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Tech Round-up from ECTC 2018
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Tech Round-up from ECTC 2018

For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather than the technology corner, as part of our media trade. We consider it to be prime rea... »

Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…
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Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…

Despite a valiant effort by the ECTC committee to integrate design topics into this year’s agenda, the number of empty seats spoke volumes: Including two plenary sessions on design-focused topics wa... »

Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology
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Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology

The special Tuesday session at ECTC 2018 took a look at new methods and applications for assembly technology to accommodate the needs of heterogeneous integration at the system level. The session was ... »

Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018
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Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018

There’s fact, and there’s perception. The messages people carry away from conferences are not only influenced by what they hear from the speakers, but also from the conversations they have... »

Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s a network storage device, net... »

The Heterogeneous Integration Roadmap Explained by Bill Chen
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The Heterogeneous Integration Roadmap Explained by Bill Chen

Festivities at ECTC 2018 kicked off May 29, 2018, with a full-day Heterogeneous Integration Roadmap (HIR) Workshop. This workshop was a continuation of an ongoing series that have been scheduled along... »

ECTC 2018 Paves the Path to Heterogeneous Integration
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ECTC 2018 Paves the Path to Heterogeneous Integration

For nine years, my fellow 3D InCites bloggers and I have been evangelizing about the wonders the microelectronics industry can achieve with innovations in 3D, advanced packaging, and other heterogeneo... »

The Advanced Packaging Industry is on the Move
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The Advanced Packaging Industry is on the Move

Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the developm... »

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received an order for its EVG®120 aut... »

Thermal Metamaterials for Advanced Packaging Applications from Stanford University
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Thermal Metamaterials for Advanced Packaging Applications from Stanford University

Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials with low thermal conductivity also exist, or are easily ... »

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC A... »

bitcoin

Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry

Bitcoin, a cryptocurrency built on blockchain, has become one of the hottest topics to hit the semiconductor news feeds and the conference circuit since the iPhone. Why? Because this code-based techno... »

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity
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EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has started construction work for the next... »

2018 TSMC Technology Symposium: Listen – Analyze – Act

2018 TSMC Technology Symposium: Listen – Analyze – Act

May 1st is a holiday in many countries, but not in the U.S. and not for TSMC. A very professional TSMC team and many of its Open Innovation partners demonstrated recent accomplishments to a gathering ... »

Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 

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Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 


Digital imaging has come a long way since its first consumer implementation in digital cameras to replaced film cameras in the early 21st century. In fact, digital imaging technologies have become so ... »

There’s a Fan-out for That
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There’s a Fan-out for That

Long gone are the days of the “killer app” and the notion that a single device market like personal computers (PCs) or smartphones alone can make or break the semiconductor industry. In fact, whil... »

SEMI Alliance
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Strategic Partnership with ESD Alliance Extends SEMI’s Reach to Semiconductor Design

On Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System Design (ESD) Alliance, representing the design commu... »

Kamel Ait-Mahiout Appointed as CEO of UnitySC
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Kamel Ait-Mahiout Appointed as CEO of UnitySC

Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced that its board of directors has a... »

Implementing High-Density Advanced Packaging for OSATs and Foundries
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Implementing High-Density Advanced Packaging for OSATs and Foundries

Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in response to system scaling demands. These innovations... »

Concept for 3-dimensional stacking of Flash devices. A thin film field effect transistor with a silicon nitride as charge reservoir and a tunnel oxide. A.J. Walker et al., VLSI Symposium, 2003.
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The Future of Non-volatile Memory

Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above is a concept for 3D stacking of Fl... »

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