Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits


August 16, 2018    Francoise von Trapp

For the second consecutive year, SEMI Europe is co-locating its MEMS and Sensors/Imaging and Sensors Summits in Grenoble, France, in the heart of the Rhone-Alpes.

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story


August 13, 2018    Francoise von Trapp

The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging


August 6, 2018    John Lau

Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging,”

TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications


August 2, 2018    TechSearch International, Inc.

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies


August 2, 2018    Invensas Corporation

SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading global semiconductor foundry, UMC. This

Striking the Right Chord for Chiplet Integration

Striking the Right Chord for Chiplet Integration


July 30, 2018    Amin Shokrollahi

The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total

It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018

It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018


July 25, 2018    Francoise von Trapp

Emerging technologies like artificial intelligence (AI), machine learning (ML) are driving more than just the semiconductor market. They also drove the conversations I had with

Volumes Matter and Other Conversations from SEMICON West 2018

Volumes Matter and Other Conversations from SEMICON West 2018


July 25, 2018    Francoise von Trapp

The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things (IoT) devices. And suddenly, semiconductors

Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems

Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems


July 24, 2018    Veeco

PLAINVIEW, New York, July 9, 2018 – Veeco Instruments Inc. (Nasdaq: VECO) today announced that one of the world’s leading memory chip manufacturers has ordered

SEMICON West Confirms:  AI is the New Killer-app for Semiconductors

SEMICON West Confirms:  AI is the New Killer-app for Semiconductors


July 24, 2018    Herb Reiter

SEMICON West (San Francisco, July 10 to 12) confirmed that our industry’s rapid growth will continue. Machine learning (ML) and artificial intelligence (AI) will be

Why We need Lower Cost TSVs and How to Get Them

Why We need Lower Cost TSVs and How to Get Them


July 19, 2018    Francoise von Trapp

Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between dies at extremely low power

What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?

What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?


July 16, 2018    Francoise von Trapp

The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should

SEMICON West 2018: Smart Starts Where?

SEMICON West 2018: Smart Starts Where?


July 13, 2018    Francoise von Trapp

Well, that was interesting. SEMICON West 2018 just wrapped up, and I’m not quite sure what just happened. This year’s event was… for lack of

3D InCites Top Picks for SEMICON West 2018

3D InCites Top Picks for SEMICON West 2018


July 6, 2018    Francoise von Trapp

Ok folks. It’s that time of year again. SEMICON West 2018 is upon us. By the time you read this – IF you get the

DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain

DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain


July 3, 2018    Herb Reiter

This year’s Design Automation Conference (DAC 2018) was held at Moscone West, San Francisco, CA. On three levels, about 175 exhibitors showed their capabilities and

An Update on the Fan-out Panel-Level Packaging Consortium

An Update on the Fan-out Panel-Level Packaging Consortium


July 2, 2018    Francoise von Trapp

One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out panel-level packaging (FOPLP).  In