Advanced iBGA Image Sensor Encapsulation
Apr 09, 2026 · By Delo · White Papers
Latest Posts - Page 3
A Path Finding Based SI Design Methodology for 3D Integration
3D integration is being touted as the next semiconductor revolution by industry. 3D integration involves the use of various interconnects... TSV Inspection using Virtual Interface Technology
Frontier Semiconductor has recently introduced Virtual Interface Technology (VITTM) for TSV Inspection. In the realm of 2.5D/3D packaging, a high... Silicon Interposer for a 12X10 Gb/s Electro-optical Engine
By Terry Bowen and Richard Miller, TE Connectivity The increasing transmission speeds in network switching, data storage, and super computing... 3D IC System Verification Methodology: Solutions and Challenges
By Dusan Petranovic, Member, IEEE, and, Karen Chow, Member, IEEE, (Mentor Graphics) The three largest EDA companies are taking an... A Comparative Simulation Study of 3D TSS Assembly Processes
A memory stack on logic 3D TSS stack was considered for comparative study of warpage response to two different process... 