Latest Posts - Page 5
EDPS 2020: An Inside Look at the Manufacturing-centric Presentations
Like many other industry conferences, the Electronic Design Process Symposium (EDPS 2020) had to go virtual. Not only did it...
Why We Need to Address Known Good Die (KDG) Holistically
If you love, like me, to work on the bleeding edge of technology, you will find that your personal success...
48V Ecosystem and Power Packaging Trends
With each passing year, emerging growth application areas such as Automotive, Cloud Computing, Industrial Automation, and Telecom (5G) Infrastructure are...
What A Difference a Quarter Makes!
At the end of the 1st quarter and into early June, the thinking was that the semiconductor and packaging industry...
The Advantages of Outsourced Test Services
The business model in today’s competitive world of commerce has shifted over recent years to “services.” Companies like Microsoft, Amazon,...
ISES 2020 Highlights Asia’s Advanced IC Packaging and HI Capabilities
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for...
3D InCites’ Mural Project Raised $4000 For IMAPS Foundation
If you’ve attended the IMAPS Device Packaging Conference over the past three years, you probably noticed a hand-drawn mural coming...
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the...
Advanced Heterogeneous Packaging Solutions for High Performance Computing
Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad,...
Amkor Offers Optical Package Solutions for Multiple Applications
TEMPE, Ariz. December 13, 2018 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test...
Citius, Altius, Fortius Redux: More From SEMICON Korea 2018
The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their...
Announcing the Winners of the 2018 3D InCites Awards
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and...
MEMS Ascendant at IMAPS Device Packaging 2017
Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at...
Convergence on the “Big Five”: Focus on Wafer-based Advanced SiP
In the fourth installment of the series “Convergence on the Big Five,” we compared conventional SiP with advanced system-in-package (SiP),...Convergence on the “Big Five”: Focus on Laminate-based Advanced SiP
Part four in a five-part series While many industry experts have long predicted the demise of Moore’s law, it’s only...
Amkor Opens MEMS Packaging Line in China
TEMPE, Ariz., June 28, 2016 – Driven by the increase in global demand for sensors from the smartphone and automotive...
Convergence on the “Big Five”: Focus on MEMS Packaging
Part three of a five-part series In the first two parts of this series, we focused on low-cost flip chip...
Convergence on the “Big Five”: Focus on WLCSP
Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially,... 