When it comes to 3D chip stacking, chip-to-wafer (C2W) processes have proven to be the way to go for stacking known-good-die (KGD) for best yields, or if the dies being stacked are of different size.
Unfortunately, sequential C2W processes have historically been time consuming, achieving low throughput; making it a costly approach. Several approaches are under development to address this; all involving a two-step die placement followed by collective permanent bond. Chip Scale Review recently spoke with Thorsten Matthias, Business Development Director for EV Group, to learn more about the company’s collaboration with Datacon to develop what they’ve dubbed Advanced Chip to Wafer (C2W) Bonding. (Full Story)