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Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System
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Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world’s ... »

Technical Tidbits from IWLPC and MSEC 2017
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Technical Tidbits from IWLPC and MSEC 2017

It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors ... »

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)
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Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)

One of the things I like best about the annual MEMS and Sensors Executive Congress (MSEC17) hosted by SEMI-MSIG, is being in the presence of some of the greatest minds in the industry. While the prese... »

Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?
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Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?

I’ve often found it somewhat ironic that those responsible for dreaming up and building the technologies that made smart devices, cities, cars, and factories possible, are often the slowest to adopt... »

The Memory Packaging Market Shows Steady Growth
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The Memory Packaging Market Shows Steady Growth

The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135 billion by 2022, with DRAM and NAND constituti... »

MEMS Packaging Market is Growing Faster Than The MEMS Devices Market
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MEMS Packaging Market is Growing Faster Than The MEMS Devices Market

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging marke... »

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

PARIS, FRANCE–(Marketwired – Oct 24, 2017) – aveni S.A., developer and manufacturer of market disrupting wet deposition technologies and chemistries for 2D interconnects and 3D TSV p... »

Electromagnetic Modeling of Three-dimensional Integrated Circuits
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Electromagnetic Modeling of Three-dimensional Integrated Circuits

Three-dimensional Integrated circuits (3DIC) are generating increased interest as a way to increase speed and density while reducing power and form factor. System level integration in Package (SiP) ha... »

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017
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Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

To the best of my recollection (and a quick search through 3D InCites’ archives) the panel level packaging (PLP) hoopla first hit the conference circuit in 2015 at the International Wafer Level Pack... »

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s ... »

Sir Walter Raleigh towered above the 50th IMAPS Symposium
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Sir Walter Raleigh towered above the 50th IMAPS Symposium

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed ... »

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices
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imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and Analog Devices, Inc. (ADI), the leading globa... »

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy
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EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and SwissLitho AG, a manufacturer of novel nanolithography tools, ... »

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore
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European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

There’s no doubt about it. Imaging sensor technologies have come a long way since the introduction of the digital camera. In fact, according to Gartner, image-based sensors will be the single larges... »

EDPS 2017: NOT the usual Electronic DESIGN Process Symposium
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EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fa... »

Spotlight on the European MEMS and Sensors Technology Showcase
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Spotlight on the European MEMS and Sensors Technology Showcase

As it’s difficult to be in two places at one time, I was happy to see that the organizers of the co-located European MEMS and Sensors Summit/Imaging and Sensors Summits made sure two featured tr... »

Making Sense of MEMS and Sensors at the MEMS/Imaging Sensors Summits
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Making Sense of MEMS and Sensors at the MEMS/Imaging Sensors Summits

Last week, I had a whirlwind trip to Grenoble, France: 3 days, 2 summits, and 1 supercool paragliding festival, Coupe Icare, on the side – all filled with “Aha!” moments. Ironically, the paragli... »

CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVD

CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVD

Montbonnot, France, 20th of September 2017  ̶  KOBUS, a leading equipment supplier in advanced deposition solutions, and Leti, a technology research institute of CEA Tech, are pursuing their long-t... »

Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow
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Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow

Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is rapidly gaining popularity in the market. But what ... »

Image Courtesy of TSMC Ltd.

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share so... »

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