Accelerating the Transition to Intel 18A for Secure National Security Microelectronics
Sep 22, 2026 · By Intel Foundry · 3D In-Depth, Processes and Technology, R&D and Collaboration
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Major Semiconductor Companies Join SEMATECH’s 3D Enablement Center to Accelerate Adoption of 3D TSV Technologies
SEMATECH announced that Advanced Semiconductor Engineering (ASE) Incorporated, Altera Corporation, Analog Devices Inc. (ADI), LSI Corporation, ON Semiconductor Corporation, and...CEA-Leti Forms Common Lab with IPDiA to Focus on 3D-Integration Technologies for Passive Components on Silicon
CEA-Leti and IPDiA have formed a common lab to capitalize on their complementary expertise in miniaturization and 3D integration on...Alchimer’s Wet Deposition Products Licensed for MEMS 3D Research
Alchimer, provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects, MEMS and other electronic applications, announced that the...Ziptronix Signs Licensing Agreement with Sony
Ziptronix, Inc. has signed a licensing agreement with Sony Corporation for the use of Ziptronix’s patents regarding oxide bonding technology...Leti’s 300mm 3D Launch Party
Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration,...CEA-Leti and SHINKO Sign Common-Lab Agreement
In a move that promises to provide increased performance and smaller size for portable electronics and other advanced systems, CEA-Leti...Rudolph Technologies Collaborates in 3D Advanced Packaging Integration
Rudolph Technologies, Inc., provider of process characterization equipment and software for wafer fabs and advanced packaging facilities announced that it...EV Group Teams with Industrial Technology Research Institute (ITRI) on Advanced MEMS Research and Development
ST. FLORIAN, Austria, June 1, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for...Alchimer and Nagase & Co Sign Exclusive Agreement
Alchimer S.A, provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, is extending its...
CEA-Leti Building Europe’s First 300mm R&D Line Dedicated to 3D-Integration
CEA-Leti has opened a complete 300mm fab extension dedicated to 3D-integration applications. Final equipment installations will continue through to the...3D Integration Research, SEMATECH Style
SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. ...IMAPS 3D Panel Presents United Front
Keith Cooper, Technology and Development, SET North America reports from 2010 IMAPS International , where he attended the 3D Panel,...3D R&D Round-up: Part 1: RTI International
At last month’s 3D Architectures for Semiconductor Integration and Packaging Conference, coordinated by RTI International, three government-funded research institutes...