Jean-Eric Michallet, Author at 3D InCites

CoolCube™: More than a True 3D VLSI Alternative to Scaling

CoolCube™: More than a True 3D VLSI Alternative to Scaling

Almost four years ago, we published an article titled “CoolCube™: A True 3DVLSI Alternative to Scaling” on 3D InCites. It described the concept of stacking layers of transistors sequentially on top of each other and documented the research effort happening at Leti to develop a feasible process integration scheme and a comprehensive product design frame. Now, four years later, we can say that... »

CoolCube™: A True 3DVLSI Alternative to Scaling

CoolCube™: A True 3DVLSI Alternative to Scaling

Stacking transistors on top of each other sequentially in the same front-end process flow is a concept that has been imagined to provide the semiconductor community with an alternative to the traditional scaling paradigm challenged by technical and cost roadblocks. LETI Advanced CMOS Laboratory introduced CoolCube™, a low-temperature process flow that provides a true path to 3DVLSI. »