Electromagnetic Modeling of Three-dimensional Integrated Circuits

Electromagnetic Modeling of Three-dimensional Integrated Circuits


October 31, 2017    MentorPCB

Three-dimensional Integrated circuits (3DIC) are generating increased interest as a way to increase speed and density while reducing power and form factor. System level integration

The Future of Automotive Electronics from the European Perspective

The Future of Automotive Electronics from the European Perspective


November 23, 2017    Francoise von Trapp

From the keynotes to the sessions to casual conversation, automotive electronics was a hot topic of discussion at SEMICON Europa 2017. That’s likely because Europe

SEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper

SEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper


November 22, 2017    Francoise von Trapp

I remember the day I became Queen of 3D like it was yesterday: It was 2007 and I was attending my very first SEMICON Europa,

Merck Brings Material Solutions to the Automotive Industry

Merck Brings Material Solutions to the Automotive Industry


November 17, 2017    Merck KGAA

Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation automotive applications. Future automotive requires

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System


November 14, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA

Technical Tidbits from IWLPC and MSEC 2017

Technical Tidbits from IWLPC and MSEC 2017


November 8, 2017    Francoise von Trapp

It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)


November 7, 2017    Francoise von Trapp

One of the things I like best about the annual MEMS and Sensors Executive Congress (MSEC17) hosted by SEMI-MSIG, is being in the presence of

Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?

Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?


November 6, 2017    Francoise von Trapp

I’ve often found it somewhat ironic that those responsible for dreaming up and building the technologies that made smart devices, cities, cars, and factories possible,

The Memory Packaging Market Shows Steady Growth

The Memory Packaging Market Shows Steady Growth


November 3, 2017    YOLE DEVELOPPEMENT

The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135

MEMS Packaging Market is Growing Faster Than The MEMS Devices Market

MEMS Packaging Market is Growing Faster Than The MEMS Devices Market


November 2, 2017    YOLE DEVELOPPEMENT

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1]

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies


October 31, 2017    aveni

PARIS, FRANCE–(Marketwired – Oct 24, 2017) – aveni S.A., developer and manufacturer of market disrupting wet deposition technologies and chemistries for 2D interconnects and 3D

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017


October 27, 2017    Francoise von Trapp

To the best of my recollection (and a quick search through 3D InCites’ archives) the panel level packaging (PLP) hoopla first hit the conference circuit

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.


October 23, 2017    UnitySC

Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Sir Walter Raleigh towered above the 50th IMAPS Symposium


October 19, 2017    Herb Reiter

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices


October 16, 2017    imec

LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and Analog Devices, Inc. (ADI), the

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy


October 9, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and SwissLitho AG, a manufacturer of