In this editorial commentary, blogger Ed Sperling, of the Low Power Engineering community, talks about the opportunities 3D stacking technologise pose for EDA start-ups and vendors.

There seems to be little doubt that the semiconductor industry is moving to 3D stacking. It’s simply too expensive for most companies to develop SoCs at advanced nodes from scratch when they can use existing blocks of pre-verified IP—particularly analog IP developed for older processes. (Full Story)

Francoise von Trapp

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