3D Topics

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story
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How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story

The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US are women. For racial diversity, the si... »

Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging
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Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging

Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging,” written by... »

TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters req... »

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading global semiconductor foundry, UMC. This strategic partnership wil... »

Striking the Right Chord for Chiplet Integration
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Striking the Right Chord for Chiplet Integration

The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is dou... »

It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018
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It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018

Emerging technologies like artificial intelligence (AI), machine learning (ML) are driving more than just the semiconductor market. They also drove the conversations I had with everyone I spoke with a... »

Volumes Matter and Other Conversations from SEMICON West 2018
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Volumes Matter and Other Conversations from SEMICON West 2018

The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things (IoT) devices. And suddenly, semiconductors are the hottest gam... »

Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems
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Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems

PLAINVIEW, New York, July 9, 2018 – Veeco Instruments Inc. (Nasdaq: VECO) today announced that one of the world’s leading memory chip manufacturers has ordered multiple AP300™ lithography system... »

SEMICON West Confirms:  AI is the New Killer-app for Semiconductors
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SEMICON West Confirms:  AI is the New Killer-app for Semiconductors

SEMICON West (San Francisco, July 10 to 12) confirmed that our industry’s rapid growth will continue. Machine learning (ML) and artificial intelligence (AI) will be the core technologies for a wide ... »

Why We need Lower Cost TSVs and How to Get Them

Why We need Lower Cost TSVs and How to Get Them

Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between dies at extremely low power dissipation. Used for years in micr... »

New Defect Inspection Systems Address Process and Tool Monitoring Challenges

New Defect Inspection Systems Address Process and Tool Monitoring Challenges

MILPITAS, Calif., July 10, 2018—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring during silicon ... »

What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?
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What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?

The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should keep it simple. When it comes to heterogeneous integration no... »

SEMICON West 2018: Smart Starts Where?
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SEMICON West 2018: Smart Starts Where?

Well, that was interesting. SEMICON West 2018 just wrapped up, and I’m not quite sure what just happened. This year’s event was… for lack of a better word… different. All I could think of as I... »

 Latest Abatement System Installation Marks a Milestone of Success for Edwards

 Latest Abatement System Installation Marks a Milestone of Success for Edwards

SAN FRANCISCO – SEMICON West (11 July 2018) – Edwards Vacuum, a leading manufacturer of vacuum and abatement solutions, announces a milestone of 10,000 Edwards inward fired combustion abatemen... »

3D InCites Top Picks for SEMICON West 2018

3D InCites Top Picks for SEMICON West 2018

Ok folks. It’s that time of year again. SEMICON West 2018 is upon us. By the time you read this – IF you get the time to read this – it’s almost curtain time. Everything that needs to be prepp... »

Are you Team 3D, 2.5D or 2DS/2DO?

Are you Team 3D, 2.5D or 2DS/2DO?

The Heterogenous Integration Roadmap Committee wants to create a new nomenclature that does away with 2.5D. Instead, the industry will refer to 2D, 2D enhanced (formerly 2.5D) and 3D architectures. 2D... »

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available... »

DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain
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DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain

This year’s Design Automation Conference (DAC 2018) was held at Moscone West, San Francisco, CA. On three levels, about 175 exhibitors showed their capabilities and discussed market needs. Our indus... »

An Update on the Fan-out Panel-Level Packaging Consortium
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An Update on the Fan-out Panel-Level Packaging Consortium

One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out panel-level packaging (FOPLP).  In theory, the concept of taking fan-out from... »

TechSearch International Analyzes Potential for 3D Sensing Modules
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TechSearch International Analyzes Potential for 3D Sensing Modules

Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection, gesture control, automotive/industrial 3D mapping, and proximity applicatio... »

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