3D Topics

Warpage Issues in Fan-Out Wafer Level Packaging
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Warpage Issues in Fan-Out Wafer Level Packaging

As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it, however, most of them don’t know what they are talking about. Let’s use t... »

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications
EVG IQ Aligner NT Automated Mask Alignment System EVG150 Automated Resist Processing System

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solut... »

Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products
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Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products

Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a to... »

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP
Keith Felton - Mentor BSD

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

  For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly design kits (ADK), similar to the process design kits (P... »

Impressions from ECTC 2017
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Impressions from ECTC 2017

Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing... »

Artificial Intelligence: A New Era of the Advanced Packaging Industry
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Artificial Intelligence: A New Era of the Advanced Packaging Industry

Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV & 2.5D business update report, Yole Développement (Yole), part of... »

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging
Unique HDAP Flow Enables Design Capture and Rapid Prototyping Disrupting Design Methods and Tools Mentor Introduces New Design Flow for HDAP Mentor: Proven differentiated capability for HDAP Mentor Delivers....

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies, s... »

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Fifty Shades of Fan-out Discussed at ECTC 2017

The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place in Orlando at the Walt Disney W... »

EV Group Expands Production Capacity at Corporate Headquarters in Austria
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EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its co... »

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Wilmington, Mass. (May 23, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep S Lithography System for fan-out panel-based advanced packaging... »

Will IoT be the Next Killer App for Semiconductors?
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Will IoT be the Next Killer App for Semiconductors?

At the end of April, I attended the Internet of Things (IoT) Developers Conference at the Santa Clara Convention Center. Because our semiconductor industry is expecting that IoT applications will sign... »

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory
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The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years of progress. Here we look at the dual-gate thin film transistor (... »

SMIC Signs License Agreement For Invensas’ DBI Technology

SMIC Signs License Agreement For Invensas’ DBI Technology

Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology t... »

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide
EVG - Wafer Bond Chamber in an EVG560 Automated Wafer Bonding System EVG GEMINI Automated Production Wafer Bonding System (200 mm)

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a lea... »

Are Glass Substrates the Next Option for Fan-out Packaging?
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Are Glass Substrates the Next Option for Fan-out Packaging?

As you all may know, in most fan-out wafer level packages (FOWLP) such as embedded wafer level ball grid array (eWLB) by Infineon and STATS ChipPAC, and TSMC’s integrated fan out (InFO), the chi... »

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer
Sponsorship Opportunities for 3D InCites Awards 2017 G1ve A Buck

The 2017 3D InCites Awards Will Help Fund Kid Size Cures for Childhood Cancer

It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the 2017 3D InCites Awards. The 2017 3D InCites Awards will be presented on Wednesday, July... »

UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems
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UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems

Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular ... »

Multiple Orders for Rudolph’s Firefly Inspection System Marks Early Success
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Multiple Orders for Rudolph’s Firefly Inspection System Marks Early Success

 Wilmington, Mass. (May 1, 2017) Rudolph Technologies, Inc. (NYSE: RTEC) announced today that two of the industry’s leading suppliers of advanced packaging services have purchased multiple Firefly... »

Meet Us at ECTC 2017 in Walt Disney World

Meet Us at ECTC 2017 in Walt Disney World

As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of le... »

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA
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Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA

The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very important, but a relatively small part of the entire conference. After the two key... »

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