Covering 3D IC technology and heterogeneous integration

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Event Coverage

Semiconductor Companies Participate in the 4th China International Import Expo

The 4th CIIE was held successfully, let’s see which semiconductor...

SEMICON Europa Member Preview

SEMICON Europa is back! On the agenda? The latest innovations...

IMAPS 2021 Community Member Preview

The IMAPS 2021 program is set to be knowledge-packed, offering...

Upcoming Events

Environmental Sustainability and Flexible & Printed Electronics Master Class

Dec 1, 2021

WEBINAR: Bonding Solutions for Next-Generation Advanced Packaging

Dec 2, 2021

Does Phase-Shift Profilometry Improve Inspection of 3D ICs?

The semiconductor packaging industry continues to advance, with new designs...

Advanced Packaging Shifts Design Focus To System Level – SemiEngineering

Partitioning and floor-planning become big challenges. What goes on which...

The Democratization of Chip Design – EE Times

A look at how the open-source silicon movement is expanding...

CyberOptics Wins Prestigious GLOBAL Technology Award for WX3000 Metrology and Inspection System

Minneapolis, Minnesota — November 17, 2021 — CyberOptics® Corporation (NASDAQ:...

Veeco Ships First Laser Annealing System from New San Jose Manufacturing Facility Designed to Serve the Semiconductor Market

Plainview, N.Y., November 22, 2021—Veeco Instruments Inc. (NASDAQ: VECO) today...

EV Group Brings High-speed High-precision Metrology to 3D Heterogeneous Integration

EVG®40 NT2 offers breakthrough metrology performance to accelerate implementation of ...

Trending Topic

#advanced packaging View all

IFTLE 500: We’ve Come a Long Way, Baby!

Oct 14, 2021 · By Phil Garrou · Blogs

IFTLE (Insights From the Leading Edge), believe it or not, has reached #500! I hope this message reaches all of...

How Can We Tap into $52 Billion to Reshore Advanced Packaging?

Aug 23, 2021 · By Francoise von Trapp · Blogs

One of the things that are missing from virtual events is the candid conversations we engage in when we meet...

ESiPAT-TC Team Prepping for Successful In-Person Event

Aug 12, 2021 · By Trine Pierik · 3D Event Coverage

Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in...