Processes and Technology

Latest Posts - Page 2

48V Ecosystem and Power Packaging Trends

Sep 21, 2020 · By Ajay Sattu · 3D In-Depth

With each passing year, emerging growth application areas such as Automotive, Cloud Computing, Industrial Automation, and Telecom (5G) Infrastructure are...

Carrier Wafers for Semiconductor and MEMS Manufacturing

Jul 14, 2020 · By Plan Optik · 3D In-Depth

As technology rapidly moves forward, the reduction of device and chip size is playing an important role in implementing as...

Temporary Wafer Bonding System Is Based On Electrostatics, Not Adhesives

May 11, 2020 · By Paul Werbaneth · 3D In-Depth

Temporary wafer bonding is widely employed in semiconductor device fabrication and in semiconductor device packaging applications, particularly now that changes...

Temporary Bonding and Mold Process to Enable Next-Gen FOWLP

Apr 30, 2020 · By Arnita Podpod · 3D In-Depth

Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be...

A Look Inside The 3D Technology Toolbox For STCO

Aug 09, 2019 · By Eric Beyne · 3D In-Depth

System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling...

Addressing the Challenges of Surface Preparation for Advanced Wafer Level Packaging

Apr 11, 2019 · By Anil Vijayendran

As the semiconductor industry shifts focus from CMOS scaling to heterogeneous integration, the importance of surface preparation and wafer cleans...

CoolCube™: More than a True 3D VLSI Alternative to Scaling

Mar 28, 2019 · By Jean-Eric Michallet · 3D In-Depth

Almost four years ago, we published an article titled “CoolCube™: A True 3DVLSI Alternative to Scaling” on 3D InCites. It...

Replacing NMP: Are You Ready?

Dec 04, 2018 · By John Taddei · 3D In-Depth

NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an...

The Fundamentals and Early History of Quantum Mechanical Tunneling

Feb 05, 2018 · By Andrew Walker · 3D In-Depth

The mid-1920’s were the miracle years for quantum mechanics. The “Old Quantum Theory” originating with Niels Bohr, had reached crisis point by the...

The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage

Feb 05, 2018 · By Andrew Walker · 3D In-Depth

If all the data sent worldwide each day on the internet were burned on to CDs and these were then piled one...

Integrated Solid-state Capacitors Based on Carbon Nanostructure

Sep 20, 2017 · By Smoltek · 3D In-Depth

The constant demand for miniaturization, added functionality and increased performance of electronic devices systematically drives higher integration by adding more...

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

Aug 15, 2017 · By Eric Beyne · 3D In-Depth

In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is...

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

May 23, 2017 · By Andrew Walker · 3D In-Depth

Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years...

Lam Research: SABRE 3D

Jul 02, 2015 · By Francoise von Trapp

SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications. This product leverages proprietary...