We have another great conference coming up for the 3D InCites community! Taking place in Dallas, Texas from May 27-30, this year’s Electronic Components and Technology Conference (ECTC) is packed with member sessions and exhibits. We have 16 members presenting, 27 exhibiting, and even more attending. This conference is the most well-attended conference by the 3D InCites community, and if you scroll through this post, you’ll see that for yourself.
With four packed days, ECTC 2025 has much to offer. Four member companies will be hosting special sessions on Tuesday, May 27, detailing some of the latest innovations in advanced packaging and offering an exciting forum to come together. 3D InCites members will also be presenting four Professional Development Courses (PDCs) on topics like hybrid bonding, panel level packaging, fundamentals of fabrication, and advanced fan-out developments.
Kulicke & Soffa will also be presenting its own technical session on Wednesday, May 28 from 5:30-8:30 p.m. in room San Saba 4 at the Gaylord Texan Resort & Convention Center. To RSVP, please email kscontact@kns.com and see the full details below.
Like always, please be sure to stop by the 3D InCites booth to say hi! Francoise will be podcasting, and I would love to meet as many of you in-person as possible. In the meantime, we hope this serves as a useful guide to help plan your time at ECTC. If you’d like to schedule a formal meeting, please reach out to Francoise at francoise@3dincites.com, or to me at jmc@3dincites.com. We’re looking forward to it!
Special Sessions
Glass Core vs. RDL Interposers: Ready for Prime-Time?
- Tuesday, May 27 from 10:30 a.m. -12 p.m.
- Jan Vardaman, TechSearch International; Zia Kharim, Yield Engineering Systems
IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop
- This will include four technical sessions that span from the morning through the afternoon
- Tuesday, May 27
- William Chen, ASE
2025 ECTC Young Professional Networking Event
- Tuesday, May 27 from 6:45-7:45 p.m.
- Aakrati Jain, IBM
Advancements in mmWave and Sub-THz Packaging for Communication and Radar Applications
- Tuesday, May 27 from 3:30-5 p.m.
- Ivan Ndip, Fraunhofer IZM
HIR Session With Joint Participation by IPC: Components to System – Integration Needs, Gaps, Challenges, Solutions
- Tuesday, May 27 from 3:30-5 p.m.
- Gary Brist, Siemens EDA
Professional Development Courses
Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Advanced Interconnects
- Tuesday, May 27 from 8 a.m. – 12 p.m.
- Viorel Dragoi, EV Group
From Wafer to Panel Level Packaging
- Tuesday, May 27 from 8 a.m. – 12 p.m.
- Tanja Braun and Piotr Mackowiak, Fraunhofer IZM
Fundamentals of Fabrication Processes and RF Design of Advanced Packages Including Fan-Out Chiplets, Glass, and Polymer Interposer
- Tuesday, May 27 from 8 a.m. – 12 p.m.
- Ivan Ndip and Markus Wöhrmann, Fraunhofer IZM
Advanced Fan-Out Developments and Applications
- Tuesday, May 27 from 8 a.m. – 12 p.m.
- John Hunt and Jan Vardaman, TechSearch International
Interactive Sessions
Applying GA-NN and Explainable AI for IC Packaging Warpage Optimization: A Case Study on Product Feature
- Wednesday, May 28 from 10 a.m. – 12 p.m.
- Tang-Yuan Chen, Chen-Chao Wang, C. P. Hung, ASE
Fast and Accurate Machine Learning Prediction of BackEnd-Of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- Wednesday, May 28 from 10 a.m. – 12 p.m.
- Prabudhya Roy Chowdhury, Aakrati Jain, Dureseti Chidambarrao, Atsushi Ogino, Kartik Acharya, IBM
Comparison of Mechanical Response and Failure Characteristics of Selected SnAgCu-Based HighTemperature Solder Alloys
- Wednesday, May 28 from 10 a.m. – 12 p.m.
- Morgana Ribas, MacDermid Alpha
A Compact Dual Band (28/39 GHz) 1×4 Antenna Array Design With Frequency Selective Surface-base (FSS) for 5G AiP Applications
- Wednesday, May 28 from 2:30-4:30 p.m.
- Sheng-Chi Hsieh, ASE
Fabrication of D-band (140 GHz) Broadband Antenna Using Quartz Glass on Silicon Hybrid Bonded Wafer With Cavity
- Thursday, May 29 from 10 a.m. – noon
- Uwe Maaß, Alexander Gäbler, Ivan Ndip, Fraunhofer IZM
IR Laser Debonding for Silicon Based Temporary Carrier Systems Enabling 2.5D and 3D Chiplet Integration Processes
- Thursday, May 29 from 10 a.m. – noon
- Peter Urban, Simon Halas, Julian Bravin, Thomas Uhrmann, Markus Wimplinger, EV Group
Process Approaches to Enable 200 °C Hybrid Bonding With SiCN Bond Layer and 0.5 µm Pitch
- Thursday, May 29 from 10 a.m. – noon
- Taotao Ding, Barbara Weis, Gernot Probst, EV Group
Novel Fault Isolation Methodology Applied on Nano-Scale Defect in Fine Line RDL for Advanced Fan-Out Package
- Thursday, May 29 from 10 a.m. – noon
- Yi-Sheng Lin, Cheng-Hsin Liu, Chen-Chao Wang, C. P. Hung, Chun-Liang Kuo, Chia-Wen Hung, ASE
Improving the Uniformity of Cu Deposition in Fan-Out Panel Level Package With FEM Simulation Model
- Thursday, May 29 from 2:30-4:30 p.m.
- Yung-Sheng Lin, Min-Yan Tsai, Mingtzung Kuo, Ling-yuan Chang, Ping-Feng Yang, C. P. Hung, Chen-Chao Wang, ASE
Characterization of FOWLP Process Using Temporary Bonding Material on Carrier With Very Low Die Shift
- Thursday, May 29 from 2:30-4:30 p.m.
- Alice Guerrero, Brewer Science
Wafer-to-Wafer Bonding With Saddle-Shaped Wafers
- Thursday, May 29 from 2:30-4:30 p.m.
- Anton Alexeev, Thomas Plach, Taotao Ding, Markus Wimplinger, EV Group
Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- Thursday, May 29 from 2:30-4:30 p.m.
- Sathya Raghavan, Nicholas Polomoff, Katsuyuki Sakuma, IBM
High-Power Vapor Chambers With Hierarchical Dendritic Wick Structures for High-Performance Computing Systems
- Friday, May 30 from 10 a.m. – 12 p.m.
- Yu-Hsiang Chang, Hung-Hsien Huang, ChenChao Wang, C. P. Hung, ASE
Member Highlights
Amkor
Low Loss, High Reliability (LLHR) Package on a 650 mm x 650 mm Hybrid Panel-Level Package Platform
- Thursday, May 29 from 11:55 a.m. – 12:15 p.m.
- Eoin O’Toole, Jose Silva, Paulo Cardoso, Filipe Cardoso, Maria Bras, Jose Miguel Silva, Pedro Fernandes, Pedro Ferreira
ASE
IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop
- This will include four technical sessions that span from the morning through the afternoon
- Tuesday, May 27
- William Chen
Applying GA-NN and Explainable AI for IC Packaging Warpage Optimization: A Case Study on Product Feature
- Wednesday, May 28 from 10 a.m. – 12 p.m.
- Tang-Yuan Chen, Chen-Chao Wang, C. P. Hung
Advanced Numerical Modeling of Microstructure Effect on Fine Cu Redistribution Lines Under Electric Current Stressing
- Wednesday, May 28 from 11:55 a.m. – 12:15 p.m.
- Min-Yan Tsai, Yung-Sheng Lin, C. P. Hung, Chen-Chao Wang
A Compact Dual Band (28/39 GHz) 1×4 Antenna Array Design With Frequency Selective Surface-base (FSS) for 5G AiP Applications
- Wednesday, May 28 from 2:30-4:30 p.m.
- Sheng-Chi Hsieh
Novel Fault Isolation Methodology Applied on Nano-Scale Defect in Fine Line RDL for Advanced Fan-Out Package
- Thursday, May 29 from 10 a.m. – noon
- Yi-Sheng Lin, Cheng-Hsin Liu, Chen-Chao Wang, C. P. Hung, Chun-Liang Kuo, Chia-Wen Hung
Evolution of Advanced Packaging From FOWLP to FOPLP: Development of Fanout Chip Last With Embedded Bridge in 300 mm Panel
- Thursday, May 29 from 12:15-12:35 p.m.
- Smith Chen, Yung Shun Chang
Improving the Uniformity of Cu Deposition in Fan-Out Panel Level Package With FEM Simulation Model
- Thursday, May 29 from 2:30-4:30 p.m.
- Yung-Sheng Lin, Min-Yan Tsai, Mingtzung Kuo, Ling-yuan Chang, Ping-Feng Yang, C. P. Hung, Chen-Chao Wang, ASE
FOCoS-Bridge for Emerging Trends in High-Performance Computing
- Thursday, May 29 from 4:45-5:05 p.m.
- Smith Chen
High-Power Vapor Chambers With Hierarchical Dendritic Wick Structures for High-Performance Computing Systems
- Friday, May 30 from 10 a.m. – 12 p.m.
- Yu-Hsiang Chang, Hung-Hsien Huang, ChenChao Wang, C. P. Hung, ASE
Challenges and Solutions for Measuring Copper-Polymer Interfacial Adhesion Strength in RDL of Advanced Packaging
- Friday, May 30 from 4:25-4:45 p.m.
- Wu-Lung Wang, Hsin-Chih Shih, C. P. Hung, Chin-Li Kao, Chen-Chao Wang
Brewer Science
Hierarchical Multi-layer and Stacking Vias With Novel Structure by Transferable Cu/Polymer Hybrid Bonding for High Speed Digital Applications
- Wednesday, May 28 from 4:05-4:25 p.m.
- Chung-An Tan
Characterization of FOWLP Process Using Temporary Bonding Material on Carrier With Very Low Die Shift
- Thursday, May 29 from 2:30-4:30 p.m.
- Alice Guerrero
Deca Technologies
M-Series Fan-Out Interposer Technology (M-FIT) – Scaling up for HPC & AI
- Thursday, May 29 from 10:10-10:30 a.m.
- Craig Bishop, Robin Davis, Liberty Perez, Ryan Sanden, Andrew Hoetker
Die-to-Die Parallel Interface Optimization Utilizing Deca™s Novel M-Series Gen-2 Fan-Out Technology
- Thursday, May 29 from 11:35-11:50 a.m.
- Craig Bishop
EV Group
PDC: Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Advanced Interconnects
- Tuesday, May 27 from 8 a.m. – 12 p.m.
- Viorel Dragoi
Advanced Metrology for Heterogeneous Chiplet Integration With 100% (Chip-to-Wafer Hybrid Bond) Overlay Control at High Speed With Four Parameter Modeling
- Wednesday, May 28 from 4:45 – 5:05 p.m.
- Thomas Uhrmann
Integration, Materials and Equipment Innovations to Enable 100 nm Pitch W2W Bonding for Memory-to-Logic and Logic-to-Logic 3D Stacking
- Thursday, May 29 from 9:30-9:50 a.m.
- Barbara Weis
IR Laser Debonding for Silicon Based Temporary Carrier Systems Enabling 2.5D and 3D Chiplet Integration Processes
- Thursday, May 29 from 10 a.m. – noon
- Peter Urban, Simon Halas, Julian Bravin, Thomas Uhrmann, Markus Wimplinger
Process Approaches to Enable 200 °C Hybrid Bonding With SiCN Bond Layer and 0.5 µm Pitch
- Thursday, May 29 from 10 a.m. – noon
- Taotao Ding, Barbara Weis, Gernot Probst
Wafer-to-Wafer Bonding With Saddle-Shaped Wafers
- Thursday, May 29 from 2:30-4:30 p.m.
- Anton Alexeev, Thomas Plach, Taotao Ding, Markus Wimplinger
Advanced FO PLP Digital Lithography Patterning Development for AI Devices
- Thursday, May 29 from 2:40-3 p.m.
- Ksenija Varga, Roman Holly, Boris Povazay, Tobias Tobias, Thomas Uhrmann
Evatec
Characterization of PVD Backside Metal Adhesion for Improved Thermal Management in Heterogeneous Integration
- Friday, May 30 from 10:10-10:30 a.m.
- Carl Drechsel, Patrik Carazzetti, Eleftherios Stampolis, Roland Rettenmeier
Fraunhofer IZM
PDC: From Wafer to Panel Level Packaging
- Tuesday, May 27 from 8 a.m. – 12 p.m.
- Tanja Braun and Piotr Mackowiak, Fraunhofer IZM
PDC: Fundamentals of Fabrication Processes and RF Design of Advanced Packages Including Fan-Out Chiplets, Glass, and Polymer Interposer
- Tuesday, May 27 from 8 a.m. – 12 p.m.
- Ivan Ndip and Markus Wöhrmann, Fraunhofer IZM
Advancements in mmWave and Sub-THz Packaging for Communication and Radar Applications
- Tuesday, May 27 from 3:30-5 p.m.
- Ivan Ndip
Large-Scale Glass Waveguide Circuit for Board-Level Optical Interconnects Between Faceplate and Co-Packaged Optical Transceivers
- Wednesday, May 28 from 11:35-11:55 a.m.
- Julian Schwietering, Christian Herbst, Henning Schroeder
Fabrication of D-band (140 GHz) Broadband Antenna Using Quartz Glass on Silicon Hybrid Bonded Wafer With Cavity
- Thursday, May 29 from 10 a.m. – noon
- Uwe Maaß, Alexander Gäbler, Ivan Ndip, Fraunhofer IZM
Influence of Passivation Layer on Electromigration Lifetime of Fine-Pitch Cu RDL
- Friday, May 30 from 9:50-10:10 a.m.
- Adrija Chaudhuri, Johannes Jaeschke, Astrid Gollhardt, Hermann Oppermann
Characterization of PVD Backside Metal Adhesion for Improved Thermal Management in Heterogeneous Integration
- Friday, May 30 from 10:10-10:30 a.m.
- Ole Hoelck, Marcus Voitel, Friedrich Mueller, Karl-Friedrich Becker
Integration of D-Band 140 GHz III-V Components Transceiver in Embedding PCB-Based Technology
- Friday, May 30 from 4:05-4:25
- Tekfouy Lim, Stefan Kosmider, Kavin Senthil Murugesan, Thi Huyen Le, Marius Van Dijk, Johannes Jaeschke, Ivan Ndip, Ulrike Gasnesh
IBM
2025 ECTC Young Professional Networking Event
- Tuesday, May 27 from 6:45-7:45 p.m.
- Chair – Aakrati Jain
Fast and Accurate Machine Learning Prediction of BackEnd-Of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- Wednesday, May 28 from 10 a.m. – 12 p.m.
- Prabudhya Roy Chowdhury, Aakrati Jain, Dureseti Chidambarrao, Atsushi Ogino, Kartik Acharya, IBM
Graphite Sheet Embedded in an Organic Flip-Chip Package for Heat Spreading
- Wednesday, May 28 from 2:20-2:40 p.m.
- Keiji Matsumoto, Daisuke Oshima, Hiroyuki Mori, Toyohiro Aoki, Akihiro Horibe, Atom Watanabe, Russell Budd, Daniel Edelstein
Self-Alignment of Active Si Bridge Using Solder Joint Capillary Forces
- Wednesday, May 28 from 2:40-3 p.m.
- Sayuri Kohara, Akihiro Horibe, Divya Taneja, Isabel De Sousa
Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- Wednesday, May 28 from 4:25-4:45 p.m.
- John Knickerbocker, Jean Benoit Heroux, Adrian Paz Ramos, Hsianghan Hsu, Neng Liu, Yoichi Taira, Daniel Kuchta, Mark Schultz
Electrical Performance of Hybrid Bonding With Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Thursday, May 29 from 11:55 a.m. -12:15 p.m.
- Roy Yu, Nicholas Polomoff, Luke Darling, Katsuyuki Sakuma
Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- Thursday, May 29 from 2:30-4:30 p.m.
- Sathya Raghavan, Nicholas Polomoff, Katsuyuki Sakuma, IBM
Fully Encapsulated Fine Pitch Dual Damascene Organic RDL With Low Dk Df Photosensitive Polyimide and Its Reliability
- Friday, May 30 from 9:50-10:10 a.m.
- Minhua Lu, Joyce Liu, Peter Sorce, Andrew Giannetta, Michael Lofaro, Adele Pacquette, Michelle Hofman, David Rath
A Novel Approach to UltraLow Temperature Interconnection: DoubleSided SLID Process Using SAC BGAs and Off-Eutectic SnBiIn Paste
- Friday, May 30 from 11:15-11:35 a.m.
- Divya Taneja
Kulicke & Soffa
Formic Acid Vapor Assisted Fluxless TCB for Advanced Packaging- a Key Enabler for Ultra-Fine Pitch and HighDensity Interconnects
- Friday, May 30 from 11:55 a.m. – 12:15 p.m.
- Adeel Bajwa, Suleman Ayub, Tom Colosimo, Matt Wasserman, Bob Chyla
MacDermid Alpha
Comparison of Mechanical Response and Failure Characteristics of Selected SnAgCu-Based HighTemperature Solder Alloys
- Wednesday, May 28 from 10 a.m. – 12 p.m.
- Morgana Ribas, MacDermid Alpha
Onto Innovation
Yield Prediction Technology: A Game Changer for Cutting Costs and Reducing Ramp Time in FOPLP Lithography
- Wednesday, May 28 from 11:35-11:55 a.m.
- John Chang, Keith Best, Jian Lu, Timothy Chang
Siemens EDA
HIR Session With Joint Participation by IPC: Components to System – Integration Needs, Gaps, Challenges, Solutions
- Tuesday, May 27 from 3:30-5 p.m.
- Gary Brist, Siemens EDA
TechSearch International
Glass Core vs. RDL Interposers: Ready for Prime-Time?
- Tuesday, May 27 from 10:30 a.m. -12 p.m.
- Jan Vardaman
PDC: Advanced Fan-Out Developments and Applications
- Tuesday, May 27 from 1:30-5:30 p.m.
- John Hunt and Jan Vardaman, TechSearch International
Yield Engineering Systems (YES)
Glass Core vs. RDL Interposers: Ready for Prime-Time?
- Tuesday, May 27 from 10:30 a.m. -12 p.m.
- Zia Kharim
Improving the Quality and Yield Performance of Vacuum Fluxless Reflow Soldering for High-Density AI Chips
- Thursday, May 29 from 10:10-10:30 a.m.
- Lei Jing, Xinxuan Tan, Anderson Chen, Vladimir Kudriavtsev, Wayne Chen, Hans Lin, Zia Karim, Saket Chadda
Member Exhibits
