NHanced Semiconductors, Inc., holds a deep library of technical expertise in cutting edge semiconductor technologies. The company has extensive experience in advanced packaging: 3D-ICs, silicon interposers, 2.5D, chiplets, additive silicon manufacturing, photonics, microfluidics, and other innovative solutions.
Their 25,000 square foot development and manufacturing facility (fab) specializes in BEoL and advanced packaging. The fab works with a large variety of materials including III-V compound semiconductors. It currently performs small volume manufacturing, in-house process development, and customer prototyping. The fab is being expanded to house an additional pure-play line dedicated to high-volume advanced packaging.
In addition to its fab, the company boasts a seasoned team of design engineers. Their specialized skills in 3D semiconductor design have built a strong customer base. Working under the leadership of 3D pioneer Bob Patti, they extend the functionality of advanced ICs in exciting new directions.
Will leverage next generation technologies, spur workforce development, seed small businesses NHanced Semiconductors announces a new office in the Westgate...
