3D Topics

Will Fully Autonomous Vehicles Solve Global Transportation Problems?
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Will Fully Autonomous Vehicles Solve Global Transportation Problems?

Automotive electronics, with the Holy Grail being fully autonomous vehicles, is currently being touted as one of the biggest growth drivers for the semiconductor industry. So much so, that every event... »

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High-Speed Die ... »

3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law
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3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law

In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS imagers you find in your smartphone, the ... »

Solving the Design and Verification Challenges of High Density Advanced Packaging
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Solving the Design and Verification Challenges of High Density Advanced Packaging

Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve product quality and design efficiency through the use of new design ... »

IMAPS 2017 SiP Conference Takes on Sonoma
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IMAPS 2017 SiP Conference Takes on Sonoma

California’s Wine Country attracts visitors from all over the world. They can enjoy the scenic countryside, historic places, golf courses, tennis courts, gambling and of course great wine and excell... »

MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained
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MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained

Multichip module (MCM),  system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least,... »

Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions
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Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions

I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for faster production ramp-ups, will force our industry to pay even mor... »

Mission Impossible? Not for SEMI!
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Mission Impossible? Not for SEMI!

San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at this picture of the South Hall you may ask yourself: “... »

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan
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EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its... »

Xperi Sets Out to Enable Immersive Experiences
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Xperi Sets Out to Enable Immersive Experiences

Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was Tessera, well-known throughout the advanced packaging sector of the semiconductor industr... »

The Brighter Side of SEMICON West 2017
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The Brighter Side of SEMICON West 2017

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was in my inbox in a recent edition of Semiconducto... »

SEMICON West 2017: The Semiconductor Industry at a Young 50
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SEMICON West 2017: The Semiconductor Industry at a Young 50

The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over again during SEMICON West 2017 I heard some variation of the phrase “We’re just gett... »

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)

In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions during SEMICON West 2017. For part two, I spoke with equipment an... »

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion sensors, ba... »

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging
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EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

  Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio of materials solutions for advanced semiconductor ma... »

2017 3D InCites Awards Ceremony and Reception: A Retrospective

2017 3D InCites Awards Ceremony and Reception: A Retrospective

Once again this year, the industry came out in full force to honor excellence in heterogeneous integration at the 2017 3D InCites Awards Ceremony and Cocktail Reception to benefit KidSizeCures for chi... »

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)At SEMICON West 2016, the big story was the end of the ITRS Roadmap for dimensional scaling according to Moore’s Law and the... »

NXP and Nepes Create Value with their First FO PoP SiP for IoT

NXP and Nepes Create Value with their First FO PoP SiP for IoT

Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and cost reduction to the final products. The advanced packaging industry with its ... »

Three Patents Granted to Smoltek

Three Patents Granted to Smoltek

Smoltek, a leading Swedish nanotech company in the semiconductor industry, has expanded its patent portfolio in Asia the last month. New patents in Japan and South Korea are important milestones to in... »

What is Driving the Growth of the Glass Material Market in Semiconductor Manufacturing?
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What is Driving the Growth of the Glass Material Market in Semiconductor Manufacturing?

Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role in the semiconductor industry. It is today already implemented as a matur... »

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