Packaging Technology, I was a

IFTLE 411: Focus on the Sensor Technology Market

IFTLE 411: Focus on the Sensor Technology Market


April 25, 2019    Phil Garrou

At the recent IMAPS Device Packaging Conference, March 5-7, 2019 in Fountain Hills AZ, Benedetto Vigna, president of the ST Micro Analog, MEMS and Sensors

SemiSister Success Stories: Lena Nicolaides Turns Adversity into Opportunity

SemiSister Success Stories: Lena Nicolaides Turns Adversity into Opportunity


April 24, 2019    Francoise von Trapp

I first met Lena Nicolaides on a tour of KLA’s manufacturing area in 2015, just before the launch of the CIRCL™-AP. She had recently been

Could ON Semiconductor be GlobalFoundries’ White Knight?

Could ON Semiconductor be GlobalFoundries’ White Knight?


April 22, 2019    Francoise von Trapp

In light of recent rumors, could ON Semiconductor’s acquisition of GlobalFoundries’ East Fishkill fab save the company from being carved up further? The Basics Phoenix,

Advanced Heterogeneous Packaging Solutions for High Performance Computing

Advanced Heterogeneous Packaging Solutions for High Performance Computing


April 18, 2019    Ron Huemoeller

Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial

Update on  3D X-ray and DBI Technology for Advanced and 3D Packaging

Update on 3D X-ray and DBI Technology for Advanced and 3D Packaging


April 16, 2019    Herb Reiter

The Microelectronics Packaging & Test Engineering Council (MEPTEC) held its monthly meeting at SEMI in Milpitas on April 10.  Two speakers outlined their companies’ capabilities

IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging

IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging


April 15, 2019    Phil Garrou

Silicon Carbide (SiC) is a wide bandgap (WBG) material that has advantages when compared to silicon (Figure 1).  For the same die size and thickness,