3D Topics

Replacing NMP: Are You Ready?
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Replacing NMP: Are You Ready?

NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an effective and versatile cleaning agen... »

TechSearch International Explores Power Device Packaging and Assembly Trends

TechSearch International Explores Power Device Packaging and Assembly Trends

Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments from 2017 to 2021 for power device ... »

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing
EVG BONDSCALE Automated Production Fusion Bonding System

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all-new BONDSCALE™ automated production fus... »

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications
EV Group GEMINI Automated Production Wafer Bonding System - 200 mm

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the ... »

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies
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Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High-Performance ... »

IFTLE 399: Polymer Dielectric Updates from HD Micro, Taiyo Ink, Toray and MicroChem
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IFTLE 399: Polymer Dielectric Updates from HD Micro, Taiyo Ink, Toray and MicroChem

Who was Madeline on Halloween? Before we start more tech coverage of IMAPS 2018 with a look at polymer dielectric advancements, long time readers know that you are due a Halloween update on my grandda... »

Seen on the Scene at Electronica 2018
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Seen on the Scene at Electronica 2018

This was my first Electronica, and all I can say is – It is massive. It covered everything to do with the electronics supply chain, from chip design to the chip itself, to the package, component, su... »

Seen on the Scene at SEMICON Europa 2018
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Seen on the Scene at SEMICON Europa 2018

SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment, process, and material suppliers, the other 17 wouldn’t have any ... »

Designing and Integrating MCM/SIP Packages into Systems PCBs
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Designing and Integrating MCM/SIP Packages into Systems PCBs

The challenge of designing smaller, cost-effective systems that require additional processing and performance power led to 3D chip stacking of bare die and a new approach to packaging known as SiP (sy... »

Closing Out My 2018 Conference Season With SEMICON Europa and Electronica
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Closing Out My 2018 Conference Season With SEMICON Europa and Electronica

In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS and sensors, two on advanced packaging, and one that tied everything all together. A... »

IFTLE 398: Samsung’s 256Gb 3DS (TSV-Stacked) RDIMM; IMAPS 2018 in Pasadena
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IFTLE 398: Samsung’s 256Gb 3DS (TSV-Stacked) RDIMM; IMAPS 2018 in Pasadena

Samsung at the Leading Edge At the recent Samsung Tech Day, the company unveiled several new technologies: Their 7nm extreme ultraviolet (EUV) process node from Samsung’s foundry business SmartSSD ... »

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro all surface inspectio... »

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district... »

EDA Design Tools/Flows Targeting WLP Featured at IWLPC 2018
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EDA Design Tools/Flows Targeting WLP Featured at IWLPC 2018

Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry exper... »

Trymax Turns 15 and Celebrates Success at SEMICON Europa 2018

Trymax Turns 15 and Celebrates Success at SEMICON Europa 2018

NIJMEGEN, THE NETHERLANDS – November 08, 2018. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, has reached a milestone this month... »

The MSEC 2018 Technology Showcase: Who Owns the Data?
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The MSEC 2018 Technology Showcase: Who Owns the Data?

The competition was fierce and the stakes high for the annual MSEC 2018 technology showcase. which took place during the MEMS and Sensors Executive Congress, in Napa CA. The winner gets a free table n... »

Wally Rhines Discusses the Importance of EDA and Design at IWLPC 2018
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Wally Rhines Discusses the Importance of EDA and Design at IWLPC 2018

At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at the DoubleTree Hotel in San Jose from October 23 to 25... »

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

Wilmington, Mass. (November 1, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the availability of its NovusEdge™ system for edge, notch and backside inspection of unpatterned wafer... »

MSEC 2018 Keynote Speaker Examines the Growing Importance of Cybersecurity
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MSEC 2018 Keynote Speaker Examines the Growing Importance of Cybersecurity

Just over a year ago, Napa Valley was in flames, and the annual MEMS and Sensors Executive Congress (MSEC) had to be relocated from the Silverado Resort and Spa, located on the fringes of the Atlas Fi... »

Talking Nerdy with Exhibitors at IWLPC 2018
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Talking Nerdy with Exhibitors at IWLPC 2018

With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have ... »

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