SiP

Packaging, Innovation, and Our Application-Driven World

Packaging, Innovation, and Our Application-Driven World

MEPTEC lunches, now known as the MEPTEC / IMAPS / SEMI Semiconductor Speaker Series Luncheon sponsored by Chip Scale Review, are on again in Silicon Valley. At the most recent lunch  in mid-March 2018, I was pleased to see that it was none other than Rich Rice, VP Business Development, ASE US, delivering his view on Packaging Innovation for our Application-Driven World Rich’s thesis: that, desp... »

Designing and Integrating MCM/SIP Packages into Systems PCBs

Designing and Integrating MCM/SIP Packages into Systems PCBs

Traditionally, MCMs (Multi-Chip-Modules) were a way of integrating several ASICs, or ASICs and memory, into a lower-cost, smaller form-factor, robust module that was an alternative to a single large SoC. Instead of integrating all or most of the systems PCBs needs onto a large and complex single SOC, you could design and fabricate smaller, high-yielding ASICs (Figure 1) and make them behave like a... »

IMAPS 2017 SiP Conference Takes on Sonoma

IMAPS 2017 SiP Conference Takes on Sonoma

California’s Wine Country attracts visitors from all over the world. They can enjoy the scenic countryside, historic places, golf courses, tennis courts, gambling and of course great wine and excellent food. How well can a highly technical conference compete with all these “distractions”? Please read about the sessions I attended and judge for yourself! The Inaugural Conference and Exhibitio... »

MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained

MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained

Multichip module (MCM),  system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least, a book written about them. However, herein I would like to give these technologies very simple descriptions. if you don’t mind. MCM MCM integrates different chips and discrete components side-by-si... »

NXP and Nepes Create Value with their First FO PoP SiP for IoT

NXP and Nepes Create Value with their First FO PoP SiP for IoT

Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and cost reduction to the final products. The advanced packaging industry with its 7% CAGR between 2016 and 2022 (in revenues)¹ is undoubtedly a dynamic sector where innovations play a key role. NXP’s SCM-i.MX6Q fan-out package-on-package system-in-package (FO PoP SiP) with boot ... »

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Wilmington, Mass. (May 23, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep S Lithography System for fan-out panel-based advanced packaging processes. The system, which will ship in June 2017 to an outsourced assembly and test (OSAT) facility based in Asia, will be used to produce system-in-package (SiP) products that combine sensor, pro... »

More-than-Moore 2.5D and 3D SiP Integration

More-than-Moore 2.5D and 3D SiP Integration

A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available. The book addresses the current status of More-than-Moore system-in-package (SiP) technologies and explores the technical and business tradeoffs for deploying these options in high volume commercial IC products. We’re pleased to provide an excerpt of the preface: “There is a lot of... »

SiP Impact, Smartphone Market Saturation… What is the Future of Fan-in Packaging?

SiP Impact, Smartphone Market Saturation… What is the Future of Fan-in Packaging?

Fan-in packaging has been a successful and steadily growing platform for over a decade. However, fan-in packaging should face a challenging future, announces Yole Développement (Yole), the “More than Moore” market research and strategy consulting company. Indeed, despite unchanged market drivers, Fan-In packaging is showing an uncertain future with a slowing down smartphone market and the gro... »

Convergence on the “Big Five”: Focus on Laminate-based Advanced SiP

Part four in a five-part series While many industry experts have long predicted the demise of Moore’s law, it’s only in the past few months that it seems we have exhausted current CMOS scaling methods. While it’s likely that scaling approaches will resume in the future as new materials, processes, and tools are developed, the reality is that these solutions are still in the early stages of d... »

Executive Viewpoint: The New Advanced Packaging Landscape

Executive Viewpoint: The New Advanced Packaging Landscape

You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had the opportunity to interview Dongkai Shangguan, then CEO of the National Center for Advanced Packaging (NCAP) in Wuxi, China, which he helped found along with nine investors. They talked about lots of timely topics: the importance of industry-wide collaboration to bring down ... »

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