Atrenta Inc., provider of SoC Realization solutions for the semiconductor and electronic systems industries, in collaboration with imec’s 3D integration...
Applied Materials, Inc. announced its new Applied Producer®OptivaTM CVD system that enables the manufacture of state-of-the-art, backside-illuminated (BSI) image sensors used...
Last week’s announcement of Alchimer’s expansion into Taiwan via its Representative agreement with Kromax International Corp. further exemplifies the company’s...
Earlier this week Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced both its acquisition of ALLVIA’s patent assets,...
CEA-Leti has announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are...
Ziptronix Inc., the leading developer of direct bonding technology for advanced semiconductor applications, announced today that recent collaborations with major...