Electromagnetic Simulation for Electronic Systems

Electromagnetic Simulation for Electronic Systems


December 6, 2017    admin-impress

Packages and boards are playing an increasing role as a way to increase speed and density while reducing power and form factor of electronic systems.

The Truth About Moore’s Law is Revealed at 3D ASIP 2017

The Truth About Moore’s Law is Revealed at 3D ASIP 2017


December 11, 2017    Francoise von Trapp

I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference


December 6, 2017    Francoise von Trapp

Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced

A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope

A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope


November 30, 2017    Peter Ramm

Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days during which we honored Gilles

TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential


November 28, 2017    TechSearch International, Inc.

Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP

When It Comes to Robots and AI, We Draw the Line at Beer

When It Comes to Robots and AI, We Draw the Line at Beer


November 27, 2017    Francoise von Trapp

As one of the current key drivers of the semiconductor industry, the development of robots with artificial intelligence has been on my mind quite a

The Future of Automotive Electronics from the European Perspective

The Future of Automotive Electronics from the European Perspective


November 23, 2017    Francoise von Trapp

From the keynotes to the sessions to casual conversation, automotive electronics was a hot topic of discussion at SEMICON Europa 2017. That’s likely because Europe

SEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper

SEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper


November 22, 2017    Francoise von Trapp

I remember the day I became Queen of 3D like it was yesterday: It was 2007 and I was attending my very first SEMICON Europa,

Merck Brings Material Solutions to the Automotive Industry

Merck Brings Material Solutions to the Automotive Industry


November 17, 2017    Merck KGAA

Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation automotive applications. Future automotive requires

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System


November 14, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA

Technical Tidbits from IWLPC and MSEC 2017

Technical Tidbits from IWLPC and MSEC 2017


November 8, 2017    Francoise von Trapp

It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)


November 7, 2017    Francoise von Trapp

One of the things I like best about the annual MEMS and Sensors Executive Congress (MSEC17) hosted by SEMI-MSIG, is being in the presence of

Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?

Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?


November 6, 2017    Francoise von Trapp

I’ve often found it somewhat ironic that those responsible for dreaming up and building the technologies that made smart devices, cities, cars, and factories possible,

The Memory Packaging Market Shows Steady Growth

The Memory Packaging Market Shows Steady Growth


November 3, 2017    YOLE DEVELOPPEMENT

The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135

MEMS Packaging Market is Growing Faster Than The MEMS Devices Market

MEMS Packaging Market is Growing Faster Than The MEMS Devices Market


November 2, 2017    YOLE DEVELOPPEMENT

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1]

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies


October 31, 2017    aveni

PARIS, FRANCE–(Marketwired – Oct 24, 2017) – aveni S.A., developer and manufacturer of market disrupting wet deposition technologies and chemistries for 2D interconnects and 3D