3D Topics

Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s a network storage device, net... »

Advanced packaging is everyone’s business!
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Advanced packaging is everyone’s business!

“Changes in the semiconductor supply chain and shifting business models, as well as uncertainty related to US-china trade, creates a growing number of huge opportunities for some, while posing a thr... »

IFTLE 434: Process Optimization for a Reliable NXP FOWLP Microcontroller
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IFTLE 434: Process Optimization for a Reliable NXP FOWLP Microcontroller

There are several different fan-out wafer-level packaging (FOWLP) technologies that are currently in high-volume production. The traditional fan-out (FO) technology as initially developed by Motorola ... »

Air Force Research Laboratory Invests $7.5M in BRIDG efforts to develop secure semiconductor “digital twin”

Air Force Research Laboratory Invests $7.5M in BRIDG efforts to develop secure semiconductor “digital twin”

The U.S. Air Force Research Laboratory (AFRL), the primary scientific research and development center for the Air Force, has awarded BRIDG a major federal defense contract valued at $7.5 million to de... »

Air Force Research Laboratory Invests $7.5M in BRIDG efforts to develop secure semiconductor “digital twin”

The U.S. Air Force Research Laboratory (AFRL), the primary scientific research and development center for the Air Force, has awarded BRIDG a major federal defense contract valued at $7.5 million to de... »

GSA Awards Dinner celebrates 25 years of Recognizing the Best of the Semiconductor Industry
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GSA Awards Dinner celebrates 25 years of Recognizing the Best of the Semiconductor Industry

A few thousand semiconductor experts, including many high-level executives, got together on December 5, 2019, celebrate the Global Semiconductor Alliance’s (GSA) 25th Anniversary at the annual GSA A... »

IFTLE 433: AMD Chiplets go Commercial Amidst a Need for Chiplet Standardization
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IFTLE 433: AMD Chiplets go Commercial Amidst a Need for Chiplet Standardization

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Talking about Neural Networks and SoC Design Challenges
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Talking about Neural Networks and SoC Design Challenges

Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addre... »

Vehicle Autonomy & Electrification Push Advanced Packaging for Automotive Applications
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Vehicle Autonomy & Electrification Push Advanced Packaging for Automotive Applications

“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analys... »

SUSS MicroTec and BRIDG Join Forces to Establish a Production-Level Applications Center in North America

SUSS MicroTec and BRIDG Join Forces to Establish a Production-Level Applications Center in North America

SUSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, announced today a far-reaching collaboration agreement with BRIDG, a not-for-profit, public-private p... »

Lam Research Offers New Capabilities in its Edge Yield Product Portfolio

Lam Research Offers New Capabilities in its Edge Yield Product Portfolio

Lam Research Corp. (Nasdaq: LRCX) is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield at the edge of the wafer, which is essential to deli... »

IFTLE 432: Ferric and TSMC Partner on Voltage Regulators; High TC Die Attach for TIM?
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IFTLE 432: Ferric and TSMC Partner on Voltage Regulators; High TC Die Attach for TIM?

The IMAPS International Symposium took place this year in Boston. Let’s take a look at a few of the more interesting presentations that were given there. Ferric and TSMCs Partner on Voltage Regulato... »

Microtech Ventures brings a New MEMS and Sensors Summit to Town
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Microtech Ventures brings a New MEMS and Sensors Summit to Town

From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation Summit at the DoubleTree Hotel in San Jose. I have to admit, until recently I di... »

MRSI receives Laser Focus World Innovators Award for HVM Die Bonder

MRSI receives Laser Focus World Innovators Award for HVM Die Bonder

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for the Lase... »

Chiplets: Key Enablers for the Next 10-20 Years
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Chiplets: Key Enablers for the Next 10-20 Years

Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die. As a result, an increasing number of companies are turning to new architectur... »

Siemens and Qualcomm Set Up First Private Standalone 5G Network in Industrial Environment

Siemens and Qualcomm Set Up First Private Standalone 5G Network in Industrial Environment

· Sustainable technological cooperation for the future of industrial wireless communication · Joint Proof of Concept in a real industrial environment using the 3.7-3.8 GHz band · Researching the ca... »

Indium Corporation’s Andy Mackie Talks About Materials Science
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Indium Corporation’s Andy Mackie Talks About Materials Science

“We believe that materials science changes the world,” declared Indium Corporation’s Andy Mackie during our recent sit-down together at IMAPS 2019 in Boston, MA. Even though I am a chemical engi... »

Cu-Interposer Drives Connectivity to the Next Level

Cu-Interposer Drives Connectivity to the Next Level

Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressiv... »

SEMICON Europa and Productronica 2019 Exhibitor Showcase
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SEMICON Europa and Productronica 2019 Exhibitor Showcase

The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade be... »

SEMI, Partners Launch Largest Microelectronics Education Initiative

SEMI, Partners Launch Largest Microelectronics Education Initiative

SEMI and 19 partners from 14 countries today launched a microelectronics education initiative to fill the skills gap and boost workforce diversity by tightening collaboration between the microelectron... »

Uniting the World Through Technology Innovation
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Uniting the World Through Technology Innovation

What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously, I highly recommend you put it on your must-do list. ... »

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