Chiplets have become a strategic asset for designers who are implementing them in all sorts of applications. Until now, chiplet verification until now has been overlooked. I discussed this phenomenon with Dave Kelf, CEO of Breker Verification Systems, an ESD Alliance member company and provider of verification solutions that leverage...
Editor’s Note: Bob Smith, executive director of the ESD Alliance, a SEMI Technology Community, is a regular contributor to 3D InCites. He turns over his blog today to John Lee of Ansys, an ESD Alliance member company, who describes a disruptive change in product engineering and the requirements of the...
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
Modern-day applications such as cloud computing, high-performance computing, artificial intelligence (AI), data centers, and future 6G systems are driving the...
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence...
NanoCleave enables Laser Debonding on Silicon with Nanometer Precision In semiconductor manufacturing, 3D integration – the manufacturing, vertical assembly, and...