3D Topics

Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s a network storage device, net... »

Advanced Heterogeneous Packaging Solutions for High Performance Computing
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Advanced Heterogeneous Packaging Solutions for High Performance Computing

Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial intelligence (A... »

Update on  3D X-ray and DBI Technology for Advanced and 3D Packaging
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Update on 3D X-ray and DBI Technology for Advanced and 3D Packaging

The Microelectronics Packaging & Test Engineering Council (MEPTEC) held its monthly meeting at SEMI in Milpitas on April 10.  Two speakers outlined their companies’ capabilities and demonstrate... »

IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging
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IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging

Silicon Carbide (SiC) is a wide bandgap (WBG) material that has advantages when compared to silicon (Figure 1).  For the same die size and thickness, WBG devices provide higher breakdown voltage, cur... »

Reliable Process Control Solutions for the Growing Power Device Market
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Reliable Process Control Solutions for the Growing Power Device Market

The expected increase of the power device market, with a compound annual growth rate (CAGR) of more than 10% — and more particularly insulated-gate bipolar transistor (IGBT) products for automotive ... »

Addressing the Challenges of Surface Preparation for Advanced Wafer Level Packaging
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Addressing the Challenges of Surface Preparation for Advanced Wafer Level Packaging

The importance of surface preparation and wafer cleans during semiconductor device manufacturing is migrating from front-end wafer processing to back-end wafer level packaging processes. To get a clea... »

IFTLE 409: ST Micro Studies Hybrid Bonding Reliability; TSMC 2019 Packaging Revenue
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IFTLE 409: ST Micro Studies Hybrid Bonding Reliability; TSMC 2019 Packaging Revenue

Continuing our look at the 2019 SEMI 3D and Systems summit in Dresden, we look at presentations on advanced packaging platforms and hybrid bonding reliability. Systems Plus Romain Fraux of System Plus... »

Advanced Packaging: Game Changer for Semiconductor Revolution
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Advanced Packaging: Game Changer for Semiconductor Revolution

Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & c... »

Arizona SEMI Breakfast Forum Focuses on Sensors Enabling a Connected World
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Arizona SEMI Breakfast Forum Focuses on Sensors Enabling a Connected World

Why are sensors not on the same growth trajectory as CMOS? In the face of a shaky global economy, where are the opportunities coming from? How will doctors practice medicine five years from now and ho... »

IFTLE 408: Plasma Dicing ; Intel compares High-density Packaging for HI
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IFTLE 408: Plasma Dicing ; Intel compares High-density Packaging for HI

Plasma Dicing Advanced packaging is bringing with it new ways to separate die from the wafer. In the past, wafer dicing was traditionally carried out using conventional dicing “saw”. However, this... »

The 5G Revolution is Pushing Innovations for RF front-end SiP
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The 5G Revolution is Pushing Innovations for RF front-end SiP

Without a doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular and connectivity. It is clear for everyone that 5G will totally redefine h... »

Trymax Launches New UV Curing and Charge-Erase Product Line
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Trymax Launches New UV Curing and Charge-Erase Product Line

Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, announces the addition of an ultraviolet (UV) curing and charge-erase product line to i... »

CoolCube™: More than a True 3D VLSI Alternative to Scaling
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CoolCube™: More than a True 3D VLSI Alternative to Scaling

Almost four years ago, we published an article titled “CoolCube™: A True 3DVLSI Alternative to Scaling” on 3D InCites. It described the concept of stacking layers of transistors sequentially on ... »

IFTLE 407: Intel Lakefield Uses 3D Stacking; SEMI Europe’s 3D & System Summit
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IFTLE 407: Intel Lakefield Uses 3D Stacking; SEMI Europe’s 3D & System Summit

At CES 2019, Intel previewed a new client platform, code-named “Lakefield”. It featured the first iteration of its new innovative Foveros 3D packaging technology. The Lakefield stacked module ... »

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing
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EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconducto... »

Celebrating 25 Years of Advanced Packaging Innovation: Part 2
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Celebrating 25 Years of Advanced Packaging Innovation: Part 2

Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning with the establishment of 3D InCites in 2009. The first conference I... »

Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019
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Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019

Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes on wafer and panel formats. The JetStep sys... »

Celebrating 25 Years of Advanced Packaging Innovation: Part 1
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Celebrating 25 Years of Advanced Packaging Innovation: Part 1

After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS DPC) March5-7,2019, in Fountain Hills, Arizona, I am once again reminded why... »

Trymax Signs Strategic Financial Partnership with NIBC Bank

Trymax Signs Strategic Financial Partnership with NIBC Bank

Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma-based equipment and solutions for semiconductor manufacturers, is pleased to announce NIBC Bank as a new strategic financial partn... »

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing
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EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for ... »

Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging Conference
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Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device Packaging Conference

Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual IMAPS Device Packaging Conference, held March 5-7, 2019, in Fountai... »

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