Latest Posts - Page 14
EPS 2019: Imagining Thomas Edison as the Father of Advanced Packaging
Thomas Alva Edison didn’t invent semiconductor device packaging, but he might have, had he lived just one more generation. “I...
Your Electronics Industry Publications, Blogs, and Online Communities Need Your Support
Everyone in the semiconductor industry seems so shocked by the steady stream of electronics industry publications closures and cutbacks over...
IFTLE 422: Is Advanced Packaging Production Returning to the US by SHIP?
Is advanced packaging production coming back to the USA? The Navy (i.e. NSWC Crane) is currently seeking proposals from the...Advanced Packaging Industry: A Wonderful World
The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the...
Analysis Highlights Impact of Trade Friction on Electronics Industry
The impact of the ban on selling components to Huawei combined with generally lower shipments for PCs and mobile phones...
Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019
In the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a...
Advanced Packaging: Game Changer for Semiconductor Revolution
Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law...
Celebrating 25 Years of Advanced Packaging Innovation: Part 1
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS...IFTLE 405: DC Hu of SiPlus Classifies Advanced Packaging Technologies at IMPACT 2018
As scientists, we have a tendency to classify and categorize. It’s our way of comparing and contrasting things in our...
Advanced Packaging: at the Heart of Innovation
The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt,...
MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior...
DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging
Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing...
Advanced Packaging Technologies are Key for Semiconductor Innovation
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part...
Amkor Offers Optical Package Solutions for Multiple Applications
TEMPE, Ariz. December 13, 2018 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test...
Bridging the Interconnect Pitch Gap Calls for 3D Technologies
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s...
MRSI Systems’ MRSI-HVM3P Extends The MRS-HVM3 Die Bonder Family to New Applications
BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with...
The Advanced Packaging Industry is on the Move
Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts...
Thermal Metamaterials for Advanced Packaging Applications from Stanford University
Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials...
