Nordson ASYMTEK

About ASYMTEK, Nordson ELECTRONICS SOLUTIONS

ASYMTEK, Nordson ELECTRONICS SOLUTIONS, delivers award-winning automated fluid dispensing systems and equipment for the speed, flexibility, and exacting precision required in advanced 3D and wafer-level packaging. Applications include capillary underfill for stacked dies with through silicon vias (TSV), face-to-face stacked dies, and flux dispensing for die stacking. Other applications include fluid encapsulation, conductive pastes for die attach, and thermal interface material (TIM) for heat dissipation.

ASYMTEK focuses on your immediate and long-term needs, continuously innovating as technology and electronics applications evolve. Our award-winning service and support network is available locally and globally.

Products include:

ASYMTEK's Vantage® Series Next-Generation Fluid Dispensing System for cutting-edge reliability and micro-dot jetting for advanced semiconductor package, electromechanical, and PCB assembly. This platform is ideal for high-speed, precise volume dispensing that requires tight keep-out zones or dispensing of thin and accurate lines. It comes with Canvas^®, a new software interface that simplifies programming tasks and provides powerful insight and process control.

The  Forte^™ Series is an advanced, precision dispensing platform with an optional dual-simultaneous dispense head with two high-frequency IntelliJet^® Jetting Systems that dispense at the same time to further boost UPH and quality. Dispense-time can be reduced by half and it automatically adjusts for workpiece and individual component rotational skew.

The Spectrum^® II Premier Fluid Dispensing System has been popular for semiconductor and mobile electronics packaging applications. The closed-loop system reduces process variation, increases yield, and reduces cost. Software-managed temperature, fluid, and air pressure eliminates operator adjustments.

The Quantum^® High-Value Fluid Dispensing in-line or batch system ensures quality, value, and productivity. It can include the Vortik^® progressive cavity pump for dispensing bonding, sealing, encapsulation, and potting materials. Progressive cavity pump technology gives the highest volumetric accuracy, thereby enabling very small volumes.

Visit us at www.NordsonASYMTEK.com.