Enhanced Hardware, Software and Process Control Capabilities Enable Two-fold Increase in Throughput to Meet Productivity and Yield Requirements of Today’s...
ANSYS subsidiary Apache Design, Inc. today introduced RedHawk(TM)-3DX to meet the power, performance and price demands of low-power mobile, high-performance computing,...
Applied Materials, Inc. today announced a breakthrough technology for reducing power consumption in semiconductor chips with its new Applied Producer® OnyxTM...
SEMATECH’s 3D Enablement Center (3D EC), together with the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), has identified...
Honeywell Microelectronics and Tezzaron Semiconductor are working together to produce a new range of radiation-hardened (rad hard) integrated circuits. Honeywell’s sturdy, well-qualified...
Through-silicon via (TSV) foundry,ALLVIA, has received official International Traffic in Arms Regulations (ITAR) registration from the U.S. Department of State,...