3D Topics

There’s a Fan-out for That
IMG_8922 IMG_2217 copy Emerging-Technology-Hype-Cycle-for-2017_Infographic_R6A-1024x866

There’s a Fan-out for That

Long gone are the days of the “killer app” and the notion that a single device market like personal computers (PCs) or smartphones alone can make or break the semiconductor industry. In fact, whil... »

SEMI Alliance
ESD

Strategic Partnership with ESD Alliance Extends SEMI’s Reach to Semiconductor Design

On Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System Design (ESD) Alliance, representing the design commu... »

Kamel Ait-Mahiout Appointed as CEO of UnitySC
UnitySC_CEO_Kamel Ait-Mahiout

Kamel Ait-Mahiout Appointed as CEO of UnitySC

Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced that its board of directors has a... »

Implementing High-Density Advanced Packaging for OSATs and Foundries
mentorpaper_101410 hdap

Implementing High-Density Advanced Packaging for OSATs and Foundries

Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in response to system scaling demands. These innovations... »

Concept for 3-dimensional stacking of Flash devices. A thin film field effect transistor with a silicon nitride as charge reservoir and a tunnel oxide. A.J. Walker et al., VLSI Symposium, 2003.
Fig24 Fig25 Fig26 Fig27

The Future of Non-volatile Memory

Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above is a concept for 3D stacking of Fl... »

Getting IC Package Design Right the First Time
Hetero Image Verification and Validation Prototyping 3D Physical challenges 20180329_161613[1] copy 3DInCites 2018 Mentor

Getting IC Package Design Right the First Time

Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated as it becomes more critical to the performance of the end-devices. ... »

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More
18475810875_0b440f2f0c_m

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s Electronics Components and Technologies Conference (ECTC 20... »

Packaging, Innovation, and Our Application-Driven World
MEPTEC Lunch newmeptecluncheon Rich Rice

Packaging, Innovation, and Our Application-Driven World

MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review, are on again in Silicon Valley. At the most recent lunch  in mid-March 201... »

Hybrid Bonding: From Concept to Commercialization
GillFig1 GillFig2 GillFig3 Screen Shot 2018-04-02 at 8.35.36 AM Screen Shot 2018-04-02 at 12.38.51 PM gill

Hybrid Bonding: From Concept to Commercialization

Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications, from 2DS enhanced, to 3D stackin... »

Advanced Packaging Trends – Part II: Solving Lithography Challenges
Figure 1 - Veeco AP Litho Article Doug Anberg Figure 2 - AP Litho Doug 2 NASDAQ 2012

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM) / redistribution layer (RDL) challenges. This article looks at AP tre... »

Designing and Integrating MCM/SIP Packages into Systems PCBs
mentorpaper_101401 Image_101401

Designing and Integrating MCM/SIP Packages into Systems PCBs

Traditionally, MCMs (Multi-Chip-Modules) were a way of integrating several ASICs, or ASICs and memory, into a lower-cost, smaller form-factor, robust module that was an alternative to a single large S... »

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018
IMAPS DPC 2018 Dance Chris at DPC 2018

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018

The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the Gartner Hype Cycle listings from 2008 as I just did you w... »

The Invention of NAND Flash Memory
Fig18 Fig19 Fig20 Fig21 Fig22 Fig23

The Invention of NAND Flash Memory

Part 3 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the invention of NAND flash memory. The above image is of the first comprehensive pap... »

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives
IMG_8142 tesla-fire-truck-crash uber_tempe_2 IMG_8141

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives

How does the innovation of self-driving cars affect the business world we live in? This was the topic the iMAPS Global Business Council (GBC) chose to explore during its spring meeting two weeks ago, ... »

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplie... »

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?
ILLUS_ADV_SUBSTRATES_Roadmap_Scalingfunctional_YOLE_March2018 (433x280) ILLUS_ADV_SUBSTRATES_PCBrevenues_SmartphonesApplication_YOLE_March2018 (433x280)

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?

The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are giving way to functi... »

EV Group and IBM Sign License Agreement on Laser Debonding Technology
EVG 850 DB Automated Debonding System with integrated film frame mounter

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to s... »

Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS DPC 2018
IMG_4C679AF99CF1-1 IMG_690B058EB637-1 IMG_342F03D41C3B-1 140424-strip 140424 Screen Shot 2018-03-14 at 11.58.31 AM Screen Shot 2018-03-14 at 9.42.13 AM Screen Shot 2018-03-14 at 10.58.10 AM

Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS DPC 2018

As it has for the past 14 years, the global microelectronics industry gathered at Wekopa Resort and Conference Center in Fountain Hills, AZ, March 6-8, 2018, for the 2018 IMAPS Device Packaging Confer... »

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education

March 7, 2018, the day of the 2018 3D InCites Awards Ceremony, dawned chillier than normal for this time of year in Fountain Hills, AZ. As they enjoyed their breakfast on the terrace outside the confe... »

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our new MR... »

Page 1 of 59123»