TSMC Announces SoC Design in the Cloud at the OIP 2018 Ecosystem Forum

TSMC Announces SoC Design in the Cloud at the OIP 2018 Ecosystem Forum


October 11, 2018    Herb Reiter

As I prepared to attend TSMC’s OIP 2018 Forum on October 3, 2018 two emails from TSMC caught my attention. They conveyed the news that

How Do We Create Smart Cities Without Exploiting Personal Data?

How Do We Create Smart Cities Without Exploiting Personal Data?


October 9, 2018    Francoise von Trapp

Creating smart cities while also protecting the personal data of its citizens is no easy task these days, particularly with growing public awareness and concern

Dr. Phil Garrou Makes the Move to 3D InCites

Dr. Phil Garrou Makes the Move to 3D InCites


October 8, 2018    Francoise von Trapp

Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites as contributing editor and as

Ain’t No Mountain High Enough to Keep Rozalia Beica From Success

Ain’t No Mountain High Enough to Keep Rozalia Beica From Success


October 5, 2018    Francoise von Trapp

“Driven” doesn’t even begin to describe Romanian-born Rozalia Beica, global director, strategic marketing, DowDupont. Neither rain, nor sleet, nor whizzing bullets overhead can keep this

SEMI’s Strategic Materials Conference Calls for Supply Chain Cooperation

SEMI’s Strategic Materials Conference Calls for Supply Chain Cooperation


October 3, 2018    Herb Reiter

The message remains consistent: following Moore’s Law is no longer economical for most IC designs. A major part of the IC value creation is moving

3D VLSI is the New Active Interposer

3D VLSI is the New Active Interposer


October 1, 2018    Francoise von Trapp

 3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on the scene as monolithic 3D

Will Fully-Autonomous Vehicles Ever Take Over Our Roads?

Will Fully-Autonomous Vehicles Ever Take Over Our Roads?


September 26, 2018    Francoise von Trapp

At the 2018 European MEMS, Imaging and Sensors Summits, I detected a shift in sentiment around the likelihood (and the feasibility) that fully-autonomous vehicles are

MEMS, Imaging, and Sensors Summits Show The Power of Collaboration

MEMS, Imaging, and Sensors Summits Show The Power of Collaboration


September 25, 2018    Francoise von Trapp

Last week, at the co-located 2018 European MEMS and Sensors/Imaging and Sensors Summits, held in Grenoble, France, I had the pleasure of gathering with 380

Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It

Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It


September 13, 2018    Francoise von Trapp

It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has

Package Designers Need Assembly-level LVS Signoff for HDAP Verification

Package Designers Need Assembly-level LVS Signoff for HDAP Verification


September 1, 2018    MentorPCB

While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity issues, such as missing or

Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge

Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge


August 29, 2018    Francoise von Trapp

Throughout my years of writing about the semiconductor industry, I’ve met women from all over the world. I’ve often wondered what or who encouraged them

Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology

Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology


August 27, 2018    Francoise von Trapp

It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer level packaging (WLP) and heterogeneous

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits


August 16, 2018    Francoise von Trapp

For the second consecutive year, SEMI Europe is co-locating its MEMS and Sensors/Imaging and Sensors Summits in Grenoble, France, in the heart of the Rhone-Alpes.

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story


August 13, 2018    Francoise von Trapp

The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging


August 6, 2018    John Lau

Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging,”

TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications


August 2, 2018    TechSearch International, Inc.

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages