Paul Werbaneth is a long-time Contributing Editor at 3D InCites. Paul received the B.S. degree in chemical engineering from Cornell University, Ithaca, NY, USA, and recently completed studies in spoken Japanese from the Cornell Summer FALCON Program, and in marketing strategy, also through Cornell. Since entering the semiconductor industry in 1980, Paul has been a hands-on Photolithography Process Sustaining Engineer in an Intel wafer fab; a Senior Plasma Etch Process Engineer with Hitachi High Technologies; the Country Manager for Tegal Japan Inc.; the Vice President of Marketing and Applications at Tegal Corporation; a Business Development Manager at EV Group; an independent consultant and writer; the Global Product Marketing Director at Intevac, Inc.; and Global Product Manager at Nor-Cal Products, Inc. Paul is a member of the SEMI Advanced Semiconductor Manufacturing Conference Steering Committee, and was the SEMI ASMC 2004 Conference Co-Chair. Active in the Northern California Chapter of the American Vacuum Society for many years, Paul was Program Chair for the NCCAVS Technical Symposium 2019, and is the Chapter Chair for 2019. Paul is also a Guest Editor of IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING; wrote the contributed chapter on TSV etching in the book “3D Integration for VLSI Systems,” and has written or co-written an extensive number of articles, papers, and blogs regarding the semiconductor capital equipment business, advanced packaging, and various aspects of semiconductor manufacturing.
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Feb 20, 2020