Design View all

DAC 2020 Addresses Chiplet Design and Integration

In the early days of ASIC technology, only logic library elements and basic I/Os with up to 10s of transistors were available for customizing gate arrays and/or logic functions in standard cell chips. And then, “megacells” (a.k.a. Functional Blocks, Semiconductor IP Blocks), comprised of 100s, even 1000s, and more transistors...

Devices View all

How AiP Technology Helps Enable 5G and More

For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
Intel@14nm+@Skylake@Kabylake-S(DualCore)@Celeron_G3930@SR35K______DSC02678

System-on-Chip Disintegration is Underway

We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...

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