Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA


April 18, 2017    Herb Reiter

The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very important, but a relatively small

The Advancement of Device Packaging – A Resume on IMAPS DPC 2017

The Advancement of Device Packaging – A Resume on IMAPS DPC 2017


April 17, 2017    Peter Ramm

As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised – the largest conference dedicated

Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices

Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices


April 14, 2017    Pascal Couderc

More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is being driven by the consumer

TechSearch International Analyzes High-Performance Package Trends

TechSearch International Analyzes High-Performance Package Trends


April 12, 2017    TechSearch International, Inc.

A variety of alternatives is challenging silicon’s role in advanced packaging interposers for high-performance package applications. The first applications using silicon interposers with through silicon

IMAPS DPC 2017 Covers Range of High-tech Topics, Including EDA

IMAPS DPC 2017 Covers Range of High-tech Topics, Including EDA


April 11, 2017    Herb Reiter

The WeKoPa Resort near Phoenix was the venue for the latest IC packaging focused conference, IMAPS DPC 2017, which took place in early March. The

Equipment &  Materials for Fan-out: What is the Impact of On Manufacturing Markets?

Equipment & Materials for Fan-out: What is the Impact of On Manufacturing Markets?


April 11, 2017    YOLE DEVELOPPEMENT

2016 was a turning point for fan-out (FO) packaging. With Apple’s entrance and its subsequent decision to package its A10 APE in TSMC’s fan-out solution,

Advanced Packaging Industry: What We Can Expect in 2017…

Advanced Packaging Industry: What We Can Expect in 2017…


April 10, 2017    YOLE DEVELOPPEMENT

2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.“And

The Advanced Packaging Times, they are A-Changing…or Are They?

The Advanced Packaging Times, they are A-Changing…or Are They?


April 5, 2017    Francoise von Trapp

It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had plenty of time to mull

MEMS  Ascendant at IMAPS Device Packaging 2017

MEMS Ascendant at IMAPS Device Packaging 2017


March 29, 2017    Paul Werbaneth

Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at the recent IMAPS Device Packaging

Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging

Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging


March 27, 2017    Amy P. Lujan

In recent years, there has been an increased focus on fan-out wafer level packaging. While fan-out wafer level packaging may be the right solution for

Highlights of the 23rd TSMC Symposium

Highlights of the 23rd TSMC Symposium


March 21, 2017    Herb Reiter

On March 15, 2017, TSMC held its 23rd Symposium, based on popular request, at the Santa Clara Convention Center. I had the opportunity to attend

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT


March 21, 2017    admin

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today

Executive Viewpoint: Next-Gen Drone Technologies Rely on Semiconductor Innovation

Executive Viewpoint: Next-Gen Drone Technologies Rely on Semiconductor Innovation


March 20, 2017    Francoise von Trapp

Robotics and drone technologies are one of the fastest growing end-use markets for integrated sensor technology today. According to a 2016 Yole Développement market report,

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform


March 14, 2017    UnitySC

Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced

Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!

Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!


March 13, 2017    Francoise von Trapp

Here we go again! One thing is for sure, there is never a dull moment at the IMAPS Device Packaging Conference panel sessions. (Remember the

EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging

EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging


March 8, 2017    EV Group

FLORIAN, Austria, March 8, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled