CEA Leti

3D VLSI is the New Active Interposer

3D VLSI is the New Active Interposer

 3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on the scene as monolithic 3D (M3D), or as Leti dubbed it: sequential 3D. In 2014, the French research institute officially introduced it as CoolCube™ because this version of the technology addressed the thermal issues that plagued early versions of M3D. This paved th... »

aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 Aspect Ratio TSVs

aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 Aspect Ratio TSVs

MASSY, France – Jan. 23, 2018 – aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 3D through silicon via (TSV) packaging and 2D interconnects, today announced that CEA-Leti has successfully fabricated TSVs at an unprecedented 12:1 aspect ratio and achieved 100% electrical yield using aveni’s Rhea copper seed. This study used 12:1 aspe... »

A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope

A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope

Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days during which we honored Gilles Poupon, the Advanced Packaging “Pope” of CEA Leti. Upon his retirement at the end of November 2017, somehow an era ends. I have known Gilles for quite a long time: He reminded of the first time we met. It was 2003 in Munich. Gilles was a member of the CEA delegatio... »

MEMS  Ascendant at IMAPS Device Packaging 2017

MEMS Ascendant at IMAPS Device Packaging 2017

Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at the recent IMAPS Device Packaging Conference were the acronyms FOWLP, FOPLP, and MEMS. That would be fan-out wafer level packaging, fan-out panel level packaging, and microelectromechanical systems, respectively. It wasn’t that IMAPS was a MEMS packaging conference in the... »

DAC 2016: There is More to Life than IC Design, Part 2

DAC 2016: There is More to Life than IC Design, Part 2

Part 1 of my DAC 53 reporting focused on this year’s really impressive keynotes, now posted on the DAC website, together with videos of other remarkable pavilion presentations, panels, interviews, demos, etc.…. Part 2 will cover a few highlights that I found very interesting and useful at DAC. Considering that this blog is being posted on 3D InCites, let’s talk about CEA Leti’s 3D network-... »

ECTC 2016: Is the Life after Moore’s Law?

ECTC 2016: Is the Life after Moore’s Law?

Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic Materials, gathered a prestigious group of senior executives from the world’s leading microelectronics research institutes to discuss Life after Moore’s Law. Panelists included Marie-Noelle Semeria, CEA-Leti; Dim Lee Kwong, IME; Luc van den hove, imec; CP Wong, NCAP; and Subu Iye... »

In Conversation with Yann Guillou About the SEMI European MEMS Summit 2015

In Conversation with Yann Guillou About the SEMI European MEMS Summit 2015

Yann Guillou, Membership & Business Development, SEMI Europe, talked with 3D InCites / 3D+ about the upcoming European MEMS Summit 2015, which will be held in Milan, Italy, on 17-18 September. 3D InCites / 3D+: Yann, thank you for taking the time to talk with us today about the European MEMS Summit 2015 SEMI is producing this year in Milan. You have as a theme for the summit Sensing the Planet... »

CoolCube™: A True 3DVLSI Alternative to Scaling

CoolCube™: A True 3DVLSI Alternative to Scaling

Stacking transistors on top of each other sequentially in the same front-end process flow is a concept that has been imagined to provide the semiconductor community with an alternative to the traditional scaling paradigm challenged by technical and cost roadblocks. LETI Advanced CMOS Laboratory introduced CoolCube™, a low-temperature process flow that provides a true path to 3DVLSI. »

SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology

SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology

Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI Newport, United Kingdom – June 24, 2014 – SPTS Technologies, a leading manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti... »

Rudolph Ships NSX 320 TSV Metrology System to CEA-Leti  for TSV Process Development

Rudolph Ships NSX 320 TSV Metrology System to CEA-Leti for TSV Process Development

Flanders, New Jersey (February 11, 2014)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today the sale of its first NSX® 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec Research Technology Institute (Nanoelec RTI) program, is developing three-dimensional integrated circuit (3DIC) technologies that use throug... »

Page 1 of 3123