Solving the Design and Verification Challenges of High Density Advanced Packaging

Solving the Design and Verification Challenges of High Density Advanced Packaging


August 14, 2017    MentorPCB

Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve product quality and design efficiency



Will Fully Autonomous Vehicles Solve Global Transportation Problems?

Will Fully Autonomous Vehicles Solve Global Transportation Problems?


August 18, 2017    Francoise von Trapp

Automotive electronics, with the Holy Grail being fully autonomous vehicles, is currently being touted as one of the biggest growth drivers for the semiconductor industry.



MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing


August 18, 2017    MRSI Systems

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a



3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law


August 15, 2017    Eric Beyne

In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS



IMAPS 2017 SiP Conference Takes on Sonoma

IMAPS 2017 SiP Conference Takes on Sonoma


August 10, 2017    Herb Reiter

California’s Wine Country attracts visitors from all over the world. They can enjoy the scenic countryside, historic places, golf courses, tennis courts, gambling and of



MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained

MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained


August 7, 2017    John Lau

Multichip module (MCM),  system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least, a book



Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions

Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions


August 4, 2017    Herb Reiter

I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for faster production ramp-ups, will force



Mission Impossible? Not for SEMI!

Mission Impossible? Not for SEMI!


August 3, 2017    Herb Reiter

San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at this picture of the South



EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan


August 3, 2017    EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating



Xperi Sets Out to Enable Immersive Experiences

Xperi Sets Out to Enable Immersive Experiences


July 31, 2017    Francoise von Trapp

Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was Tessera, well-known throughout the advanced



The Brighter Side of SEMICON West 2017

The Brighter Side of SEMICON West 2017


July 27, 2017    Francoise von Trapp

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was



SEMICON West 2017: The Semiconductor Industry at a Young 50

SEMICON West 2017: The Semiconductor Industry at a Young 50


July 26, 2017    Paul Werbaneth

The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over again during SEMICON West 2017



Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)


July 24, 2017    Francoise von Trapp

In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions during SEMICON West 2017. For



TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends


July 20, 2017    TechSearch International, Inc.

Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion



EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging


July 19, 2017    Amber Leann

  Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio of materials solutions for advanced



2017 3D InCites Awards Ceremony and Reception: A Retrospective

2017 3D InCites Awards Ceremony and Reception: A Retrospective


July 19, 2017    Francoise von Trapp

Once again this year, the industry came out in full force to honor excellence in heterogeneous integration at the 2017 3D InCites Awards Ceremony and