3D Topics

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s ... »

Sir Walter Raleigh towered above the 50th IMAPS Symposium
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Sir Walter Raleigh towered above the 50th IMAPS Symposium

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed ... »

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices
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imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and Analog Devices, Inc. (ADI), the leading globa... »

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy
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EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and SwissLitho AG, a manufacturer of novel nanolithography tools, ... »

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore
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European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

There’s no doubt about it. Imaging sensor technologies have come a long way since the introduction of the digital camera. In fact, according to Gartner, image-based sensors will be the single larges... »

EDPS 2017: NOT the usual Electronic DESIGN Process Symposium
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EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fa... »

Spotlight on the European MEMS and Sensors Technology Showcase
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Spotlight on the European MEMS and Sensors Technology Showcase

As it’s difficult to be in two places at one time, I was happy to see that the organizers of the co-located European MEMS and Sensors Summit/Imaging and Sensors Summits made sure two featured tr... »

Making Sense of MEMS and Sensors at the MEMS/Imaging Sensors Summits
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Making Sense of MEMS and Sensors at the MEMS/Imaging Sensors Summits

Last week, I had a whirlwind trip to Grenoble, France: 3 days, 2 summits, and 1 supercool paragliding festival, Coupe Icare, on the side – all filled with “Aha!” moments. Ironically, the paragli... »

CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVD

CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVD

Montbonnot, France, 20th of September 2017  ̶  KOBUS, a leading equipment supplier in advanced deposition solutions, and Leti, a technology research institute of CEA Tech, are pursuing their long-t... »

Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow
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Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow

Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is rapidly gaining popularity in the market. But what ... »

Image Courtesy of TSMC Ltd.

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share so... »

 Integrated Solid-state Capacitors Based on Carbon Nanostructure 
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 Integrated Solid-state Capacitors Based on Carbon Nanostructure 

The constant demand for miniaturization, added functionality and increased performance of electronic devices systematically drives higher integration by adding more devices on a single chip. In additi... »

Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards
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Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards

In the AMD-NVIDIA battle, System Plus Consulting’s experts continue to pursue innovation and monitor progress. At the beginning of the year, AMD was pleased to announce its forthcoming graphics proc... »

Temporary Bonding and Debonding Technologies for Fan-out Wafer-Level Packaging
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Temporary Bonding and Debonding Technologies for Fan-out Wafer-Level Packaging

Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within an affordable package. It enables smaller footprints, higher i... »

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing
EV Group - Wafer-Level Optics Manufacturing

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received multiple orders for its comprehens... »

Fan-out Packaging Confirms its Success Story
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Fan-out Packaging Confirms its Success Story

Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole). Will the fan-out market grow... »

Rudolph Announces Multiple Customers’ Acceptance  of its Firefly Inspection System
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Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System

Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple se... »

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate... »

Technology Showcase Finalists Revealed for European MEMS & Sensors Summit
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Technology Showcase Finalists Revealed for European MEMS & Sensors Summit

GRENOBLE, France ─ August 28, 2017 – SEMI®, with its Strategic Association partner MEMS & Sensors Industry Group® (MSIG), today announced its shortlist of competitors for the Technology Show... »

MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE
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MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE

North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems will be exhibiting at the 19th C... »

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