Processes and Technology

Trends and challenges for thin wafer processing

Processes addressing the handling of ultra-thin wafers have been a hot topic ever since it became clear that they are...

Alchimer introduces seedless wet deposition; eliminates entire step from TSV stacking

Alchimer S.A.,provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D through-silicon vias (TSV),...