3D Topics

Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s a network storage device, net... »

IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP
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IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP

In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR – 1µm RDL Ultratech, IMEC and JSR discussed “One Micron Damascene Redistribution ... »

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Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and d... »

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio
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Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

 Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent, wet process tool and its AP300™  l... »

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MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will be ... »

MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies
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MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies

This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an explo... »

How Do We Entice Young Women to Pursue Careers in Microelectronics & Packaging?
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How Do We Entice Young Women to Pursue Careers in Microelectronics & Packaging?

If what is expressed during ongoing discussions on gender diversity and inclusion at semiconductor and packaging industry events is true, then the overarching belief is that women are drawn to careers... »

3D Integration Enables More than Moore Technologies

3D Integration Enables More than Moore Technologies

Looking back at the last 10 years, it is very difficult to choose one single event that was the most pivotal for commercializing 3D integration technology. There have been many prior events that have ... »

DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging
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DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging

Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing printed circuit board (PCB) and system designers the latest technology ... »

Advice on Gender Diversity and Inclusion from the Trenches
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Advice on Gender Diversity and Inclusion from the Trenches

From the semiconductor industry panels on gender diversity and inclusion and networking receptions to casual lunches and one-on-one interviews, I’ve been listening to women of all levels of experien... »

IFTLE 403: TSMC 4th Generation CoWoS; 2018 Singapore EPTC Part 1
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IFTLE 403: TSMC 4th Generation CoWoS; 2018 Singapore EPTC Part 1

Heterogeneous Integration spurs demand for 3D backend solutions Julian Ho reported in the Jan 10th issue of Digitimes that heterogeneous integration of diverse semiconductor components to support 5G,... »

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Megatrends are Changing the Future of the Lithography Equipment Market

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the more tha... »

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Fan-Out Packaging is Becoming Imperative to Stay Competitive in Advanced Packaging

“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Dévelop... »

Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration
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Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration

The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous integration, quantum computing, a... »

3D ICs Eliminate the Memory Wall
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3D ICs Eliminate the Memory Wall

The adoption of 3D ICs allowed the elimination of the “Memory Wall” using a new memory architecture and through silicon via (TSV) technology. While individual ICs became faster with each process n... »

Probe Test for 3D Integration: A Thousand Mile Journey
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Probe Test for 3D Integration: A Thousand Mile Journey

When we look back at the last 10 years, it’s really been a series of baby steps to move the commercialization of 3D integration technologies forward. There is no single pivotal event that catalyzed ... »

ERS electronic GmbH Takes the Lead in Fan-Out Panel Level Packaging Equipment Manufacturing
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ERS electronic GmbH Takes the Lead in Fan-Out Panel Level Packaging Equipment Manufacturing

ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is taking the first ever step towards developing the new generation of thermal ... »

ISS 2019 Continued: Facing New Challenges and Opportunities
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ISS 2019 Continued: Facing New Challenges and Opportunities

Just in case you didn’t have a chance yet to read part 1 of the ISS 2019 blog, covering day 1, it’s posted here. Technology and Manufacturing Trends Day 2 started with a keynote about the magic n... »

Packaging: Consumer Solutions Adapted for Automotive Applications
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Packaging: Consumer Solutions Adapted for Automotive Applications

“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing signific... »

IFTLE 402: Advanced Packaging Underfills; JEDEC Updates HBM Memory Standard; Intel Foundry Business
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IFTLE 402: Advanced Packaging Underfills; JEDEC Updates HBM Memory Standard; Intel Foundry Business

Continuing our look at presentations from the recent 2018 IWLPC conference, let’s look at the Jiw Pai Henkel presentation on advanced packaging underfills. Henkel – Underfill Options for Advan... »

Rudolph Technologies Receives Orders for Over $15 Million from Major Memory Manufacturer

Wilmington, Mass. (January 15, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for over $15 million of legacy and new process control systems from a memory... »

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