Tech Round-up from ECTC 2018

Tech Round-up from ECTC 2018


June 13, 2018    Francoise von Trapp

For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather than the technology corner, as

Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…

Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…


June 12, 2018    Francoise von Trapp

Despite a valiant effort by the ECTC committee to integrate design topics into this year’s agenda, the number of empty seats spoke volumes: Including two

Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology

Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology


June 11, 2018    Francoise von Trapp

The special Tuesday session at ECTC 2018 took a look at new methods and applications for assembly technology to accommodate the needs of heterogeneous integration

Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018

Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018


June 9, 2018    Francoise von Trapp

There’s fact, and there’s perception. The messages people carry away from conferences are not only influenced by what they hear from the speakers, but also

Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively


June 7, 2018    MentorPCB

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s

The Heterogeneous Integration Roadmap Explained by Bill Chen

The Heterogeneous Integration Roadmap Explained by Bill Chen


June 6, 2018    Francoise von Trapp

Festivities at ECTC 2018 kicked off May 29, 2018, with a full-day Heterogeneous Integration Roadmap (HIR) Workshop. This workshop was a continuation of an ongoing

ECTC 2018 Paves the Path to Heterogeneous Integration

ECTC 2018 Paves the Path to Heterogeneous Integration


June 5, 2018    Francoise von Trapp

For nine years, my fellow 3D InCites bloggers and I have been evangelizing about the wonders the microelectronics industry can achieve with innovations in 3D,

The Advanced Packaging Industry is on the Move

The Advanced Packaging Industry is on the Move


June 1, 2018    YOLE DEVELOPPEMENT

Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world

Thermal Metamaterials for Advanced Packaging Applications from Stanford University

Thermal Metamaterials for Advanced Packaging Applications from Stanford University


May 11, 2018    Paul Werbaneth

Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials with low thermal conductivity also

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets


May 8, 2018    UnitySC

Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity

Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry

Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry


May 8, 2018    Francoise von Trapp

Bitcoin, a cryptocurrency built on blockchain, has become one of the hottest topics to hit the semiconductor news feeds and the conference circuit since the

2018 TSMC Technology Symposium: Listen – Analyze – Act

2018 TSMC Technology Symposium: Listen – Analyze – Act


May 3, 2018    Herb Reiter

May 1st is a holiday in many countries, but not in the U.S. and not for TSMC. A very professional TSMC team and many of

Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 


Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 



May 2, 2018    Francoise von Trapp

Digital imaging has come a long way since its first consumer implementation in digital cameras to replaced film cameras in the early 21st century. In

There’s a Fan-out for That

There’s a Fan-out for That


April 24, 2018    Francoise von Trapp

Long gone are the days of the “killer app” and the notion that a single device market like personal computers (PCs) or smartphones alone can

The Future of Non-volatile Memory

The Future of Non-volatile Memory


April 11, 2018    Andrew Walker

Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above

Getting IC Package Design Right the First Time

Getting IC Package Design Right the First Time


April 10, 2018    Francoise von Trapp

Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated as it becomes more critical