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ECTC 2020 Keynote: Moore’s Law 2.0 Brought to You by HIT
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately,...
EDA and the Heterogeneous Integration Roadmap
In Austria, where I grew up, homes get passed on from generation to generation. Like many Austrians, I had a...
Stay Virtually Connected with Your Industry Colleagues and Favorite Topics at ECTC 2020
On behalf of the entire Program and Executive Committees, it is my pleasure to invite and welcome all of you...
Chiplets: The New Era Begins
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important....
Heterogeneous Integration Technologies for Moore’s Law 2.0 and Beyond
Despite travel restrictions due to the Coronavirus, Dr. Douglas Yu, Vice President of R&D for TSMC gave a keynote via...
Heterogeneous Integration Technology Gets its Own Competence Center
The team at EV Group has done it again. They looked around at where the microelectronics industry is headed, identified...
Is The HIR the Best Path to Increased Revenues?
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry...
Big Data, Speed and Security Dominate DesignCon 2020
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January...
IMAPS 2019: Stalled Scaling Begets AI Opportunities For Heterogeneous Integration
Chiplets and 5G were a kind of buy-in to play at the IMAPS 2019 Symposium high-stakes table last week in...
Heterogeneous Integration Component Flavors SEMI ASMC 2019
“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and...Community Members
