3D Topics

Living the Dream at SEMI’s Industry Strategy Symposium
Screen Shot 2018-01-22 at 9.01.04 AM Screen Shot 2018-01-22 at 9.41.04 AM Screen Shot 2018-01-22 at 9.41.48 AM IMG_7781 2 IMG_7786 2

Living the Dream at SEMI’s Industry Strategy Symposium

As I noted in my day one coverage of SEMI’s Industry Strategy Symposium (ISS 2018), which took place last week at the Ritz-Carleton Hotel in Half Moon Bay, CA, this was the first time I’d been inv... »

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth

HALF MOON BAY, Calif. — January 17, 2018 — The SEMI Industry Strategy Symposium ( SEMI ISS) opened yesterday with the theme “Smart, Intuitive & Connected: Semiconductor Devices Transforming... »

Notes from SEMI’s ISS 2018, Days 2 and 3
IMG_7811 Screen Shot 2018-01-19 at 8.31.21 AM

Notes from SEMI’s ISS 2018, Days 2 and 3

The remaining two days of SEMI’s ISS 2018 dawned foggy and damp, making it a heck of a lot easier to head to the ballroom for a day and half full of inspiring talks versus ditching it all to ans... »

Notes from SEMI’s ISS 2018, Day One

Notes from SEMI’s ISS 2018, Day One

SEMI’s Industry Strategy Symposium (ISS) has been on my conference bucket list for some time, so when I was offered a press pass to attend ISS 2018, there was no question about attending. One day in... »

Using Co-Design to Ensure Multi-Fabric System-Design Success
mentorpaper_98617 wp98617

Using Co-Design to Ensure Multi-Fabric System-Design Success

Today’s SoCs, multi-core CPUs and GPUs with their high performance, high bandwidth interconnect interfaces put demanding challenges across the entire system signal path, requiring system-wide optimi... »

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2
3dasip2-1 3dasip2-2 3dasip2-3 3dasip2-4 3dasip2-5 3dasip2-6 3dasip2-7 3dasip2-8

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or impro... »

2018 Outlook for Advanced Packaging Materials
Ram Trichur Bio Photo

2018 Outlook for Advanced Packaging Materials

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing invest... »

Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award
lucvandenhove

Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award

MILPITAS, CA — January 11, 2018 — SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, i... »

The 14th 3D ASIP Conference Addresses a Spectrum  of 0pportunities, Part 1
3DASIPFeature 3DASIPFig1 3DASIPFig2 3DASIPFIg3 3DASIPfig4

The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1

Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and Packaging conference (3D ASIP Confe... »

TechSearch International Analyzes New Automotive Packaging Trends

TechSearch International Analyzes New Automotive Packaging Trends

More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for advanced driver assistance systems (ADAS). System design, packag... »

New SEMI Japan President to Drive SEMI 2.0 in Japan
vcsPRAsset_3390533_64541_6fda1212-cccc-435a-b06a-40b5ff58ccfc_0

New SEMI Japan President to Drive SEMI 2.0 in Japan

SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO Ajit Manocha, Hamajima assumes profit and loss (P&L) responsibility ... »

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017
IMAPS 2017 Print Imperial Palace Tokyo Bay Area Ridge Merlion

Continental Drifts or Tectonic Shifts? Advanced Packaging 2017

That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at 10:32 pm, a magnitude 3.9 temblor near Alum Rock I thought could have been my neig... »

Holiday Greetings from 3D InCites!
3DIC_Christmas Card_Thumb_RGB

Holiday Greetings from 3D InCites!

Did you ever wonder how much easier Christmas Eve would be for Santa in a world enabled by heterogeneous integration? This video shows our vision. Enjoy! Warm wishes for a Merry Christmas and Happy N... »

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ
DCIM100MEDIADJI_0029.JPG Photo 1 2017_12_Testrooms_3

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

  EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction and open... »

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo
EVG810LT LowTemp Plasma Activation System

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order from the University of To... »

Trymax and AST China Partner to Distribute and Support Customers in China

Trymax and AST China Partner to Distribute and Support Customers in China

NIJMEGEN, The Netherlands and Beijing, China (Oct. 10, 2017) – Trymax Semiconductor Equipment BV and AST China announced today that they have entered into a distribution and service agreement fo... »

The Truth About Moore’s Law is Revealed at 3D ASIP 2017
IMG_7291 2

The Truth About Moore’s Law is Revealed at 3D ASIP 2017

I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the title, introduction, and conclusion. At most, they skim the res... »

Electromagnetic Simulation for Electronic Systems
mentorpaper_85475 Electromagnetic Simulation for Electronic Systems

Electromagnetic Simulation for Electronic Systems

Packages and boards are playing an increasing role as a way to increase speed and density while reducing power and form factor of electronic systems. This is part of a trend called sometimes “more t... »

TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has e... »

When It Comes to Robots and AI, We Draw the Line at Beer
IMG_5244 IMG_6966 53247590563__F0A605F0-0974-45EE-A7DC-9CA2CE3A6CD7 IMG_7237

When It Comes to Robots and AI, We Draw the Line at Beer

As one of the current key drivers of the semiconductor industry, the development of robots with artificial intelligence has been on my mind quite a bit recently, second only to autonomous vehicles. I ... »

Page 1 of 57123»