Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow
Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is rapidly gaining popularity in the
TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem
Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into
Integrated Solid-state Capacitors Based on Carbon Nanostructure
The constant demand for miniaturization, added functionality and increased performance of electronic devices systematically drives higher integration by adding more devices on a single chip.
Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards
In the AMD-NVIDIA battle, System Plus Consulting’s experts continue to pursue innovation and monitor progress. At the beginning of the year, AMD was pleased to
Temporary Bonding and Debonding Technologies for Fan-out Wafer-Level Packaging
Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within an affordable package. It enables
EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received multiple
Fan-out Packaging Confirms its Success Story
Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole). Will
Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System
Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor
Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017
Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable
Technology Showcase Finalists Revealed for European MEMS & Sensors Summit
GRENOBLE, France ─ August 28, 2017 – SEMI®, with its Strategic Association partner MEMS & Sensors Industry Group® (MSIG), today announced its shortlist of competitors
MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE
North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be
Plasma-Therm and Trymax Partner to Distribute Resist Ashing Products in North America
ST. PETERSBURG, Florida and NIJMEGEN, The Netherlands (Aug. 15, 2017) – Plasma-Therm LLC, and Trymax Semiconductor Equipment BV, announced today that they have entered into
New Solution for Testing Chips Prior to 3D Stacking
Stacking chips on top of each other (aka 3D stacking) is a well-known approach to make more compact and powerful systems. Until now, it was
Will Fully Autonomous Vehicles Solve Global Transportation Problems?
Automotive electronics, with the Holy Grail being fully autonomous vehicles, is currently being touted as one of the biggest growth drivers for the semiconductor industry.
MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing
BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a
3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law
In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS
