Pallavi Jithendrriyan

About Pallavi

Pallavi is a PhD Student in Electrical Engineering at Arizona State University, focusing FEA-driven modeling and design optimization to address manufacturing challenges and improve the reliability of advanced fan-out packaging. She is also an Erasmus Mundus graduate in Smart Systems Integration, specializing in sensor and actuator design, with international research and industry experience across the United Kingdom, Norway, Hungary, and Belgium.

Beyond her academic achievements, Pallavi serves as President of the IMAPS Arizona State University Student Chapter, where she has worked to strengthen connections between students and industry professionals while fostering engagement within the microelectronics packaging community.

Pallavi has been an active participant in IMAPS programs and events. Most recently, she was featured in the IMAPS Student Spotlight series and presented during the IMAPS Device Packaging Conference (DPC) as part of the Future Connect: Classroom to Career session. She also shared her research during DPC technical sessions, presenting on "Warpage Modeling and Neural Networking-Assisted Process Optimization of Molded Core Substrates for Advanced Fan-Out Packages."