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The Role of Redistribution Layers (RDL) in Advanced Packages
IFTLE 633: What’s Inside Apple’s A20 Chip? Also: Introducing Intel EMIB-T
Novel Semi-additive Process Streamlines RDL to Address Industry Roadmaps and Reduces Cost
Yield and Cost Analysis of a Face-to-Back Chip-on-Wafer 3D Package
Revealing the Invisible: Optimized nano-CT Case Studies in Advanced Packaging
IFTLE 632: Deca and IBM Partner to Produce Fan-Out Interposer in North America
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#Glass Interposers View all
IFTLE 613: Solder Joint Reliability of Glass Core Substrate Assemblies
We have seen considerable global activity focused on developing glass core substrate assemblies and interposers, yet, as some of us...
IFTLE 512: SKC Announces Glass Substrates for BGAs; TSMC Expands Packaging
Over the past several years many companies have been extolling the virtues of glass as a packaging medium. Corning Glass,... Glass-based Solutions for Packaging are Here
A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring...
Products on Parade in the Exhibits at IWLPC 2019
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out...
Tech Round-up from ECTC 2018
For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather...
Takeaways from the 5th Annual IEEE Global Interposer Technology Workshop
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC...
Putting Their Money on Glass Interposers
While the jury is still out on whether glass interposers will play a large or niche role in the interposer...
3D Technology Snapshots from IMAPS 2014
This year’s IMAPS International Symposium purported to have “the most interposer and 3D content under one roof.” I’m not sure...
Lithography Challenges for 2.5D Interposer Manufacturing
In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and the first products using this... Glass Substrates for Advanced Packaging
Glass has many properties that make it an ideal substrate for interposers such as: ultra-high resistivity and low electrical loss,...Community Members
