3D Integration 101: Explore, Learn, Share

The semiconductor industry could learn a few things from Santa’s elves. How about devices that package themselves? These guys may be onto something. Check it

Moore’s law is increasingly difficult to maintain and is driving the growth of innovative, high-density advanced packaging technologies in response to system scaling demands. These

At the Intel “architecture day” held Dec 12th in Santa Clara, Intel finally announced what some of us have been waiting for, literally for over

NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an effective and versatile cleaning agent,

Who was Madeline on Halloween? Before we start more tech coverage of IMAPS 2018 with a look at polymer dielectric advancements, long time readers know

This was my first Electronica, and all I can say is – It is massive. It covered everything to do with the electronics supply chain,

SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment,

The challenge of designing smaller, cost-effective systems that require additional processing and performance power led to 3D chip stacking of bare die and a new

In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS and sensors, two on advanced

Samsung at the Leading Edge At the recent Samsung Tech Day, the company unveiled several new technologies: Their 7nm extreme ultraviolet (EUV) process node from Samsung’s

Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro

Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry experts

The competition was fierce and the stakes high for the annual MSEC 2018 technology showcase. which took place during the MEMS and Sensors Executive Congress,

At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at the DoubleTree Hotel in San

Just over a year ago, Napa Valley was in flames, and the annual MEMS and Sensors Executive Congress (MSEC) had to be relocated from the

With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have pulled