IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP

IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP


February 14, 2019    Phil Garrou

In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR – 1µm RDL Ultratech, IMEC

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio


February 14, 2019    Veeco

 Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent, wet process tool and

MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies

MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies


February 11, 2019    Heidi Hoffman

This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging

How Do We Entice Young Women to Pursue Careers in Microelectronics & Packaging?

How Do We Entice Young Women to Pursue Careers in Microelectronics & Packaging?


February 7, 2019    Francoise von Trapp

If what is expressed during ongoing discussions on gender diversity and inclusion at semiconductor and packaging industry events is true, then the overarching belief is

3D Integration Enables More than Moore Technologies

3D Integration Enables More than Moore Technologies


February 6, 2019    Paul Lindner

Looking back at the last 10 years, it is very difficult to choose one single event that was the most pivotal for commercializing 3D integration

DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging

DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging


February 4, 2019    Herb Reiter

Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing printed circuit board (PCB) and

Advice on Gender Diversity and Inclusion from the Trenches

Advice on Gender Diversity and Inclusion from the Trenches


February 1, 2019    Francoise von Trapp

From the semiconductor industry panels on gender diversity and inclusion and networking receptions to casual lunches and one-on-one interviews, I’ve been listening to women of

IFTLE 403: TSMC 4th Generation CoWoS; 2018 Singapore EPTC Part 1

IFTLE 403: TSMC 4th Generation CoWoS; 2018 Singapore EPTC Part 1


January 31, 2019    Phil Garrou

Heterogeneous Integration spurs demand for 3D backend solutions Julian Ho reported in the Jan 10th issue of Digitimes that heterogeneous integration of diverse semiconductor components to

Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration

Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration


January 28, 2019    Don Draper

The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous integration, quantum computing, and wide

3D ICs Eliminate the Memory Wall

3D ICs Eliminate the Memory Wall


January 24, 2019    Jan Vardaman

The adoption of 3D ICs allowed the elimination of the “Memory Wall” using a new memory architecture and through silicon via (TSV) technology. While individual

Probe Test for 3D Integration: A Thousand Mile Journey

Probe Test for 3D Integration: A Thousand Mile Journey


January 22, 2019    Amy Leong

When we look back at the last 10 years, it’s really been a series of baby steps to move the commercialization of 3D integration technologies

ISS 2019 Continued: Facing New Challenges and Opportunities

ISS 2019 Continued: Facing New Challenges and Opportunities


January 21, 2019    Herb Reiter

Just in case you didn’t have a chance yet to read part 1 of the ISS 2019 blog, covering day 1, it’s posted here. Technology

IFTLE 402: Advanced Packaging Underfills; JEDEC Updates HBM Memory Standard; Intel Foundry Business

IFTLE 402: Advanced Packaging Underfills; JEDEC Updates HBM Memory Standard; Intel Foundry Business


January 16, 2019    Phil Garrou

Continuing our look at presentations from the recent 2018 IWLPC conference, let’s look at the Jiw Pai Henkel presentation on advanced packaging underfills. Henkel –

ISS 2019: Semiconductor Industry Faces New Challenges and Opportunities

ISS 2019: Semiconductor Industry Faces New Challenges and Opportunities


January 15, 2019    Herb Reiter

SEMI held its annual Industry Strategy Symposium (ISS 2019) at the Ritz Carlton in Halfmoon Bay, CA January 6-9, 2019. Many high-level executives represented key

Optimizing Your SoC or ASIC to Design PCBs More Cost Effectively

Optimizing Your SoC or ASIC to Design PCBs More Cost Effectively


January 14, 2019    MentorPCB

Shrinking silicon process nodes and increasing memory demands are a nightmare for PCB design teams working with custom ASICs or SoCs on high-performance systems. Huge

3D Powered: From Image Sensors to Artificial Intelligence

3D Powered: From Image Sensors to Artificial Intelligence


January 11, 2019    Paul Werbaneth

The widespread deployment of 3D stacked CMOS Image Sensors (CIS) in consumer electronics, namely smartphones, by handset makers domestic (Apple, iPhone) and overseas (Samsung, Galaxy),