CEA-Leti has opened a complete 300mm fab extension dedicated to 3D-integration applications. Final equipment installations will continue through to the end of this year with an inauguration event planned in January, 2011.

The integration line includes lithography, metallization, deep etching, dielectric deposition, wet etching and packaging tools that will be available for Leti’s customers and partners around the world.

The line will complement Leti’s 3D-integration toolbox, which already includes through-silicon vias(TSVs), alignment, bonding, grinding, thinning, planarization, bumping, micro-inserts and design capabilities and mixed-signal IC applications.

“Leti is recognized as a key player in 3D integration R&D and this new line is a vital addition to our continuously expanding 3D capabilities,” said Laurent Malier, CEO of Leti. “It also will enable us to offer heterogeneous integration technologies to customers on 200mm and 300mm wafers.”

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