Accelerating the Transition to Intel 18A for Secure National Security Microelectronics
Sep 22, 2026 · By Intel Foundry · 3D In-Depth, Processes and Technology, R&D and Collaboration
Latest Posts
VIEW Systems Labs – Applications Progress Around the World!
VIEW Micro Metrology is having a productive season in our systems labs in both the United States and Asia, as...
Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing
2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather...
Combining Technology Platforms and Integrating Complex Materials for New Applications
Heterogeneous integration is in many ways different from other research technology platforms. For one thing, the technology is mostly driven...
Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration
Multi-project wafer (MPW) programs have long been considered an economical way to integrate different IC designs from various teams to...
3D InCites Interview: RTI in 3D
While most of the research institutes in the US and Asia have been focused on commercializing 3D integration technologies for...
Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
Nano Utica gets $1.5B Infusion; Probably Good Die Revisited; Developments in Monolithic 3D
Word on the street is, New York will soon be known as Nano York, with all the money the state...
Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium
I admit, I always have my 3D glasses on at conferences. But even though the title of this week’s MEPTEC...
Dow Corning offers the Power of Silicone Technology
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview...
Interview with Fraunhofer IZM-ASSID’s Juergen Wolf: The Collaboration Grows
A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed...
EV Group: Never a Dull Moment
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with...
Interview with imec’s Ludo Deferm: Packaging Design Kits and Debond Solutions
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought...
Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization...
2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on...
EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013
Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST,...
Semi Trade Pubs Talk 3D, Just in time for SEMICON West
That Jan Vardaman, she’s so clever! I just finished reading her column on ECTC 2013 in Printed Circuit Design and... New Consortium for 2.5D Through-silicon Interposer Technology to Benefit Computer and Consumer Electronics Industries
A*STAR Institute of Microelectronics and Leading Semiconductor Partners combine research and market expertise to address industry challenges Singapore, 24 June...
2.5D Products and 3DIC Standards and Roadmaps Are On the Move
Naysayers be damned! Full commercialization for 3D ICs in smartphones may be a few years out, but that doesn’t dampen...
3D IC Reality Check
The good news: While forecasted dates for 3D IC volume manufacturing continues to be pushed out, clearly foundries and OSATS are...