The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory


May 23, 2017    Andrew Walker

Data is now the world’s most valuable resource. Solid-state data storage of data driving an innovation revolution built upon 50 years of progress. Here we

SMIC Signs License Agreement For Invensas’ DBI Technology

SMIC Signs License Agreement For Invensas’ DBI Technology


May 22, 2017    Invensas Corporation

Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide


May 17, 2017    EV Group

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16,

Are Glass Substrates the Next Option for Fan-out Packaging?

Are Glass Substrates the Next Option for Fan-out Packaging?


May 16, 2017    John Lau

As you all may know, in most fan-out wafer level packages (FOWLP) such as embedded wafer level ball grid array (eWLB) by Infineon and STATS

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer


May 10, 2017    Francoise von Trapp

It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the 2017 3D InCites Awards. The

UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems

UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems


May 9, 2017    UnitySC

Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer

Multiple Orders for Rudolph’s Firefly Inspection System Marks Early Success

Multiple Orders for Rudolph’s Firefly Inspection System Marks Early Success


May 4, 2017    Rudolph Technologies

 Wilmington, Mass. (May 1, 2017) Rudolph Technologies, Inc. (NYSE: RTEC) announced today that two of the industry’s leading suppliers of advanced packaging services have purchased

Meet Us at ECTC 2017 in Walt Disney World

Meet Us at ECTC 2017 in Walt Disney World


May 2, 2017    Francoise von Trapp

As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA


April 18, 2017    Herb Reiter

The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very important, but a relatively small

The Advancement of Device Packaging – A Resume on IMAPS DPC 2017

The Advancement of Device Packaging – A Resume on IMAPS DPC 2017


April 17, 2017    Peter Ramm

As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised – the largest conference dedicated

Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices

Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices


April 14, 2017    Pascal Couderc

More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is being driven by the consumer

TechSearch International Analyzes High-Performance Package Trends

TechSearch International Analyzes High-Performance Package Trends


April 12, 2017    TechSearch International, Inc.

A variety of alternatives is challenging silicon’s role in advanced packaging interposers for high-performance package applications. The first applications using silicon interposers with through silicon

IMAPS DPC 2017 Covers Range of High-tech Topics, Including EDA

IMAPS DPC 2017 Covers Range of High-tech Topics, Including EDA


April 11, 2017    Herb Reiter

The WeKoPa Resort near Phoenix was the venue for the latest IC packaging focused conference, IMAPS DPC 2017, which took place in early March. The

Equipment &  Materials for Fan-out: What is the Impact of On Manufacturing Markets?

Equipment & Materials for Fan-out: What is the Impact of On Manufacturing Markets?


April 11, 2017    YOLE DEVELOPPEMENT

2016 was a turning point for fan-out (FO) packaging. With Apple’s entrance and its subsequent decision to package its A10 APE in TSMC’s fan-out solution,

Advanced Packaging Industry: What We Can Expect in 2017…

Advanced Packaging Industry: What We Can Expect in 2017…


April 10, 2017    YOLE DEVELOPPEMENT

2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.“And

The Advanced Packaging Times, they are A-Changing…or Are They?

The Advanced Packaging Times, they are A-Changing…or Are They?


April 5, 2017    Francoise von Trapp

It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had plenty of time to mull