SPTS Technologies has launched its low temperature plasma-enhanced chemical vapor deposition (PECVD) solution for via-reveal passivation in 3D-IC packaging applications....
This week’s webinar on chip stack assembly simulation, presented by Kamal Karimanal of Cielution offered some useful information on how modeling can...
Semiconductor test and advanced packaging service provider, STATS ChipPAC Ltd. announced its next-generation three dimensional (3D) embedded Wafer Level Ball...
Georgia Tech’s Packaging Research Center, in its pioneering chip-last embedded interconnection technology, demonstrates World's Thinnest 3D Organic Package at 130um thickness...