Maskless Lithography Addresses Shift Toward Heterogeneous Integration and 3D Packaging
Jul 12, 2022 · By Thomas Uhrmann · 3D In-Depth, Processes and Technology
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Altera joins imec’s advanced CMOS scaling program for 3-D process technology development
Imec has entered into a three-year research collaboration with Altera Corporation to develop advanced CMOS scaling technologies. Altera joins a...Imec and Atrenta Develop Exploration Flows for 3D ICs
Atrenta Inc., provider of SoC Realization solutions for the semiconductor and electronic systems industries, in collaboration with imec’s 3D integration...Applied Materials Introduces Technology to Enable Advanced Image Sensors for Smartphones
Applied Materials, Inc. announced its new Applied Producer®OptivaTM CVD system that enables the manufacture of state-of-the-art, backside-illuminated (BSI) image sensors used...SUSS MicroTec launches XBS300, the next generation Temporary Bonder for 200mm and 300mm High-Volume Production
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary...Alchimer’s Taiwanese Expansion Emphasizes Total Solution Strategy
Last week’s announcement of Alchimer’s expansion into Taiwan via its Representative agreement with Kromax International Corp. further exemplifies the company’s...Going UP! Next-Generation IC Assembly
Coverage of the GSA Memory Conference continues in this week's issue of Chip Scale Review Tech Monthly. Francoise von Trapp...Exploring New Approaches to 3D Integration
In this article that appeared in the April Issue of CSR Tech Monthly, Andrew Smith, Ron Csermak, and Mark Vandermeulen ...C2W Bonding Approaches: Variations on Theme
As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields...Invensas and ALLVIA Collaboration Results in Full 3D R&D Line; Paves the Way for 3D Manufacturing
Earlier this week Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced both its acquisition of ALLVIA’s patent assets,...Leti Develops C2W Direct Metallic Bonding Technology for Customized 300mm Device Bonder
CEA-Leti has announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are...