Intel Foundry Achieves Breakthrough with World’s Thinnest GaN Chiplet Technology
Apr 10, 2026 · By Intel Foundry · 3D In-Depth, Processes and Technology
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Alchimer Product Extension Provides Metallization For Interposer and Via Last in 3D Packaging
Alchimer, provider of nanometric film deposition for advanced 3D packaging applications as well as semiconductor interconnects, MEMS and other electronic...Altera joins imec’s advanced CMOS scaling program for 3-D process technology development
Imec has entered into a three-year research collaboration with Altera Corporation to develop advanced CMOS scaling technologies. Altera joins a...Imec and Atrenta Develop Exploration Flows for 3D ICs
Atrenta Inc., provider of SoC Realization solutions for the semiconductor and electronic systems industries, in collaboration with imec’s 3D integration...Applied Materials Introduces Technology to Enable Advanced Image Sensors for Smartphones
Applied Materials, Inc. announced its new Applied Producer®OptivaTM CVD system that enables the manufacture of state-of-the-art, backside-illuminated (BSI) image sensors used...SUSS MicroTec launches XBS300, the next generation Temporary Bonder for 200mm and 300mm High-Volume Production
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary...Alchimer’s Taiwanese Expansion Emphasizes Total Solution Strategy
Last week’s announcement of Alchimer’s expansion into Taiwan via its Representative agreement with Kromax International Corp. further exemplifies the company’s...Going UP! Next-Generation IC Assembly
Coverage of the GSA Memory Conference continues in this week's issue of Chip Scale Review Tech Monthly. Francoise von Trapp...Exploring New Approaches to 3D Integration
In this article that appeared in the April Issue of CSR Tech Monthly, Andrew Smith, Ron Csermak, and Mark Vandermeulen ...C2W Bonding Approaches: Variations on Theme
As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields...Invensas and ALLVIA Collaboration Results in Full 3D R&D Line; Paves the Way for 3D Manufacturing
Earlier this week Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced both its acquisition of ALLVIA’s patent assets,...
