Unique Configurations Bring Improved Process Control, Lower CoO, and Higher Throughput to Pave the Way for Leading-Edge Technology Adoption Horsham,...
Three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater...
Product Description Cascade Microtech’s 3D probing solution, comprising the CM300 probe station and Pyramid Probe® cards with RBI technology, captures...
Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric...
Product Description Alchimer’s eG3D Polymer simplifies the metallization process flow for deposition processes for TSV insulation and barrier by combining...
Product Description The EVG850TB/DB XT temporary bonding/debonding platform addresses the high volume manufacturing needs for thin wafer processing. Nine process...
Product Description Cadence Encounter Test provides a comprehensive methodology for 3D-IC design-for-test and automatic test pattern generation that includes a...
Product Description The InStrip3D utilizes the experience gained from a well-established installed base of high-parallel InStrip/InMEMS solutions. The architecture of...
Product Description The NSX 320 Metrology Series combines macro inspection and 3D metrology for advanced packaging applications. The demonstrated 3D...