3D Integration 101: Explore, Learn, Share

A few thousand semiconductor experts, including many high-level executives, got together on December 5, 2019, celebrate the Global Semiconductor Alliance’s (GSA) 25th Anniversary at the

Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry

“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology &

The IMAPS International Symposium took place this year in Boston. Let’s take a look at a few of the more interesting presentations that were given

From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation Summit at the DoubleTree Hotel

“We believe that materials science changes the world,” declared Indium Corporation’s Andy Mackie during our recent sit-down together at IMAPS 2019 in Boston, MA. Even

The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON

What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously,

Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial intelligence (AI) and high-performance computing

High-performance computing (HPC) has become an important tool for areas that generate high volumes of data. While today’s HPC is already powerful, many scientific and industrial challenges require even more computing power, for instance, drug discovery and material design. Thus, the global drive for exascale (1018) computing.

Severine Cheramy, Director 3D Business Development, at CEA-Leti, recently brought key partners of Leti’s 3D-IC programs together at the 6th 3D VLSI Open Workshop to

Tomorrow evening (Nov. 7, 2019), Dr. Mary Jane Irwin will take the stage at a dinner being held in her honor, as she becomes the

We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to

Co-located with productronica in Munich, Germany, SEMICON Europa attracts and connects industry-leading technology companies from every segment of the European microelectronics industry. Held November 12-15, this year’s

“The die-attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole