What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?

What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?


July 16, 2018    Francoise von Trapp

The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should

SEMICON West 2018: Smart Starts Where?

SEMICON West 2018: Smart Starts Where?


July 13, 2018    Francoise von Trapp

Well, that was interesting. SEMICON West 2018 just wrapped up, and I’m not quite sure what just happened. This year’s event was…. For lack of

3D InCites Top Picks for SEMICON West 2018

3D InCites Top Picks for SEMICON West 2018


July 6, 2018    Francoise von Trapp

Ok folks. It’s that time of year again. SEMICON West 2018 is upon us. By the time you read this – IF you get the

DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain

DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain


July 3, 2018    Herb Reiter

This year’s Design Automation Conference (DAC 2018) was held at Moscone West, San Francisco, CA. On three levels, about 175 exhibitors showed their capabilities and

An Update on the Fan-out Panel-Level Packaging Consortium

An Update on the Fan-out Panel-Level Packaging Consortium


July 2, 2018    Francoise von Trapp

One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out panel-level packaging (FOPLP).  In

TechSearch International Analyzes Potential for 3D Sensing Modules

TechSearch International Analyzes Potential for 3D Sensing Modules


July 2, 2018    TechSearch International, Inc.

Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection, gesture control, automotive/industrial 3D mapping,

Transforming the Fan-out Landscape

Transforming the Fan-out Landscape


June 26, 2018    Francoise von Trapp

These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple’s A10 processor built on TSMCs integrated fan-out (InFO)

Tech Round-up from ECTC 2018

Tech Round-up from ECTC 2018


June 13, 2018    Francoise von Trapp

For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather than the technology corner, as

Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…

Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…


June 12, 2018    Francoise von Trapp

Despite a valiant effort by the ECTC committee to integrate design topics into this year’s agenda, the number of empty seats spoke volumes: Including two

Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology

Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology


June 11, 2018    Francoise von Trapp

The special Tuesday session at ECTC 2018 took a look at new methods and applications for assembly technology to accommodate the needs of heterogeneous integration

Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018

Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018


June 9, 2018    Francoise von Trapp

There’s fact, and there’s perception. The messages people carry away from conferences are not only influenced by what they hear from the speakers, but also

Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively


June 7, 2018    MentorPCB

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s

Thermal Metamaterials for Advanced Packaging Applications from Stanford University

Thermal Metamaterials for Advanced Packaging Applications from Stanford University


May 11, 2018    Paul Werbaneth

Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials with low thermal conductivity also

Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry

Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry


May 8, 2018    Francoise von Trapp

Bitcoin, a cryptocurrency built on blockchain, has become one of the hottest topics to hit the semiconductor news feeds and the conference circuit since the

2018 TSMC Technology Symposium: Listen – Analyze – Act

2018 TSMC Technology Symposium: Listen – Analyze – Act


May 3, 2018    Herb Reiter

May 1st is a holiday in many countries, but not in the U.S. and not for TSMC. A very professional TSMC team and many of

Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 


Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 



May 2, 2018    Francoise von Trapp

Digital imaging has come a long way since its first consumer implementation in digital cameras to replaced film cameras in the early 21st century. In