3D In-Depth

Highlights from the 2017 European 3D Summit

Highlights from the 2017 European 3D Summit

The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging, 2.5D and 3D IC technologies being developed to achieve next-generation device requirements. In addition to informative sessions, attendees enjoyed some camaraderie, as we’ve all been meeting for a number of years to get 3D integration off the ground. The highlight ... »

2017 European 3D Summit: Making Advanced Packaging Great Again

2017 European 3D Summit: Making Advanced Packaging Great Again

Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced packaging. One thing that I’ve heard over the past year is that as 3D technologies move into manufacturing, it’s become difficult to recruit speakers who have fresh content. Notoriously slow to evolve, the 3D integration conversation hasn’t changed too much over the pas... »

Top Ten Reasons to Attend the 2017 European 3D Summit

Top Ten Reasons to Attend the 2017 European 3D Summit

It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly known as the 3D TSV Summit for editions 1-3), and it’s shaping up to be a stellar event. If you are still wavering about attending, here are 3D InCites’ top ten reasons to attend: 10: The opportunity to visit beautiful Grenoble, and taste the local fare with your industry colle... »

13th 3D ASIP Conference Demonstrates Manufacturer’s Commitment

13th 3D ASIP Conference Demonstrates Manufacturer’s Commitment

The 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference is one of the biggest (if not THE biggest) event focused exclusively on the 3D IC family of technologies. The December 2016 event was held even closer to San Francisco airport than in previous years. From the lobby of the SFO Marriott Hotel, we could see planes taking off and landing.  Every smooth touch-down an... »

IEDM 2016 Demonstrates Device Physics For The Semiconductor Industry

IEDM 2016 Demonstrates Device Physics For The Semiconductor Industry

In the past few months I have been reading a lot of depressing news about our semiconductor industry’s declining growth rates, shrinking profit margins, many consolidations, as well as many articles about why, when and how following Moore’s Law will be only justified for extremely high-volume designs. Sounds kind of depressing and worrisome for semiconductors, however, last week’s Internatio... »

3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition

3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition

In less than two weeks, the 13th Annual Architectures for Semiconductor Integration and Packaging Conference (3D ASIP) kicks off at the Marriott San Francisco Airport, this year under the auspices of the International Microelectronics and Packaging Society (IMAPS). Long heralded as THE conference for 2.5D and 3D integration, the conference was created by the Tech Venture Forum at RTI International... »

What’s New for the 2017 European 3D Summit

What’s New for the 2017 European 3D Summit

For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over those years, beginning its tenure as the 3D TSV Summit, then last year re-branded as the 3D Summit in acknowledgment that not everything in 3D has to do with through silicon vias (TSVs). I’ve been honored to attend the four previous years, and have found the event to consis... »

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016) was less on MEMS development and more about the fun part: how we put these technologies to work for us. As Stefan Finkbeiner, Bosch Sensor Systems so eloquently put it, “Nobody wants to buy an accelerometer anymore, they want a step counter.” So how do we capture the value... »

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging

The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a theme of “Bridging the Interconnect Gap”, as the industry faces new challenges due to the onslaught of Big Data brought about by the Internet of Things (IoT). To provide vision on how best to address these challenges using advanced packaging technologies, the IWLP... »

MEMS & Sensors Industry Group Reveals Tech Showcase Finalists

MEMS & Sensors Industry Group Reveals Tech Showcase Finalists

MEMS & Sensors Industry Group (MSIG)’s annual MEMS & Sensors Technology Showcase at MEMS & Sensors Executive Congress® 2016 (November 9-11, 2016 in Scottsdale, AZ) highlights some of the newest and most unique MEMS/sensors-enabled applications in the industry. MSIG today announced the shortlist of finalists who will compete for the title of “winner” at this year’s even... »

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