Intel Foundry Achieves Breakthrough with World’s Thinnest GaN Chiplet Technology
Apr 10, 2026 · By Intel Foundry · 3D In-Depth, Processes and Technology
Latest Posts - Page 8
Mitsubishi Throws its Hat in the 300mm Wafer Bonding Ring
Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer...CEA-Leti Launches Open 3D(TM) Initiative
CEA-Leti today announced the launch of a major new platform that provides industrial and academic partners with a global offer...Ziptronix Direct Oxide Bond Technology Gains Momentum
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the...Rambus and ITRI Collaborate to Develop Interconnect and Advanced 3D Packaging Technologies
Rambus Inc, one of the world's premier technology licensing companies, announced today it is engaging with the Industrial Technology Research...Applied Materials Announces Atomic-Level Film Treatment to Reduce Chip Power Consumption
Applied Materials, Inc. today announced a breakthrough technology for reducing power consumption in semiconductor chips with its new Applied Producer® OnyxTM...
SEMATECH’S 3D Enablement Center Focuses on Addressing Challenges Facing Future High Volume 3D Applications
SEMATECH’s 3D Enablement Center (3D EC), together with the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), has identified...EV Group Launches ZoneBOND™ Capable Equipment and Open Platform for Temporary Bonding Materials
EVG's EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) Modules Enable Flexible Choice of Adhesives ST. FLORIAN, Austria, October...Perspectives on 3D Integration: The Researchers
To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for...Who Wins With 3D Stacking?
In this editorial commentary, blogger Ed Sperling, of the Low Power Engineering community, talks about the opportunities 3D stacking technologise...Honeywell and Tezzaron to Build Rad Hard 3D-ICs
Honeywell Microelectronics and Tezzaron Semiconductor are working together to produce a new range of radiation-hardened (rad hard) integrated circuits. Honeywell’s sturdy, well-qualified...
